67292-050LF
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 100 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
67292-050
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 100 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
87185-123HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 23 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
69173-123HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 23 Positions, 2.54 mm (0.100in) Pitch.
87827-123HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 23 Positions, 2.54mm (0.100in) Pitch.
87916-123HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 23 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.