080205HC04 Search Results
080205HC04 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : Component Weight : TQFP-EPAD 7x7 mm Document No : Lead #: 32 Process Type : No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Leadframe Plating Silver Die Attach Epoxy Gold Wire External Lead Plating |
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TQFPEP7x7-32LD-GRN-RS-1 080205HC04 |