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K18X6MMTX-PN-PF-STL-Z-BLK MISC. COMMERCIAL HRD Bisco Industries 377 - -

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W25R128FV

Abstract: W25Q128JV W25R128F W25Q128FV W25Q128F USON-8 W25Q80DL W978H6KB W25Q80BVSSIG
Text: , Enhanced3 2.7V - 3.6V 104 SOIC16Â 300mil, WSON8 8X6mm , TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm , SOIC16Â 300mil, WSON8 8X6mm , TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) P UD , 300mil, WSON8 8X6mm P N W25Q256JV Dual/Quad-SPI, QPI, DTR, Enhanced3 2.7V - 3.6V 104 SOIC16Â 300mil, WSON8 8X6mm , TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix) UD UD , 6X5mm, WSON8 8X6mm , TFBGA24 6X8mm (4x6 Matrix), TFBGA24 6X8mm (5x5 Matrix), VSOP8 208mil W25Q128FW


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2015 - Not Available

Abstract: No abstract text available
Text: (Ø 8x6mm ) 2-Electrode Gas Discharge Tubes 5KA / 3KA Fast Delivery Time 1:Dimension(mm) 2:Main Applications •PCI Cards protection •Telephone/Fax/Modem protection •single line protection •ADSL/XDSL Splitter,Power Supply •Surge Protection Device/Surge Protector 3:Features •100% Lead-Free(RoHs Compliant ) •Non-Radioactive •Low capacitance (≤1pF) •Fast Response-time,High , (Ø 8x6mm ) Gas Discharge Tubes 5 Electrical Characteristics Impulse Spark-over Voltage Impulse


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PDF HA2R75C HA2R90C HA2R2500C HA2R3000C HA2R3600C HA2R4000C 00V/S 100PCS abc0734
2009 - 25X32AVSIG

Abstract: FEATURES10
Text: -MIL . 5 PAD CONFIGURATION WSON 6X5-MM & 8X6-MM . 5 PIN DESCRIPTION SOIC 208-MIL, WSON 6X5-MM, WSON 8X6-MM , ). 41 8-Contact 8x6mm WSON (Package Code ZE , -pin SOIC 208-mil ­ 16-pin SOIC 300-mil ­ 8-pad WSON 6x5-mm (1) ­ 8-pad WSON 8x6-mm Note 1 ­ Special , -mil (Package Code SS) 4 PAD CONFIGURATION WSON 6X5-MM & 8X6-MM Figure 1b. W25X32A Pad Assignments, 8


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PDF W25X32A 32M-BIT 208-MIL 208-MIL, 25X32AVSIG FEATURES10
NS2R-90A1-M

Abstract: NS2R-230A1-M NS2R-250A1-M NS2R-350A1-M NS2R-600A1-M NS2R-75A1-M NS2R-250A-M NS2R-75A-M NS2R NS2R-350A-M
Text: 2- . , , . Medium-Duty Types 10KA / 10A ø 8x6mm 20KA / 10A ø 8x6mm NS2R-75A-M NS2R-75A1-M NS2R-90A-M NS2R-90A1-M NS2R-145A-M NS2R-145A1-M NS2R-230A-M NS2R-230A1-M NS2R-250A-M NS2R-250A1-M NS2R-350A-M NS2R-350A1-M NS2R-470A-M NS2R-470A1-M NS2R-600A-M NS2R-600A1-M 10/1000µ 50, 1 , , s 300 ,5 8/20µs, , , , 75 < 650 100 10 10 52 90 < 700 100 10 10 52 145 < 700 100 10 10 52 230 < 750 100 10 / 20 10 135 250 < 800 100


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PDF NS2R-75A-M NS2R-75A1-M NS2R-90A-M NS2R-90A1-M NS2R-145A-M NS2R-145A1-M NS2R-230A-M NS2R-230A1-M NS2R-250A-M NS2R-250A1-M NS2R-90A1-M NS2R-230A1-M NS2R-250A1-M NS2R-350A1-M NS2R-600A1-M NS2R-75A1-M NS2R NS2R-350A-M
winband

Abstract: W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm w25q128 W25X16AV 208-MIL w25X20BV
Text: , SOIC8 208mil, SOIC16 300mil, WSON 6X5mm,PDIP8 300mll SOIC8 208mil,SOIC16 300mil,WSON 6X5mm, WSON 8X6mm , PDIP8 300mll SOIC8 1 SOmll, SOIC8 208mil, SOIC16 300mil, WSON 6X5mm, WSON 8X6mm SOIC8 208mil, SOIC16 300mll, WSON 8X6mm ,PDIP8 300mll SOIC8 208mil, SOIC16 300mll, WSON 8X6mm , PDIP8 300mll SOIC16 300mil, WSON 8X6mm S(Q2/'10) S(Q3/'10) S(Q2/'10) S (Q2/'10) ■Status: P= Mass Production, S=Samples, UD=Under , , WSON 8X6mm EOL Recommend W25Q32BV Y W25X32AV 32M-bit (4MB) 16,384 pages, 4KB sectors, 64KB blocks, Dual


