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74SSTUBH32865ABKG Integrated Device Technology Inc CABGA-160, Tray
74SSTUBH32865ABKG8 Integrated Device Technology Inc CABGA-160, Reel
74SSTUBF32865ABK8 Integrated Device Technology Inc CABGA-160, Reel
74SSTUBF32865ABK Integrated Device Technology Inc CABGA-160, Tray
74SSTUBF32865ABKG8 Integrated Device Technology Inc CABGA-160, Reel
74SSTUBF32865ABKG Integrated Device Technology Inc CABGA-160, Tray
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  You can filter table by choosing multiple options from dropdownShowing 13 results of 13
Part Manufacturer Supplier Stock Best Price Price Each Buy Part
659-65AB Wakefield-Vette Master Electronics 927 $1.02 $0.56
659-65AB Wakefield-Vette Newark element14 377 $1.45 $1.02
659-65AB Wakefield-Vette Future Electronics - $1.44 $1.17
659-65AB Wakefield-Vette Sager - $1.20 $1.01
659-65AB Wakefield-Vette element14 Asia-Pacific 365 $1.70 $1.36
659-65AB Wakefield-Vette Farnell element14 365 £1.29 £1.10
659-65AB Wakefield-Vette Allied Electronics & Automation - $1.02 $1.02
659-65ABT1 REV A Wakefield-Vette Future Electronics - $1.15 $1.15
659-65ABT1E Wakefield-Vette Sager - $1.76 $1.49
659-65ABT2 Wakefield-Vette Master Electronics 2,031 $2.69 $1.00
659-65ABT3 Wakefield-Vette Sager - $1.93 $1.63
659-65ABT4E Wakefield-Vette Sager - $1.76 $1.49
659-65ABT5 Wakefield-Vette Sager - $1.77 $1.50

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659-65AB Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
7476

Abstract: 658-45AB 655-26AB 655-53AB 658-25AB 658-35AB
Text: Integrated Circuit Heat Sinks PENGUIN TM COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs Unidirectional Fin Heat Sink for AMD Am386 ®, PowerPCTM 601 659 SERIES Standard P/N 14 x 14, 38, 40 mm CQFP Base Dimensions in. (mm) Heat Sink Finish Weight lbs. (grams) 1.45 (36.8) sq 659-65AB Height in. (mm) 0.650 (16.5) Black Anodized 0.050 (22.68) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74­76. NATURAL AND FORCED CONVECTION


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PDF Am386 659-65AB 658-25AB 658-35AB 658-45AB 658-60AB 7476 658-45AB 655-26AB 655-53AB 658-25AB 658-35AB
D1065

Abstract: Chomerics* T-405 BERGQUIST softface Chomerics* T405 BGA 21x21 Chomerics T710 tape ARCLAD 8223 Chomerics T710 t443 630-35AB
Text: 655-53AB 658-25AB 658-35AB 658-45AB 658-60AB 659-65AB 660-29AB 663-35AB 698-100AB 698-40AB


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PDF 21x21 25x25 28x28 35x35 37x37 38x38 71x43 73x50 D1065 Chomerics* T-405 BERGQUIST softface Chomerics* T405 BGA 21x21 Chomerics T710 tape ARCLAD 8223 Chomerics T710 t443 630-35AB
1996 - heat and mass transfer

Abstract: Theta-J hot wire anemometer
Text: high EG&G Wakefield PN 659-65AB These heat sinks were chosen because they represent typical size and , Straight Fin HTI Pin Fin 1.5 x 1.5 x .675 inch 659-65AB Wakefield, MA 1.25 x 1.25 x .30 inch


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PDF MXT3010C heat and mass transfer Theta-J hot wire anemometer
7476

Abstract: P628 CX486slc D10650-40 pin fin heat sink 658-35AB 658-25AB 655-53AB 655-26AB 7476+truth+table
Text: Integrated Circuit Heat Sinks PENGUIN TM COOLERS: HEAT SINKS FOR MICROPROCESSORS, ASICs AND BGAs Unidirectional Fin Heat Sink for AMD Am386 ®, PowerPCTM 601 659 SERIES Standard P/N 14 x 14, 38, 40 mm CQFP Base Dimensions in. (mm) Heat Sink Finish Weight lbs. (grams) 1.45 (36.8) sq 659-65AB Height in. (mm) 0.650 (16.5) Black Anodized 0.050 (22.68) Notes: 1. Optional factory preapplied pressure-sensitive adhesive. Pages 74­76. NATURAL AND FORCED CONVECTION


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PDF Am386 659-65AB 7476 P628 CX486slc D10650-40 pin fin heat sink 658-35AB 658-25AB 655-53AB 655-26AB 7476+truth+table
Wakefield Thermal Solutions

Abstract: Chomerics* T405 Bergquist BP-108 D10650-40 77AB 658-35AB datasheet of BGAS BERGQUIST softface bga package weight 643-35AP
Text: 658-60AB 659-65AB 660-29AB 663-35AB 698-100AB 698-40AB 698-65AB 698-80AB 798-100AB 798-40AB , Application Weight lbs. (grams) 37mm BGA 659-65AB L 1.45 (36.8) sq 0.650 (16.5) Notes: 1


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PDF
BGA 64 PACKAGE thermal resistance

Abstract: BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
Text: Standard P/N 659-65AB v Unidirectional Fin Heat Sink for BGAs Base Dimensions in. (mm) Height in


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PDF 624-25AB 624-35AB 624-45AB 624-60AB BGA 64 PACKAGE thermal resistance BGA PACKAGE thermal resistance 624-25AB 612-Series 643-35AP 655-53AB
Bergquist BP-108

Abstract: T405R Chomerics* T405 T410R 64-pin BGA thermal resistance i960CF T412 T411 T410 T405
Text: 659-65AB 1.45 (36.8) sq 0.650 (16.5) Notes: 1. Optional factory preapplied pressure-sensitive adhesive


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PDF WTS001 p1-25 220486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG Bergquist BP-108 T405R Chomerics* T405 T410R 64-pin BGA thermal resistance T412 T411 T410 T405
T405R

Abstract: Chomerics* T405 BERGQUIST softface Bergquist BP-108 T410R intel 82495 intel 80486sx 651b thermal printer 2 inch Intel 82495 Cache Controller
Text: in. (mm) Typical Application Heat Sink Finish Weight lbs. (grams) 659-65AB 1.45


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PDF 0486SX I860XR I960CA, I960CF AM486DX2, AM486DX4 669-32AG 669-32AG 669-33AB 669-40AB T405R Chomerics* T405 BERGQUIST softface Bergquist BP-108 T410R intel 82495 intel 80486sx 651b thermal printer 2 inch Intel 82495 Cache Controller
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