083011HC04 Search Results
083011HC04 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : TSSOP 8 Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Lead Frame Plating Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 083011HC04 Content in % 48.235% 42.133% |
Original |
TSSOP-8LD-GRN-RS-12 083011HC04 |