| SOT82 |
|
STMicroelectronics
|
SOT82 - ASD & DISCRETES - TOURS |
Original |
PDF
|
16.14KB |
1 |
| SOT820-1 |
|
NXP Semiconductors
|
Plastic thermal enhanced small outline package; 16 leads; body width 7.5 mm; heatsink |
Original |
PDF
|
229.98KB |
1 |
| SOT821-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 228 balls; body 15 x 15 x 1.05 mm |
Original |
PDF
|
253.63KB |
1 |
| SOT82_127 |
|
NXP Semiconductors
|
Tube pack; standard product orientation; 12NC ending 127 |
Original |
PDF
|
114.76KB |
2 |
| SOT822-1 |
|
NXP Semiconductors
|
Plastic, heatsink small outline package; 16 leads |
Original |
PDF
|
228.29KB |
1 |
| SOT822-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT822-1 |
Original |
PDF
|
14.43KB |
1 |
| SOT823-1 |
|
NXP Semiconductors
|
Plastic low profile quad flat package; 80 leads; body 14 x 14 x 1.4 mm |
Original |
PDF
|
238.61KB |
1 |
| SOT824-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 320 balls; body 13 x 13 x 0.9 mm |
Original |
PDF
|
299.34KB |
1 |
| SOT825-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm |
Original |
PDF
|
247.27KB |
1 |
| SOT825-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT825-1 |
Original |
PDF
|
11.5KB |
1 |
| SOT826-1 |
|
NXP Semiconductors
|
Plastic low profile fine-pitch ball grid array package; 73 balls; body 7 x 7 x 0.9 mm |
Original |
PDF
|
234.87KB |
1 |
| SOT826-1 |
|
NXP Semiconductors
|
Footprint for reflow soldering SOT826-1 |
Original |
PDF
|
11.34KB |
1 |
| SOT827-1 |
|
NXP Semiconductors
|
Plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 6.8 mm) |
Original |
PDF
|
361.66KB |
1 |
| SOT829-1 |
|
NXP Semiconductors
|
Plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm |
Original |
PDF
|
280.53KB |
1 |
|
|
| SOT82 DPG AGRATE |
|
STMicroelectronics
|
SOT82 DEDICATED PRODUCT PACKAGE |
Original |
PDF
|
23.71KB |
1 |
