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L177HDDH78SOL2
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 78 Socket, 0.38um (15u\\) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock |
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L177HDE15SVF
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 15 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock |
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L177HREH15S
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Amphenol Communications Solutions
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Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell, 15 Socket, 4-40 Rear Nut |
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L177HDE15SOL2
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 15 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock |
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L177HDCH62SOL2RM5
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Amphenol Communications Solutions
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Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 62 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\) |
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