120 QFP Search Results

120-PIN

Contextual Info: QUAD FLAT L-LEADED PACKAGE 120 PIN CERAMIC FPT-120C-A01 120-pin ceramic QFP Lead pitch 0.8mm Lead shape Gullwing Sealing method Metal seal FPT-120C-A01 120-pin ceramic QFP (FPT-120C-A01) 32.00±0.30SQ (1.260±.012) 23.20(.9135)REF 3.56(.140) MAX 1.09(.043)

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN CERAMIC To Top / Package Lineup / Package Index FPT-120C-A01 120-pin ceramic QFP Lead pitch 0.8 mm Lead shape Gullwing Sealing method Metal seal FPT-120C-A01 120-pin ceramic QFP (FPT-120C-A01)

QFP120-P-2020-1

Abstract: FPT-120P-M13
Contextual Info: QUAD FLAT L-LEADED PACKAGE 120 PIN PLASTIC FPT-120P-M13 EIAJ code : ∗QFP120-P-2020-1 120-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold FPT-120P-M13 120-pin plastic QFP (FPT-120P-M13)

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 120 PIN PLASTIC FPT-120P-M05 EIAJ code : ∗QFP120-P-1414-1 Lead pitch 0.40mm Package width x package length 14 × 14mm Lead shape Gullwing Sealing method Plastic mold 120-pin plastic LQFP FPT-120P-M05 120-pin plastic LQFP

UBGA49

Abstract: EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
Contextual Info: CPLD Package & I/O Matrix December 15, 2002. This document is revised quarterly. Visit the Altera web site at www.altera.com for the latest version. 36 68 100-Pin TQFP 36 84 84 100 120 120 36 84 100 120 68 68 84 100 212 256-Pin BGA 68 100-Pin FBGA 1.0 mm

Contextual Info: 202-0030-01 SchmartBoard/EZ 4”x4” QFP 120-144 Pins 0.8mm Pitch

FPT-120P-M04

Abstract: QFP120
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M04 EIAJ code :∗QFP120-P-2828-4 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN CERAMIC To Top / Package Lineup / Package Index FPT-120C-C01 120-pin ceramic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Cerdip Length of flat

FPT-120P-M03

Abstract: QFP120
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M03 EIAJ code :∗QFP120-P-2828-3 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing

120 M13

Abstract: FPT-120P-M13 QFP120 QFP120-P-2020-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M13 EIAJ code :∗QFP120-P-2020-1 120-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing

QFP120

Abstract: 120p
Contextual Info: QUAD FLAT L-LEADED PACKAGE 120 PIN PLASTIC FPT-120P-M03 EIAJ code : ∗QFP120-P-2828-3 120-pin plastic QFP Lead pitch 0.80mm Package width x package length 28 × 28mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 0.80mm FPT-120P-M03

Contextual Info: QUAD FLAT L-LEADED PACKAGE 120 PIN PLASTIC FPT-120P-M04 EIAJ code : ∗QFP120-P-2828-4 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Plastic mold Length of flat portion of pins 1.20 mm

C5C5

Contextual Info: G-QFP240-3232-0.50 Uniti nn 34. 6±0. 2 31, 2±0, 4 121 180 181 120

998AM

Abstract: TDA8924 TDA8920 TDA8924TH 998AM-105 MDB553 MDB543 tda8920 application TOKO 470 CLASS D HEF4047BT
Contextual Info: INTEGRATED CIRCUITS DATA SHEET TDA8924 2 x 120 W class-D power amplifier Objective specification 2003 Jul 28 Philips Semiconductors Objective specification 2 × 120 W class-D power amplifier TDA8924 CONTENTS 15 DYNAMIC AC CHARACTERISTICS MONO BTL APPLICATION

qfp 20x20

Contextual Info: 120-PIN PLASTIC QFP FINE PITCH (20x20) A B 90 61 91 60 detail of lead end S C D R Q 120 31 1 30 F G J H I M K P S N S L M NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 22.0±0.2

Contextual Info: 120 PIN PLASTIC QFP FINE PITCH ( 20) A B 90 61 91 60 Q R D C S detail of lead end 31 F 120 1 G 30 H I M J M P K N L NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition. ITEM A MILLIMETERS

Contextual Info: 120 PIN PLASTIC QFP 28 A B 90 91 61 60 F 120 1 G 5°±5° Q D C S detail of lead end 31 30 H I M J M P K N L P120GD-80-5BB-3 NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of its true position (T.P.) at maximum material condition. ITEM

Contextual Info: 120 PIN PLASTIC QFP 28x28 A B 90 61 91 60 detail of lead end S C D Q 120 1 R 31 30 F G H I J M P K S N S L NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition. M ITEM MILLIMETERS A B 32.0±0.3 28.0±0.2

Cyrix 5x86

Abstract: 5X86 Cyrix 5x86-100 D17103 ST5X86 QFP PACKAGE thermal resistance x87-instruction-set Cyrix st5x86 5x86-120 btb 137
Contextual Info: ST5x86 100 and 120 MHz 3.45 Volt 5x86 CPU PRELIMINARY DATA n n 586-CLASS PERFORMANCE - 100 and 120 MHz core speeds with 33, 40, and 50 MHz bus options - 16 KByte write-back cache - Superpipelining and branch prediction - Data forwarding - Decoupled load/store unit

QFP-120P

Abstract: 120-pin
Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M05 EIAJ code :∗QFP120-P-1414-1 120-pin plastic LQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm

3eb data

Abstract: S120GJ-50-3EB-2
Contextual Info: Packing NEC Tray JEDEC Tray Name LA-3519A-1 LA-0519A-1 MQFP 20x20 2.7mm Mounting Pad 120 pin QFP 20 × 20 Terminal Spacing Linear = 0.5 A B 90 61 91 60 Q R D C S detail of lead end 31 F 120 1 30 G H I M J M P K N L NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of

P120GD-80-LBB

Contextual Info: Packing NEC Tray JEDEC Tray Name LA-3508A-1 MQFP 28x28 3.2mm OT-001T-01 Mounting Pad 120 pin QFP 28 × 28 Terminal Spacing Linear = 0.8 A B 90 61 91 60 F 120 1 R Q S D C detail of lead end 31 30 J G H I M M P K N ITEM NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of

80486DX4

Abstract: 486DX ST486DX4 486 DX2 component 486DX4 DBST486DXST/1 ST486 ST486DX ST486DX4V A31-A2
Contextual Info: ST486DX4V 75, 100 & 120 MHz Clock Tripled 3.45 Volt 486 CPU PRELIMINARY DATA IMPROVED 486DX4 PERFORMANCE – Clock tripled core speeds up to 120 MHz – Integrated FPU 10% faster than 80486DX4 – Up to 50 MHz bus speeds for fast local bus sys- ON-CHIP 8-KBYTE WRITE-BACK CACHE

Cyrix 5x86

Abstract: Cyrix st5x86
Contextual Info: /= 7 S G S -T H O M S O N ^7#» IM[Kefsi@IIIUg 5iïïFi(Q W(Sg ST5x86 100 and 120 MHz 3.45 Volt 5x86 CPU PRELIMINARY DATA • 586-CLASS PERFORMANCE -100 and 120 MHz core speeds with 33,40, and 50 MHz bus options -16 KByte write-back cache - Superpipel'ring and branch prediction