67292-050LF
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 100 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
67292-050
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 100 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
78938-125HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
68466-125HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
94063-125HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54mm (0.100in) Pitch.
78511-125HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.