02JUL14 Search Results

Contextual Info: F-214 Rev 02JUL14 EPLSP–019–2000 (0,80 mm) .0315" I/O SYSTEM EPLSP SERIES RUGGED LATCHING HIGH SPEED SYSTEM FEATURES • • • • Rugged external cable Small form factor Low profile latching Metal-to-metal two-piece contact system • High mating cycles

Contextual Info: F-214 Rev 02JUL14 DCC–04–03.00–G–PF–03–1 DCC–04–03.00–G–PF–02–1 (2,00 mm) .0787" DCC SERIES HIGH SPEED PRESS-FIT TO BOARD SPECIFICATIONSi For complete specifications and recommended PCB layouts see www.samtec.com?DCC Supports and surpasses PCIe

Contextual Info: UH4PBC-M3/HM3, UH4PCC-M3/HM3, UH4PDC-M3/HM3 www.vishay.com Vishay General Semiconductor High Current Density Surface Mount Ultrafast Rectifiers FEATURES eSMP Series • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement

Contextual Info: VS-GA200TH60S www.vishay.com Vishay Semiconductors Molding Type Module IGBT, 2-in-1 Package, 600 V and 200 A FEATURES • High short circuit capability • 10 s short circuit capability • VCE on with positive temperature coefficient • Maximum junction temperature 150 °C