6802/BQAJC
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Rochester Electronics LLC
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Rochester Manufactured 6802, Microprocessor, 40 SB DIP Package, QML spec. |
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68020-408H
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch. |
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68020-406H
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 6 Positions, 2.54mm (0.100in) Pitch. |
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68020-420HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch. |
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68020-422HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 22 Positions, 2.54mm (0.100in) Pitch. |
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68021-204HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 4 Positions, 2.54 mm (0.100in) Pitch. |
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