0.3MM PITCH PROBE Search Results

Contextual Info: SURFACE MOUNT TEST CLIPS DESCRIPTION AND COLOR CHOICE SETS FEATURES Access 0.3mm or 1.27mm Pitch Leads Allows you to attached the clip to a lead on the smallest of surface mount IC’s. Normal oscilloscope lead tips are too large and the probe handle is too heavy to access these

Contextual Info: The Value Leader Micro & Nano Surface Mount Test Clips Color Coded, Compact, Economical •Can access 0.3mm & 1.27mm Pitch Leads: Allows you to attached the clip to a lead on the smallest of surface mount IC’s for testing the input and/or output of the IC. Normal

Oscilloscope

Abstract: QFP 0.3mm pitch
Contextual Info: MicroGripperTM Oscilloscope Kit Oscilloscope Probe Adapter 0.8mm to 0.3mm Fine-Pitched Probing With Any Standard Oscilloscope w w w w w Connect to devices with lead pitches from 0.8mm to 0.3mm Use on a variety of QFP and SOIC packages Reduces chance of shorting with smallest wire tip diameter 0.08mm

Oscilloscope 5520

Abstract: smd 1437
Contextual Info: Grabbers and Test Clips MINIGRABBER TEST CLIP WITH BANANA JACK Banana Jack built into plunger. Overall Length: 2.54". RATING: 300V, 5 Amps, +102˚C 216˚F Max. *STD COLORS: Available in 10 colors. ACCESS 90603 Model 4723-* PRICE 4.10 ® DO-IT-YOURSELF MINIGRABBER TEST CLIPS

Contextual Info: Oscilloscope Probes and Accessories Professional Oscilloscope Probes feature modular design for maximum flexibility Oscilloscope Probes and Accessories ACCESS FAX ON DEMAND This symbol indicates immediate Fax-On-Demand Technical Information is available. Dial U.S. (800) 444-6785, (Outside U.S.) (909) 469-2991. Enter

QFP lead pitch 0.3mm

Abstract: BGA and QFP Package mounting QFP 0.3mm pitch particle 0.3mm pitch BGA bga socket material for chip resistors 8 soic pcb footprint qfp 100 SOCKET BGA and QFP Package
Contextual Info: Socket Technologies High Performance IC Sockets And Test Adapters IP, Sep2009 Overview Company Overview – – – – – Over 5,000 products High Performance Adapters and Sockets Many Custom Designs Engineering – Electrical and Mechanical ISO9001:2000 Registration

digital counter

Contextual Info: Ironwood Electronics Test socket 0.5 mm pitch Measurement Results Rev A, Ila Pal 5/15/09 1 Table of Contents Table of Contents . 2

Contextual Info: New Product News Electroformed Probe Pins XP3B Highly Reliable Electroformed Probe Pins. Outer spring type. • Plunger structure to ensure stable contact. • Highly durability due to the smooth end surfaces achieved with electroforming. •Feature ●Plunger structure to ensure stable contact.

FR4 substrate board

Abstract: 0.3mm pitch probe BGA zif socket 0.3mm pitch BGA PB-BGA48D-Z-01 1J23
Contextual Info: 7.62mm [0.300"] Top View 33.02mm [1.300"] * This height varies depending on the screw position. 3 5 2 5mm [0.197"]* 9.97mm [0.393"] 6 Side View 7.92mm 4 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni min. . Substrate: 3.60mm ±0.18mm [0.142" ±0.007"]

WLCSP flip chip

Abstract: WLCSP smt 0.3mm pitch csp package wlcsp inspection WLCSP chip mount WLCSP PBO design amkor flip amkor RDL amkor polyimide system in package WLCSP underfill
Contextual Info: data sheet wafer level packaging WLCSP Features • 4 - 196 ball count • 0.8 mm – 6.5 mm body size • Repassivation, Redistribution and Bumping options available • Electroplated and Ball-loaded bumping options • Eutectic and Lead-free solder • Standard JEDEC / EIAJ pitches and CSP solder ball diameters

