112905HC01 Search Results
112905HC01 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Lead Frame Plating Silver Die Attach Epoxy Gold Wire Lead Plating Silicon Die Rev ECN A 112905HC01 Component Weight : SOICW Document No : |
Original |
SOICW-28LD-GRN-RS-1 112905HC01 |