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PDF 300mm winband W25X40BV W25Q408W w25x40v W651GG2JB WSON* 8x6mm w25q128 W25X16AV 208-MIL w25X20BV
W25Q10EW

Abstract: w25q10 W25R128FV W25Q64FW W25R128F W25Q
Text: 300mil, SD=TSSOP8 173mil, ZP or P=WSON8 6x5mm, ZE or E=WSON8 8x6mm , TC or C=TFBGA24 8x6mm (4x6 Matrix), TB or B=TFBGA24 8X6mm (5X5 Matrix), UX=USON8 2x3mm, UU=USON8 4x3mm, XG=XSON8 4x4m, BY=WLBGA. KGD


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PDF 512K-bit 256M-bit, 104MHz 416MHz 50M-Byte/S 150mil, 208mil, 300mil, 173mil, W25Q10EW w25q10 W25R128FV W25Q64FW W25R128F W25Q
2014 - Not Available

Abstract: No abstract text available
Text: ShenZhen HuaXinAn Electronics Co.,Ltd (Ø 8x6mm ) 2-Electrode Gas Discharge Tubes 5KA Fast Delivery Time 1:Dimension(mm) 2R600C 2:Main Applications •PCI Cards protection •Telephone/Fax/Modem protection •single line protection •ADSL/XDSL Splitter,Power Supply •Surge Protection Device/Surge Protector Photo 3:Features •100% Lead-Free(RoHs Compliant , discharge www.huaandz.com Table continues on next page ShenZhen HuaXinAn Electronics Co.,Ltd (Ø 8x6mm


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PDF 2R600C 2R75C 2R2500C 2R3000C 2R3600C 2R4000C 00V/S 100PCS abc0734
2009 - w25q32b

Abstract: W25Q32BV W25X32BV 208mH
Text: -MIL . 5 PAD CONFIGURATION WSON 6X5-MM / WSON 8X6-MM . 5 PIN DESCRIPTION SOIC 208-MIL, WSON 6X5-MM, WSON 8X6-MM . 5 , ) . 39 8-Contact 8x6mm WSON (Package Code ZE , operating range Space Efficient Packaging ­ 8-pin SOIC 208-mil ­ 8-pad WSON 6x5mm (1) ­ 8-pad WSON 8x6mm ­ 16-pin SOIC 300-mil Note 1: WSON-8 8x6mm is a special order package, please contact Winbond for


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PDF W25X32BV 32M-BIT W25Q32BV W25X32BV 208-MIL w25q32b 208mH
2011 - W25Q64cv

Abstract: 25Q64CVSIG 25q64cvf 25Q64CVFIG 936KB W25Q64CVT 25q64cv 25q64 WINBOND 25Q64CVSIG 25q64cvaig
Text: -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC 208-mil, WSON 6x5/ 8x6-mm and PDIP 300-mil . 7 , -mil . 8 Ball Configuration TFBGA 8x6-mm . 9 Ball Description TFBGA 8x6-mm , ) . 72 8-Pad WSON 8x6mm (Package Code ZE


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PDF W25Q64CV 64M-BIT 208-mil W25Q64cv 25Q64CVSIG 25q64cvf 25Q64CVFIG 936KB W25Q64CVT 25q64cv 25q64 WINBOND 25Q64CVSIG 25q64cvaig
2014 - Not Available

Abstract: No abstract text available
Text: contact WSON (6x5mm) (JK) - 8 contact WSON ( 8x6mm ) (JL) - 24 balls BGA ( 8x6mm ) (JG) - All Pb-free , ) 5 SI (SO0) 8-pin WSON 6x5mm 8-pin WSON 8x6mm EL EA 8-pin SOIC 208mil 8-Pin SOIC 8


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PDF IS25CQ064 K-byte/32 104MHz 160/200MHz 300mil 208mil IS25CQ064-JKLI IS25CQ064-JLLI IS25CQ064-JGLI 24-ball
2009 - Not Available

Abstract: No abstract text available
Text: -MIL . 5 4. PAD CONFIGURATION WSON 8X6-MM . 5 5. PIN DESCRIPTION SOIC 208-MIL, WSON 8X6-MM , . 38 12.1 12.2 8-Contact 8x6mm WSON (Package Code ZE , – 8-pin SOIC 208-mil – 8-pad WSON 8x6-mm – 16-pin SOIC 300-mil  Software and Hardware , 1a. W25X64BV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS) 4. PAD CONFIGURATION WSON 8X6-MM