X7T voltage dependence

Abstract: GRM155B31A225K GR331 GRM155R71E104K GRM188R61E475 GRM188R71C105KA12 GRM1555C1HR10BA01 GRM32ER71H106KA12 GRM0222C1A101GD05 GRM188D71
Contextual Info: !Note • Please read rating and !CAUTION for storage, operating, rating, soldering, mounting and handling in this catalog to prevent smoking and/or burning, etc. • This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Contextual Info: FEATURES BENEFITS QUICK CONNECT Push/pull latching feature allows for easy one-hand mating HOW TO ORDER & HG 1 IMMEDIATE DELIVERY Four standard sizes are stocked for optimal lead time: HG0: 5 contacts HG2: 12 contacts HG3: 19 contacts HG4: 33 contacts CUSTOMISABLE

"Fiber Optic transmitter"

Abstract: C6560
Contextual Info: Fiber Optic Transmitter MOF-T2K2 Outline Dimensions Features 1.Compact adoption of small jack for mini plug JIS C6560 2.Thin type (4.4mm) transmitter unit. 3.Both optical and electrical signal can be distinguished and transmitted. 4.Signal transmission speed :

MOF-T4K2

Abstract: "Fiber Optic transmitter" C6560
Contextual Info: Fiber Optic Transmitter MOF-T4K2 Outline Dimensions Features 1.Compact adoption of small jack for mini plug JIS C6560 2.Thin type (4.4mm) transmitter unit. 3.Both optical and electrical signal can be distinguished and transmitted. 4.Signal transmission speed :

"Fiber Optic transmitter"

Abstract: C6560
Contextual Info: Fiber Optic Transmitter MOF-T4C2 Outline Dimensions Features 1.Compact adoption of small jack for mini plug JIS C6560 2.Thin type (4.4mm) transmitter unit. 3.Both optical and electrical signal can be distinguished and transmitted. 4.Signal transmission speed :

"Fiber Optic transmitter"

Abstract: C6560 optical jack
Contextual Info: Fiber Optic Transmitter MOF-T2C2 Outline Dimensions Features 1.Compact adoption of small jack for mini plug JIS C6560 2.Thin type (4.4mm) transmitter unit. 3.Both optical and electrical signal can be distinguished and transmitted. 4.Signal transmission speed :

0.3mm pitch csp package

Abstract: AN-1187 DAP 08 PCB design for 0.2mm pitch csp package DAP 07 dap sot 23-5 SAC405 LDA08B MO-220 MO-229
Contextual Info: Table of Contents Introduction . 2 Package Overview . 2

OM338

Abstract: technical of tamura solder paste technical of tamura solder mask luxeon F1 LUXEON Rebel LED Tamura Of America tamura solder paste PROFILE 210WP tamura solder paste E38152
Contextual Info: Application Brief AB32 LUXEON Rebel Assembly and Handling Information Introduction This application brief covers the recommended board design and assembly procedures for LUXEON® Rebel LEDs. LUXEON Rebel is a revolutionary, ultra compact, surface mount high

PCB design for 0.2mm pitch csp package

Abstract: SAC305 reflow profile sac305 thermal conductive DAP 07 JESD22-B111 dap sot 23-5 DAP 06 dap 11 LDA08B MO-220
Contextual Info: Table of Contents Introduction . 2 Package Overview . 2

DAP 07

Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
Contextual Info: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2

Contextual Info: VMMK-2503 1 to 12 GHz GaAs Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago’s VMMK-2503 is an easy-to-use broadband, high linearity amplifier in a miniaturized wafer level package WLP . The wide band and unconditionally stable performance makes this amplifier suitable as a gain block or a

34992

Contextual Info: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package

WLP0402

Abstract: VMMK-2203 34992 VMMK2203 A004R VMMK-2203-BLKG
Contextual Info: VMMK-2203 0.9-11 GHz E-pHEMT Wideband Amplifier in Wafer Level Package Data Sheet Description Features Avago Technologies has combined its industry leading E-pHEMT technology with a revolutionary wafer level package WLP . • 1 x 0.5 mm Surface Mount Package

Contextual Info: VMMK-2403 2 to 4 GHz GaAs High Linearity LNA in Wafer Level Package Data Sheet Description Features Avago’s VMMK-2403 is an easy-to-use, high linearity low noise amplifier in a miniaturized wafer level package WLP . The low noise and unconditionally stable performance makes this amplifier ideal as a primary or subsequent gain block of an RF receiver in applications from