112905HC02 Search Results
112905HC02 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Rev A B C D Material Molding Compound Copper Alloy Frame Lead Frame Plating Silver Die Attach Epoxy Gold Wire Lead Plating Silicon Die ECN 112905HC02 011411HC03 021811HC04 022311HC05 |
Original |
SOICW-20LD-GRN-RS-1 112905HC02 011411HC03 021811HC04 022311HC05 |