TPS657120YFFR
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Texas Instruments
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RF frontend Power Management IC (PMIC) 30-DSBGA -40 to 85 |
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68657-120HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. |
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68657-121HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 21 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. |
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68657-127HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 27 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. |
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68657-124HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. |
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68657-126HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. |
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