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UCC14240QDWNRQ1
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Texas Instruments
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Automotive, 2.0-W, 24-Vin, 25-Vout high-density > 3-kVRMS isolated DC/DC module 36-SO-MOD -40 to 125 |
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54121-424053250LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch. |
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77311-424-04LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch. |
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10142407-103KLF
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Amphenol Communications Solutions
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Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface Mount, 3 Position,Staggered,Top latch
(For product qualification latest status, please submit Product Enquiry) |
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61083-142409LF
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Amphenol Communications Solutions
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BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 140 Positions. |
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54122-113142400LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 14 position, 2.54mm (0.100in) pitch |
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