"LEADFRAME MATERIAL" DIP Search Results

Contextual Info: Thermal Data  DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:

leadframe

Abstract: dip 28 thermal dip-28 DSA008820
Contextual Info: Thermal Data  DIP 28 28 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 3.8 mm 0.0063W/cm°C Leadframe options:

Contextual Info: Part Number: SPX5205M5-L‐1‐8 Package: 5L SOT23 Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 0.6632 0.1196 3 Leadframe

Contextual Info: Part Number: XR8052ASO8X Package: 8L SOIC Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 1.7400 0.0648 3 Leadframe 25.9200

Contextual Info: Product: SP3222EBEA-L Package: 20L SSOP Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight g Element/Compound CAS No. 1 2 Die Die Attach 0.0016 0.0003 3 Leadframe 0.0617

Contextual Info: Product Number: SP3497EEN-L Package: 14L NSOIC Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight g Element/Compound CAS No. 1 2 Die Die Attach 0.0036 0.0011 3 Leadframe 0.0491

Contextual Info: Part Number: SP3232EUEA-L Package: 16 SSOP Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.3600 0.1152 3 Leadframe 46.0800

Contextual Info: Product: SP508EEF-L Package: 100L LQFP Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 31.3300 3.6991 3 Leadframe 238.6428

52398

Contextual Info: Part Number: SPX5205M5-L‐3‐3 Package: 5L SOT23 Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 0.6632 0.1196 3 Leadframe

Contextual Info: Part Number: SPX5205M5-L‐3‐0 Package: 5L SOT23 Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 0.6632 0.1196 3 Leadframe

Contextual Info: Part Number: SPX5205M5-L Package: 5L SOT23 Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 0.6746 0.1212 3 Leadframe 5.2398

Contextual Info: Product Number: SP3070EEN-L Package: 14L NSOIC Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight g Element/Compound CAS No. 1 2 Die Die Attach 0.0036 0.0011 3 Leadframe 0.0491

Contextual Info: Product: SP3485CN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.7400 0.5545 3 Leadframe 35.9827

Contextual Info: Part Number: CLC2000ISO8X Package: 8L SOIC Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 1.7400 0.0648 3 Leadframe 25.9200

Contextual Info: Product: SP706SEN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.7400 0.5545 3 Leadframe 35.9827

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARSL Package Weight mg 2000 Product Group Type No. ARS50AL – ARS50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package ARL Package Weight mg 2200 Product Group Type No. AR50AL – AR50JL Component Die Material Solder Alloy Slug Copper Alloy Leadframe Copper Alloy Plating Matte Tin Encapsulation

Contextual Info: WON-TOP ELECTRONICS Material Composition Declaration Package Information Package GBP Package Weight mg 1700 Product Group Type No. GBP200 – GBP210 Component Die Copper Alloy Plating Matte Tin Encapsulation Tolerance Material Solder Alloy Leadframe MSL Rating

Contextual Info: Part Number: SP485EMN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.8000 0.2831 3 Leadframe 38.9685

Contextual Info: Product: SP3077EEN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 4.9600 0.5019 3 Leadframe 38.9685

Contextual Info: Product: SP3485EN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.7400 0.5545 3 Leadframe 35.9827

Contextual Info: Product: SP3223EEA-L Package: 20L SSOP Material Declaration Statement of Materials, Construction Component Material Weight % Material Name Weight g Element/Compound CAS No. 1 2 Die Die Attach 0.0016 0.0003 3 Leadframe 0.0617

Contextual Info: Part Number: SP3496EEN-L Package: 8L NSOIC Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight mg Element/Compound CAS No. 1 2 Die Die Attach 2.7700 0.2831 3 Leadframe 38.9685

Contextual Info: Product: ST16C2550CQ48-F Package: 48L TQFP 7x7 Material Declaration Statement of Materials, Construction Component Material Material Weight % Name Weight (mg) Element/Compound CAS No. 1 2 Die Die Attach 2.6400 0.5350 3 Leadframe