1 X 4 Search Results
1 X 4 Datasheets (2)
| Part | ECAD Model | Manufacturer | Description | Datasheet Type | PDF Size | Page count | |
|---|---|---|---|---|---|---|---|
| 1x4-GaAs-PIN-Photodiode-Array | EMCORE | 1 x 4 GaAs PIN Photodiode Array | Original | 22.06KB | 1 | ||
| 1x4-Multimode-VCSEL-Array | EMCORE | 1x4 Multimode VCSEL Array | Original | 51.35KB | 1 |
1 X 4 Price and Stock
ams OSRAM Group GW QSLMS3.CM-H2H4-XX37-1White LEDs High-Efficacy 3V 3030 Mid-Power White LED |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GW QSLMS3.CM-H2H4-XX37-1 | 42,000 |
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Buy Now | |||||||
ams OSRAM Group GW QSLMS3.CM-H4H6-XX32-1White LEDs High-Efficacy 3V 3030 Mid-Power White LED |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GW QSLMS3.CM-H4H6-XX32-1 | 42,000 |
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Buy Now | |||||||
ams OSRAM Group GW QSLMS3.CM-H4H6-XX33-1White LEDs High-Efficacy 3V 3030 Mid-Power White LED |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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GW QSLMS3.CM-H4H6-XX33-1 | 41,979 |
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Buy Now | |||||||
Infineon Technologies AG SLB9672XU20FW1624XTMA1Security ICs / Authentication ICs TPM for embedded systems featuring I2C interface and PQC-protected firmware update mechanism |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SLB9672XU20FW1624XTMA1 | 8,909 |
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Buy Now | |||||||
Infineon Technologies AG SLB9672AU20FW1624XTMA1Security ICs / Authentication ICs TPM for embedded systems featuring I2C interface and PQC-protected firmware update mechanism |
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| Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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SLB9672AU20FW1624XTMA1 | 8,331 |
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Buy Now | |||||||
1 X 4 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
D406Contextual Info: Features - - W D - - - -L - - - - • Basic Protektive Pak tray • Great container for Kanban Item No. Size I.D. - L x W x D 37650 17-3/4 x 10-3/4 x 2-1/8 37651 17-7/8 x 13-5/8 x 2-1/8 37653 19-1/4 x 13-1/8 x 2-1/8 |
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FED-STD-101, D4060 CS-17 D406 | |
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Contextual Info: CMOS SyncFIFO 256x18, 5 1 2 x 1 8 ,1 ,0 2 4 x 1 8 , 2,048x18 and 4,096x18 FEATURES: • • • • • • • • • • • • • • • • 256 x 18-bit organization array IDT72205LB 512 x 18-bit organization array (IDT72215LB) 1,024 x 18-bit organization array (IDT72225LB) |
OCR Scan |
256x18, 048x18 096x18 18-bit IDT72205LB) IDT72215LB) IDT72225LB) | |
EW35
Abstract: weidmuller fuse Weidmuller TS35x7.5 02958 CLASS J blown fuse indicator GZ Series TS32x15
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10-pole 5X100 5M-LIT0607 EW35 weidmuller fuse Weidmuller TS35x7.5 02958 CLASS J blown fuse indicator GZ Series TS32x15 | |
T7252Contextual Info: BUS-MATCHING BIDIRECTIONAL FIFO 512 x 18-BIT-1 0 2 4 x 9-BIT 1024 x 18-BIT - 2048 x 9-BIT IDT72510 IDT72520 FEATURES: DESCRIPTION: • Two side-by-side FIFO m em ory arrays for bidirectional data transfers • 512 x 18-Bit - 1024 x 9-Bit IDT72510 • 1024 x 1 8 - B it - 2048 x 9-Bit (IDT72520) |
