| SOT890-1 |  | NXP Semiconductors | Plastic very thin fine-pitch ball grid array package; 353 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm | Original | PDF | 323.33KB | 1 | 
| SOT891 |  | NXP Semiconductors | Footprint for reflow soldering SOT891 | Original | PDF | 202.88KB | 1 | 
| SOT891 |  | NXP Semiconductors | Plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1 x 0.5 mm | Original | PDF | 218.76KB | 1 | 
| SOT89_135 |  | NXP Semiconductors | Tape reel SMD; standard product orientation 12NC ending 135 | Original | PDF | 180.67KB | 2 | 
| SOT893-1 |  | NXP Semiconductors | Plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 1 mm | Original | PDF | 256.35KB | 1 | 
| SOT89-3EV-VREG |  | Microchip Technology | Evaluation Boards - Linear Voltage Regulators (LDOs), Programmers, Development Systems, BOARD EVAL SOT89-3 VOLTAGE REG | Original | PDF |  | 22 | 
| SOT-89-3L |  | Unknown |  | Scan | PDF | 165.79KB | 1 | 
| SOT894-1 |  | NXP Semiconductors | Plastic low profile fine-pitch ball grid array package; 280 balls; body 11 x 11 x 1 mm | Original | PDF | 261.68KB | 1 | 
| SOT895-1 |  | NXP Semiconductors | Plastic flanged cavity package; 2 mounting slots; 2 leads | Original | PDF | 222.83KB | 1 | 
| SOT895a |  | NXP Semiconductors | Plastic flanged cavity package; 2 mounting slots; 2 leads | Original | PDF | 222.79KB | 1 | 
| SOT896B |  | NXP Semiconductors | Plastic earless flanged cavity package; 2 leads | Original | PDF | 218.19KB | 1 | 
| SOT898-1 |  | NXP Semiconductors | Plastic thermal enhanced thin quad flat package; no leads; 48 terminals; body 7 x 7 x 1 mm | Original | PDF | 229.5KB | 1 | 
| SOT899-1 |  | NXP Semiconductors | Plastic thermal enhanced very thin small outline package; no leads; 2 terminals; body 3 x 2 x 0.85 mm | Original | PDF | 224.49KB | 1 | 
| SOT89 Package |  | Zetex Semiconductors | Package Dimensions | Original | PDF | 26.93KB | 1 |