1 SMD FUSE MARKING CODE 32 Search Results

smd fuse marking 20

Abstract: fuse smd code N smd fuse marking code K fuse smd code k k smd fuse marking code fuse smd code P smd fuse marking code 15 smd fuse marking code T fuse smd code D fuse smd code c
Contextual Info: Document No TCF-04OS029E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

RBS 6402

Abstract: smd code 1Bs smd fuse marking code TN solar cell cnc TRANSISTOR SMD MARKING CODE kn smd transistor 5Bs smd transistor marking DK RH smd transistor marking cf rh RBS 2202 telecom rbs 6102
Contextual Info: Contents 2011 RoHS Compliant CERAMIC METALIZED SUBSTRATE Ceramic Metalized Substrate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . F1-F2 CIRCUIT PROTECTION PRODUCTS Page Over-Current Protection CF/CFS

smd fuse marking code T

Abstract: smd fuse marking code smd fuse marking code K 1 smd fuse marking code n smd FUSE CODE t smd fuse marking
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/01/18 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code T

Abstract: CH06 smd fuse marking code K fuse smd code S smd fuse marking code 1 smd fuse marking code n fuse smd code P smd fuse marking x
Contextual Info: Document No TCH-XXOS001A Thin Film Chip Fuse Issued date 2012/06/28 Page 1/13 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

fuse smd code tp

Abstract: smd fuse marking code 20 fuse smd code c smd fuse marking H smd fuse marking code G fuse smd code Y smd fuse marking code ae 1 smd fuse marking code 1 smd fuse marking code 32 fuse smd code G
Contextual Info: bel 1206 Size RoHS 6 Compliant Type C1S Surface Mount Slow Blow Chip Fuse C1S Apr2013D ÆùusCC C1S Series Fuse Slow Blow Small size,1206 SMD Current rating from 750mA to 5A Wide operating temperature range from -55°C to 125°C Tape and Reel for automatic SMD placement

1 smd fuse marking code 32

Abstract: cfs12V CFS12V3T7R0 smd fuse marking 20 smd fuse marking code 20 CFS12V3T2R50 k smd fuse marking code fuse smd code N smd fuse marking code smd fuse marking code T
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-12OS051E Issued date 2009/5/27 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

fuse smd code N

Abstract: smd fuse marking code M smd fuse marking 20 1 smd fuse marking code n CFS06V5TR50 k smd fuse marking code smd fuse marking code K smd fuse marking code T SMD 1206 fuse fuse smd code P
Contextual Info: Lead Free Thin Film Chip Fuse Document No TCFS-06OS050E Issued date 2007/7/25 Page 1/15 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

CF06V2T2R50

Abstract: CF06V fuse i2t CF06V3T1R25 fuse smd code c fuse smd code N CF06V3T1R0 Chip Fuse smd marking code 45 Smd fuse marking 45 CF06V3TR63
Contextual Info: Document No TCF-06OS030E Issued date 2009/5/27 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

IEC 60127-1

Abstract: 1 smd fuse marking code n smd marking code mfu SMD code mfu 1 smd fuse marking code 32 fuse smd code N smd fuse marking code 20 1 smd fuse marking code fuse smd code h smd fuse marking H
Contextual Info: MFU 0805, MFU 0603 Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering

fuse smd code N

Abstract: smd fuse marking code T smd fuse marking 1 smd fuse marking code n smd fuse marking code K fuse smd code S FUSE SMD k smd fuse marking code CFS04V3T2R0 fuse smd code p
Contextual Info: Document No TCFS-04OS049E Lead Free Thin Film Chip Fuse 1. Issued date 2009/5/27 Page 1/15 Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate

smd marking code mfu

Abstract: smd fuse marking code K m86m smd fuse marking code m smd fuse marking H IR511 SMD code mfu IEC 60127-1
Contextual Info: MFU 0805, MFU 0603 Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • Advanced thin film technology • Very quick acting fuse characteristics • Outstanding stability of fusing characteristics • Standard metric SMD sizes • Green product, supports lead Pb -free soldering

CPS06V3

Abstract: CPS12V3T3R00 CPS06V3T5R0 CPS12V6TR50 smd fuse marking code 20 CPS12V3T2R50 CPS12V6T1R50
Contextual Info: Document No TCPS-XXOS004F Thin Film Chip Fuse Issued date 2012/06/28 Page 1/19 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

