111703HC14 Search Results
111703HC14 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : Component Weight : TQFP-EPAD 7x7 mm Document No : Lead #: 32 Process Type : No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire Solder Lead Plating |
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111703HC14 082611HC12 TQFPEP7x7-32LD-PBY-RS-1 |