67292-050LF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 100 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
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67292-050
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 100 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating. |
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68459-130HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Double Row, 30 Positions, 2.54mm (0.100in)Pitch. |
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68764-130HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch. |
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93944-130HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch. |
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68458-130HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 30 Positions, 2.54mm (0.100in) Pitch. |
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