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PDF W25X64BV 64M-BIT W25Q64BV W25X64BV 208-MIL
2009 - W25Q64

Abstract: 3017h W25X64BVSFIG TRAY DIMENSIONS SOIC16 WINBOND W25X64BV w25Q64BV
Text: -MIL . 5 PAD CONFIGURATION WSON 8X6-MM , -MIL . 6 PIN DESCRIPTION SOIC 208-MIL, PDIP 300-MIL, WSON 8X6-MM , ) . 40 8-Contact 8x6mm WSON (Package Code ZE , Space Efficient Packaging ­ 8-pin SOIC 208-mil ­ 8-pad WSON 8x6-mm ­ 8-pin PDIP 300-mil ­ 16-pin SOIC , , 8-pin SOIC 208-mil (Package Code SS) 4. PAD CONFIGURATION WSON 8X6-MM Figure 1b. W25X64BV Pad


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PDF W25X64BV 64M-BIT W25Q64BV W25X64BV 208-MIL W25Q64 3017h W25X64BVSFIG TRAY DIMENSIONS SOIC16 WINBOND W25X64BV
2013 - Not Available

Abstract: No abstract text available
Text: . 6 3.1 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil. 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/ 8x6-mm and PDIP 300-mil . , -mil. 8 3.7 Ball Configuration TFBGA 8x6-mm , -mil . 6 Ball Description TFBGA 8x6-mm , ) . 71 9.5 8-Pad WSON 8x6-mm (Package Code ZE


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PDF W25Q32BV 32M-BIT 300-mil.
2012 - W25Q32BV

Abstract: WINBOND 25Q32BVSIG WINBOND 25Q32BVAIG WINBOND W25Q32BVSSIG 25q32bvsig W25Q32BV application note land pattern for vsop 8 pins 032KB W25Q32BVSSIG 25Q32BVAIG
Text: -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/ 8x6-mm and PDIP 300-mil . 7 Pin , -mil . 8 Ball Configuration TFBGA 8x6-mm . 9 Ball Description TFBGA 8x6-mm , ) . 71 8-Pad WSON 8x6-mm (Package Code ZE


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PDF W25Q32BV 32M-BIT 208-mil W25Q32BV WINBOND 25Q32BVSIG WINBOND 25Q32BVAIG WINBOND W25Q32BVSSIG 25q32bvsig W25Q32BV application note land pattern for vsop 8 pins 032KB W25Q32BVSSIG 25Q32BVAIG
2012 - W25Q128BV

Abstract: 25Q128BVFG JESD216 w25q128 25Q128 25q12 25Q128BVEG marking m7 A-1512 FF00FFH
Text: . 6 3.1 3.2 3.3 3.4 3.5 3.6 4. 4.1 4.2 4.3 4.4 4.5 5. 6. Pad Configuration WSON 8x6-mm . 6 Pad Description WSON 8x6-mm , -mil . 7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 8 Ball Description TFBGA 8x6-mm , . 66 8-Pad WSON 8x6-mm (Package Code E


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PDF W25Q128BV 128M-BIT W25Q128BV 25Q128BVFG JESD216 w25q128 25Q128 25q12 25Q128BVEG marking m7 A-1512 FF00FFH
W25Q128FW

Abstract: No abstract text available
Text: . 6 3.1 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm . 6 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm , -mil. 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array , -mil . 6 Ball Description TFBGA 8x6-mm , ) . 85 10.3 8-Pad WSON 8x6-mm (Package Code E


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PDF W25Q128FW 128M-BIT 208-mil, W25Q128FW
2012 - WINBOND 25Q64CVSIG

Abstract: Winbond 25Q64CVIG W25Q64CV land pattern for vsop 8 pins 25Q64CVSIG WSON 8x6mm land pattern land pattern for vsop 60 pins WINBOND APPLICATION NOTE WINBOND W25q64CV w25q64c
Text: -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/ 8x6-mm and PDIP 300-mil . 7 Pin , -mil . 8 Ball Configuration TFBGA 8x6-mm . 9 Ball Description TFBGA 8x6-mm , ) . 71 8-Pad WSON 8x6mm (Package Code ZE


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PDF W25Q64CV 64M-BIT 208-mil WINBOND 25Q64CVSIG Winbond 25Q64CVIG W25Q64CV land pattern for vsop 8 pins 25Q64CVSIG WSON 8x6mm land pattern land pattern for vsop 60 pins WINBOND APPLICATION NOTE WINBOND W25q64CV w25q64c
2014 - Not Available

