L777HDB44POL2
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Pin, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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L717HDB44POL2
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Pin, Bright Tin Shell+Grounding Dimples, Flash Gold, 3.1mm(0.122in) Clear Hole, Without Standoff&Boardlock |
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L777HDBG44POL2RM8
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Pin, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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L717HDBH44POL2VF
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Pin, Bright Tin Shell+Grounding Dimples, Flash Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Rear Nut, Without Boardlock |
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L717HDBH44POL2C309
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Pin, Bright Tin Shell+Grounding Dimples, 0.76m (30 in) Gold, 4-40 Rear Nut, |
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