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    1100SF Search Results

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    1100SF Price and Stock

    JRH ELECTRONICS

    JRH ELECTRONICS 805-003-22M21-100SF

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    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 805-003-22M21-100SF 147 1
    • 1 $5898.22
    • 10 $5780.26
    • 100 $5551.36
    • 1000 $5440.33
    • 10000 $5440.33
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    JRH ELECTRONICS 805-004-07ZNU21-100SF

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    DigiKey 805-004-07ZNU21-100SF 147 1
    • 1 $5924.35
    • 10 $5805.86
    • 100 $5575.95
    • 1000 $5464.43
    • 10000 $5464.43
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    JRH ELECTRONICS 805-005-12ZB21-100SF

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    DigiKey 805-005-12ZB21-100SF 98 1
    • 1 $4613.02
    • 10 $4520.76
    • 100 $4341.74
    • 1000 $4254.90
    • 10000 $4254.90
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    JRH ELECTRONICS 805-061-16Z121-100SF212

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    DigiKey 805-061-16Z121-100SF212 98 1
    • 1 $5161.42
    • 10 $5058.20
    • 100 $4857.89
    • 1000 $4760.73
    • 10000 $4760.73
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    JRH ELECTRONICS 805-005-22ZNU21-100SF

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    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 805-005-22ZNU21-100SF 95 1
    • 1 $4613.02
    • 10 $4520.76
    • 100 $4341.74
    • 1000 $4254.90
    • 10000 $4254.90
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    1100SF Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: Gap Filler 1100SF Two-Part Thermally Conductive, Silicone-Free, Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 1100SF PROPERTY Color / Part A • Thermal conductivity: 1.1 W/m-K • No silicone outgassing or extraction


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    100SF 1100SF 1100SF PDF

    diode sod-123 marking code 120

    Contextual Info: CYStech Electronics Corp. Spec. No. : C338SF Issued Date : 2003.06.16 Revised Date : Page No. : 1/3 1.0Amp. Surface Mount Schottky Barrier Diodes CSOD120-1100SF Series Features • For surface mounted applications. • For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications


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    C338SF CSOD120-1100SF MIL-S-19500/228 OD-123/Mini MIL-STD-750 UL94V-0 CSOD120-1100SF diode sod-123 marking code 120 PDF

    Contextual Info: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


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