OCR Scan |
18-BIT-1 18-BIT IDT72510 IDT72520 IDT72510) IDT72520) 18-to-9-bit, 36-to-9-bit, T7252 | |
72V273Contextual Info: 3.3 VOLT HIGH-DENSITY SUPERSYNC II NARROW BUS FIFO 8 ,1 9 2 x 1 8 /1 6 ,3 8 4 x 9 16,384 x 18/32,768x9 3 2,7 68 x 18 /65 ,5 36 x9 65,5 36 x 18 /13 1,07 2x 9 131,072x18/262,144x9 2 62.144x18/524.288x9 Integrated Device Technology, Inc. FEATURES: • Choose among the following memory organizations: |
OCR Scan |
768x9 072x18/262 144x9 144x18/524 288x9 IDT72V263 IDT72V273 IDT72V283 IDT72V293 IDT72V2103 72V273 | |
CY14B101LA-SZ45XI
Abstract: CY14B101LA-SZ25XI
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CY14B101LA CY14B101NA 8/64K CY14B101LA/CY14B101NA CY14B101LA-SZ45XI CY14B101LA-SZ25XI | |
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Contextual Info: 3.3 VOLT HIGH-DENSITY SUPERSYNC II NARROW BUS FIFO 8 ,1 9 2 x 1 8 /1 6 ,3 8 4 x 9 16,384 x 18/32,768x9 3 2,7 68 x 18 /65 ,5 36 x9 65,5 36 x 18 /13 1,07 2x 9 131,072x18/262,144x9 2 62.144x18/524.288x9 In teg rated D evice Technology, Inc. FEATURES: • Choose among the following memory organizations: |
OCR Scan |
768x9 072x18/262 144x9 144x18/524 288x9 IDT72V263 IDT72V273 IDT72V283 IDT72V293 IDT72V2103 | |
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Contextual Info: 1, 2 MEG x 32 DRAM DIMMs MT2LD132U X , MT4LD232U(X) DRAM MODULE For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/mti/msp/html/datasheet.html FEATURES • JEDEC pinout in a 100-pin, dual in-line memory module (DIMM) • 4MB (1 Meg x 32) and 8MB (2 Meg x 32) |
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MT2LD132U MT4LD232U 100-pin, 024-cycle 100-Pin | |
72-PIN
Abstract: 72SD3232 AX12
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Original |
72SD3232 32-Meg 32-Bit 72-PIN 72SD3232 AX12 | |
1L-10-2Y1-XX-1
Abstract: nicomatic 1L-10 HE13-HE14 nicomatic and
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Original |
2D\31 HE13-HE14\03-Connecteurs\1L-10-2Y1-XX-1 1L-10-2Y1-XX-1 1L-10-2Y1-XX-1 nicomatic 1L-10 HE13-HE14 nicomatic and | |
SG320240L
Abstract: TLSU
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SG320240L SG320240L TLSU | |
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Contextual Info: 64Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC16M4A2 – 4 Meg x 4 x 4 Banks MT48LC8M8A2 – 2 Meg x 8 x 4 Banks MT48LC4M16A2 – 1 Meg x 16 x 4 Banks Features Options • PC100- and PC133-compliant • Fully synchronous; all signals registered on positive |
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MT48LC16M4A2 MT48LC8M8A2 MT48LC4M16A2 PC100- PC133-compliant 4096-cycle 09005aef80725c0b x4x8x16 | |
GX4201
Abstract: tally pinout transistor pnp 3015 HA4201 HA4201CB HA4201CB96 HA4600 HFA1100 08LD
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HA4201 480MHz, HA4201 105mW GX4201 tally pinout transistor pnp 3015 HA4201CB HA4201CB96 HA4600 HFA1100 08LD | |
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Contextual Info: Integrated Device Technology, Inc. 32K x 18 CacheRAM BURST COUNTER & SELF-TIMED WRITE — FOR THE PowerPC™ PROCESSOR PRELIMINARY IDT71419 DESCRIPTION: FEATURES: T h e ID T 7 1 4 1 9 is a v ery h ig h -s p e e d 3 2 K x 1 8 -b it static R A M • 3 2 K x 1 8 architectu re |
OCR Scan |
IDT71419 52-pin J52-1) 4A25771 | |
