081205HC04 Search Results
081205HC04 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : Component Weight : SSOP 5.3mm Body Document No : Lead #: 16 Process Type : No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire External Lead Plating |
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SSOP-16LD-PBY-RS-1 081205HC04 |