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SOT115
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NXP Semiconductors
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SOT115 Mounting |
Original |
PDF
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5.97KB |
2 |
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SOT1150-1
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NXP Semiconductors
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SOT1150-1_po |
Original |
PDF
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297.33KB |
1 |
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SOT1151-1
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NXP Semiconductors
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Plastic thermal enhanced ball grid array package; 640 balls; heatsink |
Original |
PDF
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301.42KB |
1 |
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SOT1152-1
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NXP Semiconductors
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Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based |
Original |
PDF
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230.34KB |
1 |
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SOT1153-1
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NXP Semiconductors
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Plastic ball grid array package; 456 balls |
Original |
PDF
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268.03KB |
1 |
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SOT1154-1
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NXP Semiconductors
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Plastic dual bent surface mounted SIL power package; 27 leads |
Original |
PDF
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379.68KB |
1 |
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SOT1155-1
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 48 balls |
Original |
PDF
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231.31KB |
1 |
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SOT1155-1_118
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NXP Semiconductors
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TFBGA48; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 |
Original |
PDF
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184.28KB |
4 |
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SOT1155-2
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NXP Semiconductors
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Plastic thin fine-pitch ball grid array package; 48 balls |
Original |
PDF
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340.64KB |
1 |
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SOT1156-1
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NXP Semiconductors
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Plastic, thermal enhanced extremely thin small outline package; no leads; 12 terminals |
Original |
PDF
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212.25KB |
1 |
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SOT1156-1
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NXP Semiconductors
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Footprint for reflow soldering SOT1156-1 |
Original |
PDF
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230.78KB |
1 |
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SOT1157-1
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals |
Original |
PDF
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222.04KB |
1 |
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SOT1157-1
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NXP Semiconductors
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Footprint for reflow soldering SOT1157-1 |
Original |
PDF
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315.19KB |
1 |
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SOT1158-1
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals |
Original |
PDF
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222.85KB |
1 |
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SOT1158-1
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NXP Semiconductors
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Footprint for reflow soldering SOT1158-1 |
Original |
PDF
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320.78KB |
1 |
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SOT1159-1
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NXP Semiconductors
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Footprint for reflow soldering SOT1159-1 |
Original |
PDF
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323.81KB |
1 |
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SOT1159-1
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
Original |
PDF
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223.81KB |
1 |
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SOT115AA
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
Original |
PDF
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241.46KB |
1 |
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SOT115AD
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
Original |
PDF
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235.08KB |
1 |
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SOT115AE
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NXP Semiconductors
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Plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals |
Original |
PDF
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227.81KB |
1 |