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nicomatic a
Abstract: Connecteurs 1L-10 HE13-HE14 1l101 1-l10
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2D\31 HE13-HE14\03-Connecteurs\1L10-1Y1-XX-1 1L-10-1Y1-XX-1 nicomatic a Connecteurs 1L-10 HE13-HE14 1l101 1-l10 | |
44LSOContextual Info: UM23L64100 4,1 9 4 ,3 0 4 X 16/8,388,608 X 8 BIT LOW VOLTAGE CMOS M ASK ROM P R E LIM IN A R Y Features • 4,194,304 x 1 6 /8 ,3 88 ,6 0 8 x 8-bit o rga n izatio n 1 Full static ope ra tio n ■ S ing le + 3 V p o w e r su pp ly 1 T T L-co m p atib le inputs and o utp uts |
OCR Scan |
UM23L64100 200ns 48-pin 44-pin 23L64100 100pF 23L64100F 44LSO | |
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Contextual Info: DC/DC Converters THN 20WI Series, 20 Watt Features ◆ Smallest encapsulated 20W Converter! CndBing pULe 60950-1 Scheme Ultra compact size: 1.0” x 1.0” x 0.4” UL 60950-1 ◆ Shielded metal case with isolated baseplate ◆ Ultrawide 4:1 input voltage ranges |
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THN-20WI | |
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Contextual Info: S o n y . CXK58110OTM/YM - 1 O°w i2o</i5u< L L X /1 2 L L X /1 5 L L X 131072-word x 8-bit High Speed CMOS Static RAM Description CXK581100TM 32 pin TSOP Plastic C X K 5 8 1 1OOTM/YM is a 1M bits, 131,072 words by 8 bits, C M O S static RAM. It is suitable for portable and |
OCR Scan |
CXK58110OTM 131072-word CXK581100TM CXK581100YM 581100TM 581100Y 581100T XK581100TM | |
EEPROM
Abstract: M24C16 M24C02-R M24C02-W M24C04-R M24C04-W M24C08-R M24C08-W M24C16-R M24C16-W
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M24C16-x M24C08-x M24C04-x M24C02-x M24C01-x M24Cxx-W M24Cxx M24Cxx-F 40-year EEPROM M24C16 M24C02-R M24C02-W M24C04-R M24C04-W M24C08-R M24C08-W M24C16-R M24C16-W | |
QVL25335Contextual Info: SLOTTED OPTICAL SWITCH QVL25335 PACKAGE DIMENSIONS 3 2 .020 .50 .03 (.75) .023 (.60) XXXXXXX XX XXX .020 (.50) 4 1 SECTION X-X X XXXXXX XX XX X 1.150 (29.21) CL .177 (4.50) 2PLCS .276 (7.01) .398 (10.11) .138 (3.51) .638 (16.21) .200 (5.09) CL .350 (8.89) |
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QVL25335 QVL25335 DS300380 | |
samtec pt
Abstract: PT-1-24-03-44 vectra E130i
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Original |
C-08-XX-S) C-08-XX-H) C-08-XX-L) E130i, PT-1-24-03-44 TP-03 samtec pt PT-1-24-03-44 vectra E130i | |
1000 watt step down converter scheme
Abstract: 154811W thn 15-4813wi
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Original |
18-75VDC THN-15WI CH-8002 1000 watt step down converter scheme 154811W thn 15-4813wi | |
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Contextual Info: DC/DC Converters THN 15WI Series, 15 Watt CB Scheme Features ◆ Smallest encapsulated 15W Converter! UL 60950-1 UL 60950-1 Ultra compact size: 1.0” x 1.0” x 0.4” ◆ Shielded metal case with isolated baseplate ◆ Ultrawide 4:1 input ranges 9-36 VDC |
Original |
18-75VDC THN-15WI CH-8002 | |
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Contextual Info: Package outline TFBGA44: plastic thin fine-pitch ball grid array package; 44 balls; body 3 x 5 x 0.9 mm B D SOT963-1 A ball A1 index area E A A2 A1 detail X e1 e Øv Øw b C C A B C M M y y1 C J H G F e E e2 D C B A ball A1 index area 1 2 3 4 5 X 2.5 5 mm |
Original |
TFBGA44: OT963-1 | |