061709HC11 Search Results
061709HC11 Datasheets Context Search
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Contextual Info: Reportable Substances in Components Package Type : Lead #: No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Lead Frame Plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die Rev ECN A 121905HC42 B 061709HC11 Component Weight : |
Original |
MSOP-10LD-GRN-RS-3 |