32N035

Contextual Info: THERMAL SENSORS / CIRCUIT PROTECTORS TECHNOLOGY OF TOMORROW CIRCUIT PROTECTORS RESETTABLE FUSE SF 32 • SF 45 STRUCTURE 1 2 3 4 W NE Element Protective coating Inner electrode Outer electrode IDENTIFICATION PRODUCT CODE COATING COLOR SF 32, SF 45 Green All these products have

Contextual Info: bel 1206 Size RoHS 6 Com pliant C 1Q Surface Mount Very Fast-Acting Chip Fuse C1Q Oct2013D C1Q Series Fuse HF F ast Acting Small size,1206 SMD Current rating from 250m A to 7A Wide operating tem perature range from -55°C to 125°C Tape and Reel for automatic SMD placem ent

smd fuse marking code 20

Contextual Info: Document No TCP-XXOS006H Issued date 2011/04/22 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

CP06V3T2R0

Abstract: CHIP FUSE CP04V3TR50 CP06V3T5R0 fuse smd code t
Contextual Info: Document No TCP-XXOS006H Issued date 2012/06/28 Page 1/17 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

fuse smd code tp

Abstract: marking code maxim label smd fuse marking H smd fuse marking code J C1Q500 hs-6 48 fuse smd code Y 1206 fuse smd code h c1q-5 marking code NJ SMD
Contextual Info: bel 1206 Size RoHS 6 Compliant C1Q Surface Mount Very Fast-Acting Chip Fuse C1QApr2013D C1Q Series Fuse HF Fast Acting Small size,1206 SMD Current rating from 250m A to 7A Wide operating tem perature range from -55°C to 125°C Tape and Reel for automatic SMD placem ent

smd fuse marking code G

Abstract: fuse smd code Y 1 smd fuse marking code 32 CF12V3T2R50 CF06V2T2R50 SMD FUSE CODE M CF12V6TR80 smd fuse p Fuse 1206 1A CF12V6T1R25
Contextual Info: Document No TCF-12OS031D Issued date 2007/7/25 Page 1/15 Lead Free Thin Film Chip Fuse 1. Scope This specification applies for the Lead-Free fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element

smd fuse marking H

Abstract: 1 smd fuse marking code cv smd fuse marking code f smd marking code mfu 3A15 smd 1a5 smd 2A5 fuse smd code 162 smd fuse marking code G marking mfu
Contextual Info: MFU Series - Thin Film Fuse Vishay Beyschlag Thin Film Flat Chip Fuses FEATURES • • • • • R Advanced thin film technology Very quick acting fuse characteristics Outstanding stability of fusing characteristics Standard metric SMD sizes Green product, supports Lead Pb -free soldering

Contextual Info: Thin Film Chip Fuse Document No TCFS-XX0S004I Issued date 2012/11/26 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code J

Abstract: 25 smd fuse marking code smd fuse marking code K smd fuse marking code 4 Fuse 1206 1A CFS12V6T1R25 CFS12V3T2R50 smd fuse marking code T 1206 FUSE marking 20
Contextual Info: Thin Film Chip Fuse Document No TCFS-XXOS004H Issued date 2011/03/01 Page 1/20 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Contextual Info: Document No TCF-XXOS032J Issued date 2012/06/28 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

smd fuse marking code 15 0.75A 1206

Abstract: CF06V3T1R25 CF04V cf-06v5T smd fuse marking code K CF06V5TR40 1 smd fuse marking code n CF06V3t2 CF06V 1 smd fuse marking code
Contextual Info: Document No TCF-XXOS032J Issued date 2011/05/17 Page 1/20 Thin Film Chip Fuse 1. Scope This specification applies for the fuse series of thin film chip fuse made by TA-I. Over Coat 2. Construction Conductor Sn Plating Ceramic Substrate Fuse Element Cu / Ni Plating

Contextual Info: bel Type C2Q Surface Mount Very Fast-Acting Chip Fuse C2Q OCÍ2013D HF 0603 Size RoHS 6 Compliant C2Q Series Fuse - Fast Acting - Small size,0603 SMD - Current rating from 250mA to 5A - Wide operating temperature range from -55°C to 125°C - Tape and Reel for automatic SMD placement