67292-050LF
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 100 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
67292-050
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 100 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
68020-422HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch.
87827-422HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54mm (0.100in) Pitch.
94611-422HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm (0.100in) Pitch.
86840-422HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 22 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 5.84 mm (0.23in) Tail.