Abstract: No abstract text available
Text: (JM) - 8 contact WSON ( 8x6mm ) (JL) - 24 balls BGA (6x8mm) (JG) - All Pb-free packages are RoHS , 8-pin WSON ( 8x6mm ) EL EA HOLD#(IO3) N O T R 16-Pin SOIC 300mil 24 - Ball


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PDF IS25CQ256 M-bit/32 K-byte/131 80MHz 50MHz 24-ball IS25CQ256-JMLI 32768K 16-pin
2013 - WINBOND 25Q64CVSIG

Abstract: No abstract text available
Text: . 6 3.1 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil. 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/ 8x6-mm and PDIP 300-mil . , -mil. 8 3.7 Ball Configuration TFBGA 8x6-mm , -mil . 6 Ball Description TFBGA 8x6-mm , ) . 71 9.5 8-Pad WSON 8x6mm (Package Code ZE


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PDF W25Q64CV 64M-BIT 300-mil. WINBOND 25Q64CVSIG
2013 - Not Available

Abstract: No abstract text available
Text: . 6 3.1 3.2 Pad Description WSON 8x6-mm , -mil. 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 8 3.6 4. Pad Configuration WSON 8x6-mm . 6 Ball Description TFBGA 8x6-mm , ) . 68 9.3 24-Ball TFBGA 8x6-mm (Package Code B, 5x5-1 Ball Array


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PDF W25Q128BV 128M-BIT
2012 - 25q64fvsig

Abstract: WINBOND 25Q64FVSIG 25Q64FVAIG 25q64fv W25Q64FV 25Q64FVFIG 25q64 land pattern for vsop 8 pins 25q64f W25Q64FVSSIG
Text: -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/ 8x6-mm and PDIP 300-mil . 7 Pin , -mil . 8 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 9 Ball Description TFBGA 8x6-mm , ) . 81 8-Pad WSON 8x6-mm (Package Code ZE


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PDF W25Q64FV 64M-BIT 208-mil 25q64fvsig WINBOND 25Q64FVSIG 25Q64FVAIG 25q64fv W25Q64FV 25Q64FVFIG 25q64 land pattern for vsop 8 pins 25q64f W25Q64FVSSIG
2012 - 25q64fvsig

Abstract: 25q64fv 25Q64FVAIG WINBOND 25Q64FVSIG 25q64 W25Q64FV 25q64f 25Q64FVFIG 25q64fva W25Q64FVSSIQ
Text: -mil . 6 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 Pin Description SOIC/VSOP 208-mil, WSON 6x5/ 8x6-mm and PDIP 300-mil . 7 Pin , -mil . 8 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 9 Ball Description TFBGA 8x6-mm , ) . 81 8-Pad WSON 8x6-mm (Package Code ZE


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PDF W25Q64FV 64M-BIT 208-mil 25q64fvsig 25q64fv 25Q64FVAIG WINBOND 25Q64FVSIG 25q64 W25Q64FV 25q64f 25Q64FVFIG 25q64fva W25Q64FVSSIQ
Not Available

Abstract: No abstract text available
Text: . 6 3.1 3.2 Pad Configuration WSON 6x5-mm / 8X6-mm , -mil . 7 3.4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/ 8x6-mm and PDIP 300 , -mil . 8 3.7 Ball Configuration TFBGA 8x6-mm , -mil . 6 Ball Description TFBGA 8x6-mm , ) . 71 9.5 8-Pad WSON 8x6mm (Package Code ZE


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PDF W25Q64CV 64M-BIT 300-mil
2012 - winbond 25q128fvsg

Abstract: 25Q128fv 25q128fvsg 25Q128 25Q128F 25Q128FVFG 25Q128FVSQ W25Q128F W25Q128FV IO320
Text: Configuration WSON 6x5-mm / 8x6-mm . 6 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm . 6 Pin , -mil . 7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 8 Ball Description TFBGA 8x6-mm , 8x6-mm (Package Code E) . 90


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PDF W25Q128FV 128M-BIT 208-mil winbond 25q128fvsg 25Q128fv 25q128fvsg 25Q128 25Q128F 25Q128FVFG 25Q128FVSQ W25Q128F W25Q128FV IO320
2012 - w25q128

Abstract: winbond 25q128fvsg 25Q128FVFG 25q128fvsg 25Q128fv 25Q128F 25Q128 W25Q128F 25Q128FVSQ w25q128fv
Text: Configuration WSON 6x5-mm / 8x6-mm . 6 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm . 6 Pin , -mil . 7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) . 8 Ball Description TFBGA 8x6-mm , 8x6-mm (Package Code E) . 90


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PDF W25Q128FV 128M-BIT 208-mil w25q128 winbond 25q128fvsg 25Q128FVFG 25q128fvsg 25Q128fv 25Q128F 25Q128 W25Q128F 25Q128FVSQ w25q128fv
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