| 61082-182409LF |  | Amphenol Communications Solutions | BergStak® 0.80mm Pitch,  Receptacle, Vertical, Double Row, 180 Positions. | PDF |  | 
| 131-8218-11H |  | Amphenol Communications Solutions | Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Double End Wall, Backplane Module, 1.5mm Wipe, APP. | PDF |  | 
| 68448-218HLF |  | Amphenol Communications Solutions | BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row,  10 Positions, 2.54 mm (0.100in)Pitch. | PDF |  | 
| 61082-182600LF |  | Amphenol Communications Solutions | BergStak® 0.80mm Pitch,  Receptacle, Vertical, Double Row, 180 Positions. | PDF |  | 
| 61082-181422LF |  | Amphenol Communications Solutions | BergStak® 0.80mm Pitch,  Receptacle, Vertical, Double Row, 180 Positions. | PDF |  |