1 SMD FUSE MARKING CODE N Search Results

smd fuse marking 20

Abstract: fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c
Contextual Info: Document No TCF-04OS029E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking code T

Abstract: smd fuse marking code smd fuse marking code K 1 smd fuse marking code n smd FUSE CODE t smd fuse marking
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/01/18 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: V I S H AY I N T E R T E C H N O L O G Y, I N C . Capacitors – Hi-Rel COTS SMD Tantalum with Built-in Fuse I INNOVAT AND TEC O L OGY T86 Tantalum N HN CAPACITORS O 19 62-2012 T86 - Solid Tantalum Surface-Mount TANTAMOUNT , Molded Case, Hi-Rel COTS, Low ESR, Built-In Fuse

1 smd fuse marking code 32

Abstract: cfs12V CFS12V3T7R0 smd fuse marking 20 smd fuse marking code 20 CFS12V3T2R50 k smd fuse marking code fuse smd code N smd fuse marking code smd fuse marking code T
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-12OS051E Issued date 2009/5/27 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

fuse smd code N

Abstract: smd fuse marking code M smd fuse marking 20 1 smd fuse marking code n CFS06V5TR50 k smd fuse marking code smd fuse marking code K smd fuse marking code T SMD 1206 fuse fuse smd code P
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-06OS050E Issued date 2007/7/25 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

CF06V2T2R50

Abstract: CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63
Contextual Info: Document No TCF-06OS030E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

fuse smd code N

Abstract: smd fuse marking code T smd fuse marking 1 smd fuse marking code n smd fuse marking code K fuse smd code S FUSE SMD k smd fuse marking code CFS04V3T2R0 fuse smd code p
Contextual Info: Document No TCFS-04OS049E Lead Free Thin Film Chip Fuse 1. Issued date 2009/5/27 Page 1/15 Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

smd fuse marking code 20

Abstract: fuse i2t fuse smd code t
Contextual Info: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2011/03/01 Page 1/18 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 20

Contextual Info: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code G

Abstract: fuse smd code Y 1 smd fuse marking code 32 CF12V3T2R50 CF06V2T2R50 SMD FUSE CODE M CF12V6TR80 smd fuse p Fuse 1206 1A CF12V6T1R25
Contextual Info: Document No TCF-12OS031D Issued date 2007/7/25 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

Contextual Info: Thin Film Chip Fuse Document No TCFS-XX0S004I Issued date 2012/11/26 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code J

Abstract: 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20
Contextual Info: Thin Film Chip Fuse Document No TCFS-XXOS004H Issued date 2011/03/01 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Contextual Info: Document No TCF-XXOS032J Issued date 2012/06/28 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Abstract: CF06V3T1R25 CF04V cf-06v5T smd fuse marking code K CF06V5TR40 1 smd fuse marking code n CF06V3t2 CF06V 1 smd fuse marking code
Contextual Info: Document No TCF-XXOS032J Issued date 2011/05/17 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code TK

Abstract: KMC2S010
Contextual Info: Polymer PTC Resettable Fuse: KMC Series SMD Type Features 1. RoHS & Halogen-Free HF compliant 2. EIA size: 0603, 0805, 1206, 1812 3. Hold current ratings from 0.05 to 3A 4. Voltage ratings from 6V computer and electronic applications to 60V 5. Small footprint

EMC2 WELWYN

Abstract: IEC62 smd fuse marking 1 smd fuse marking code
Contextual Info: Pulse Withstanding Fusible Flameproof Metal Film Resistors EMC Series • • • • • UL1412 recognised* Failsafe 240V mains fusing Good pulse handling capability Small size for power rating UL94-V0 flameproof protection * Values 22R and above. UL file number E234469

RBS 6402

Abstract: smd code 1Bs smd fuse marking code TN solar cell cnc TRANSISTOR SMD MARKING CODE kn smd transistor 5Bs smd transistor marking DK RH smd transistor marking cf rh RBS 2202 telecom rbs 6102
Contextual Info: Contents 2011 RoHS Compliant CERAMIC METALIZED SUBSTRATE Ceramic Metalized Substrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . F1-F2 CIRCUIT PROTECTION PRODUCTS Page Over-Current Protection CF/CFS

K/metal film resistors SMD

Contextual Info: Pulse Withstanding Fusible Flameproof Metal Film Resistors EMC Series • UL1412 recognised* · Failsafe 240V mains fusing · Good pulse handling capability · Small size for power rating · UL94-V0 flameproof protection * Values 22R and above. UL file number E234469

Contextual Info: Pulse Withstanding Fusible Flameproof Metal Film Resistors EMC Series • UL1412 recognised* · Failsafe 240V mains fusing · Good pulse handling capability · Small size for power rating · UL94-V0 flameproof protection * Values 22R and above. UL file number E234469

RH6160

Abstract: RH6150 fru250f FRU900F FRU300F frv03 RX110f RU110F FRG1200F FRG1100F
Contextual Info: Contents 1 2、 3、 OVERVIEW COMPANY PROFILE P.1 FUZETEC  PRODUCT FAMILY P.1 SAFETY, QUALITY AND CUSTOMER SATISFACTORY P.1 TECHNOLOGY NICHE P.1 FUNDAMENTAL HOW DOES THE RESETTABLE FUSE WORK P.2 TRIP CURRENT, HOLD CURRENT AND THERMAL DERATING P.2 PRODUCTS

Contextual Info: 05081 PP0640SA - PP3500SC Only One Name Means ProTek’Tion THYRISTOR SURGE SUPPRESSOR DESCRIPTION The PP-SM Series are thyristor surge suppression TSS devices designed to protect telecommunication equipment against lightning and transients induced by AC power lines. These devices can be used on central office equipment,

Contextual Info: TANTALUM ELECTROLYTIC CAPACITORS nicKicon J U Resin-molded Chip, Built-in Fuse Series Um ® Far SMD • Specifications item Performance Characteristics O perating Tem perature Range — 5 5 — M 2 5 "C M ax. operating tem perature at rated voltage shaft be up to 8 5 ’C }

1 smd fuse marking code

Abstract: fuse smd code N smd fuse marking 20 fuse smd code p smd fuse marking SMD MARKING CODE 202 asia SMD MARKING CODE smd code marking pd FUSE SMD SMD MARKING CODE
Contextual Info: POL YFUSE OLYFUSE WICKMANN SMD0805 formerly No. 725 SMD TType ype V ype, 6 / 9 / 15 15V Specifications Approvals Packaging A Materials Terminals: cULus Recognition TÜV Features This product line is the smallest available SMD resettable fuse. These devices offer wide range

smd marking code mfu

Abstract: smd fuse marking code K m86m smd fuse marking code m smd fuse marking H IR511 SMD code mfu IEC 60127-1
Contextual Info: MFU 0805, MFU 0603 Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering