The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial

63-BALL Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
AD0712UB-A76GL

Abstract: AD0824UB-A72GL AD0824MS-A76GL AD0824MS-A71GL AD0824HB-A76GL AD0824UB-A73GL AD0812UB-A73GL ad0812ls-a76gl AD0824MB-A73GL AD0812HB-A70GL
Text: AD0805MX-D71 AD0805HX-D71 AD0805MB-D71 AD0805HB-D70 AD0805HB-D71 BALL BALL HYPRO BALL HYPRO HYPRO HYPRO BALL BALL BALL BALL S S S S BALL HYPRO HYPRO HYPRO HYPRO BALL BALL BALL BALL S S HYPRO HYPRO HYPRO BALL BALL BALL S S S S HYPRO HYPRO BALL BALL BALL 12 12 5 5 , ) Pressure (Inches) S S S HYPRO HYPRO HYPRO HYPRO HYPRO HYPRO HYPRO BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL S S S S S S S HYPRO HYPRO BALL BALL BALL S S S


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2006 - Not Available

Abstract: No abstract text available
Text: Addresses Shared Addresses 63/1& 63/1' $$ $ $$ $$ Figure 3.1 84- ball Fine-Pitch Ball Grid , BSC 0.80 BSC 0.40 BSC 0.45 MAX 1.20 -0.97 PROFILE BALL HEIGHT BODY THICKNESS BODY SIZE BODY SIZE MATRIX FOOTPRINT MATRIX FOOTPRINT MATRIX SIZE D DIRECTION MATRIX SIZE E DIRECTION BALL COUNT BALL DIAMETER BALL PITCH BALL PITCH SOLDER BALL PLACEMENT 9. 8. 7 6 NOTE 2. 3. 4. 5. 1. DIMENSIONING AND TOLERANCING METHODS PER ASME Y14.5M-1994. ALL DIMENSIONS ARE IN MILLIMETERS. BALL POSITION DESIGNATION PER


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PDF S71PL-N S71PL256N, S71PL127N, S71PL129N 16-Bit) 20ion
2002 - AM29LV512

Abstract: 63-ball 48-PIN 56-PIN
Text: Devices . 6 63-Ball FBGA and 48- Ball FBGA: 3.0 V x8/x16 or x16-only Devices . 7 48- or 63-Ball FBGA: 3.0 V x8-only Devices . 8 1 48-PIN TSOP: 3.0 V , mm 11 x 13 mm 11 x 13 mm 11 x 13 mm 12 x 18 mm 12 x 18 mm 63-BALL FBGA AND 48- BALL FBGA: 3.0 V X8/X16 OR X16-ONLY DEVICES 63-ball Grid Array A B 8 NC NC NC C E F G , MirrorBitTM Flash Device Densities 7 48- OR 63-BALL FBGA: 3.0 V X8-ONLY DEVICES 63-ball Grid Array


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PDF 64-Ball Am29LV017M 63-Ball 48-Ball x8/x16 x16-only Am29LV320MT/B Am29LV160M AM29LV512 48-PIN 56-PIN
2006 - Not Available

Abstract: No abstract text available
Text: concurrent operation • VDD = VDDQ = +1.8V ±0.1V • JEDEC-standard 63-ball ballout • Low-profile , x 2 ranks – 16 Meg x 8 x 8 banks x 2 ranks • FBGA package (lead-free) – 63-ball FBGA (9mm x , Assignments and Descriptions Ball Assignments and Descriptions Figure 1: 63-Ball FBGA Assignments â , reserved. 2Gb: x4, x8 TwinDie DDR2 SDRAM Ball Assignments and Descriptions Table 3: 63-Ball FBGA , . Table 6: Thermal Impedance Die Rev Package E 63-ball G 63-ball Last shrink


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PDF MT47H512M4 MT47H256M8 63-Ball MT47H MT47H512M4 09005aef8266acfe/Source: 09005aef8266ac6e
2006 - 63-ball

Abstract: MT47H512M4 MT47H256M8 DDR2-800 DDR2-667 DDR2-533 TN-00-08 MICRON 63 marking WMM marking micron ddr2
Text: operation · VDD = VDDQ = +1.8V ±0.1V · JEDEC-standard 63-ball ballout · Low-profile package size (1.35mm , 8 x 8 banks x 2 ranks · FBGA package (lead-free) ­ 63-ball FBGA (9mm x 11.5mm) · Timing ­ cycle , Figure 1: 63-Ball FBGA Assignments ­ x4, x8 (Top View) 1 2 3 4 5 6 7 VDD NF , Descriptions Table 3: 63-Ball FBGA Ball Descriptions ­ x4, x8 Symbol Type Description A[13:0 , Package E 63-ball G 63-ball Last shrink target 63-ball JA (°C/W) JA (°C/W) JA


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PDF MT47H512M4 MT47H256M8 09005aef8266acfe/Source: 09005aef8266ac6e MT47H512M4 63-ball MT47H256M8 DDR2-800 DDR2-667 DDR2-533 TN-00-08 MICRON 63 marking WMM marking micron ddr2
2006 - MT47H512M8

Abstract: No abstract text available
Text: Configuration ­ 64 Meg x 4 x 8 banks x 2 ranks ­ 32 Meg x 8 x 8 banks x 2 ranks · FBGA package (Pb-free) ­ 63-ball , operation · VDD = VDDQ = +1.8V ±0.1V · JEDEC-standard 63-ball ballout · Low-profile package 1.35mm MAX , and Descriptions Figure 1: 63-Ball FBGA Assignments ­ x4, x8 (Top View) 1 A 2 3 4 5 , Descriptions Table 3: 63-Ball FBGA Ball Descriptions Symbol A0, A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11 , Functional Description Table 3: 63-Ball FBGA Ball Descriptions (continued) Symbol VDDL VDDQ VREF VSS VSSDL


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PDF MT47H1G4 MT47H512M8 63-ball Timi68-3900 09005aef8227ee4d/Source 09005aef822d103f MT47H1G MT47H512M8
2006 - Not Available

Abstract: No abstract text available
Text: (Pb-free) ­ 63-ball FBGA (9mm x 11.5mm) · Timing ­ cycle time1 ­ 2.5ns @ CL = 5 (DDR2-800) ­ 2.5ns @ CL = 6 , +1.8V ±0.1V · JEDEC-standard 63-ball ballout · Low-profile package size 1.35mm MAX thickness Table 1 , SDRAM Ball Assignments and Descriptions Ball Assignments and Descriptions Figure 1: 63-Ball FBGA , Assignments and Descriptions Table 3: 63-Ball FBGA Ball Descriptions ­ x4, x8 Symbol A0, A1, A2, A3, A4, A5 , , x8 TwinDie DDR2 SDRAM Functional Description Table 3: 63-Ball FBGA Ball Descriptions ­ x4, x8


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PDF MT47H512M4 MT47H256M8 63-ball 09005aef8266acfe/Source: 09005aef8266ac6e MT47H512M4
2006 - 63-ball

Abstract: MT47H512M8 MT47H1G MT47H1G4 DDR2-533 63 ball fbga thermal resistance micron DDR2-800 SAC305 TN-00-08 IDD3P
Text: Meg x 4 x 8 banks x 2 ranks ­ 32 Meg x 8 x 8 banks x 2 ranks · FBGA package (Pb-free) ­ 63-ball FBGA (12mm x 14mm) Rev. A ­ 63-ball FBGA (9mm x 11.5mm) Rev. C · Timing ­ cycle time1 ­ 2.5ns @ CL = , · VDD = VDDQ = +1.8V ±0.1V · JEDEC-standard 63-ball FBGA · Low-profile package ­ 1.35mm MAX , Figure 1: 63-Ball FBGA ­ x4, x8 Ball Assignments (Top View) 1 2 3 4 5 6 7 8 9 , , x8 TwinDie DDR2 SDRAM Ball Assignments and Descriptions Table 3: FBGA 63-Ball Descriptions


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PDF MT47H1G4 MT47H512M8 63-ball DDR2-800) DDR2-667) DDR2-533) 09005aef8227ee4d mt47h1g MT47H512M8 MT47H1G4 DDR2-533 63 ball fbga thermal resistance micron DDR2-800 SAC305 TN-00-08 IDD3P
2006 - MT47H512M8

Abstract: 63-ball 68 ball fbga thermal resistance IDD3P 63 ball fbga thermal resistance micron DDR2 SDRAM Meg x 4 x 9 banks
Text: VDDQ = +1.8V ±0.1V · JEDEC-standard 63-ball FBGA · Low-profile package ­ 1.35mm MAX thickness , (Pb-free) ­ 63-ball FBGA (12mm x 14mm) Rev. A ­ 63-ball FBGA (9mm x 11.5mm) Rev. C · Timing ­ cycle time1 ­ , and Descriptions Figure 1: 63-Ball FBGA ­ x4, x8 Ball Assignments (Top View) 1 A B C D E VDDL , SDRAM Ball Assignments and Descriptions Table 3: FBGA 63-Ball Descriptions Symbol A[14:0] Type Input , Assignments and Descriptions Table 3: FBGA 63-Ball Descriptions (Continued) Symbol RDQS, RDQS# Type I/O


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PDF MT47H1G4 MT47H512M8 63-ball 09005aef8227ee4d mt47h1g MT47H512M8 68 ball fbga thermal resistance IDD3P 63 ball fbga thermal resistance micron DDR2 SDRAM Meg x 4 x 9 banks
2006 - Not Available

Abstract: No abstract text available
Text: Meg x 8 x 8 banks x 2 ranks · FBGA package (lead-free) ­ 63-ball FBGA (9mm x 11.5mm) · Timing ­ cycle , internal banks for concurrent operation · Vdd = Vddq = +1.8V ±0.1V · JEDEC-standard 63-ball ballout · , Descriptions Ball Assignments and Descriptions Figure 1: 63-Ball FBGA Assignments ­ x4, x8 (Top View) 1 , [13:0] 63-Ball FBGA Ball Descriptions ­ x4, x8 Type Input Description Address inputs: Provide the , . Table 6: Die Rev E G Last shrink target Thermal Impedance Package 63-ball 63-ball 63-ball JA (°C/W


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PDF MT47H512M4 MT47H256M8 09005aef8266acfe/Source: 09005aef8266ac6e MT47H512M4
2004 - A21-A0

Abstract: tray matrix bga DQ15-DQ0
Text: January 26, 2004 P r e l i m i n a r y Connection Diagrams 63-Ball Fine-Pitch BGA (FSD063) Top , = Industrial (­40°C to +85°C) PACKAGE TYPE BA = 63-ball Ball Grid Array (BGA, FSD063) 0.8 mm , S70JL128HA0 January 26, 2004 P r e l i m i n a r y Physical Dimensions FSD063-63- Ball Fine-Pitch Ball , ,E1,E8,F1,F8 G1,G8,H1,H8,J1,J8,K1,K8 L3,L4,L5,L6,M3,M4,M5,M6 0.40 MAX 1.40 -1.10 PROFILE BALL HEIGHT , SIZE E DIRECTION BALL COUNT BALL DIAMETER BALL PITCH BALL PITCH SOLDER BALL PLACEMENT DEPOPULATED


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PDF S70JL128H S29JL064H, 16-Bit) S70JL128HA0 A21-A0 tray matrix bga DQ15-DQ0
2006 - MT47H512M8

Abstract: No abstract text available
Text: = VDDQ = +1.8V ±0.1V · JEDEC-standard 63-ball FBGA · Low-profile package 1.35mm MAX thickness , (Pb-free) ­ 63-ball FBGA (12mm x 14mm) Rev. D · Timing ­ cycle time ­ 2.5ns @ CL = 6 (DDR2-800) ­ 3.0ns @ , 1: 63-Ball FBGA ­ x4, x8 Ball Assignments (Top View) 1 A B C Vdd Q 2 3 4 5 6 7 , Package 63-ball 63-ball Substrate 2-layer 4-layer 2-layer 4-layer JB (°C/W) 25.7 23.9 13.9 13.6 , SDRAM Package Dimensions Package Dimensions Figure 5: 63-Ball FBGA (12mm x 14mm) Seating plane


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PDF MT47H1G4 MT47H512M8 63-ball 09005aef8227ee4d mt47h1g MT47H512M8
2000 - 63-Ball

Abstract: AM29DL32XD transistor A16 transistor A7 32-PIN 48-PIN AM29F010
Text: x8-only Devices . 12 48- or 63-Ball FBGA: 3 V x8/x16 Devices . 13 48- or 63-Ball FBGA: 3 V X8-only Devices . 14 47- & 48- Ball FBGA , VSS 16 17 DQ3 A11 Migrating Between Flash Device Densities 48- OR 63-BALL FBGA: 3 V X8/X16 DEVICES 63-ball Grid Array A B 8 NC NC NC C E F G H J K , 48- OR 63-BALL FBGA: 3 V X8-ONLY DEVICES 63-ball Grid Array A B NC NC NC NC 8


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PDF 48-/63-ball 48Ball Am29BDS 44-pin 56-pin Am29LV065 40-Pin 48-Pin 63-Ball AM29DL32XD transistor A16 transistor A7 32-PIN AM29F010
2006 - Not Available

Abstract: No abstract text available
Text: ) – 63-ball FBGA (8mm x 10.0mm) • Timing – cycle time1 – 2.5ns @ CL = 5 (DDR2-800) â , has 8 internal banks for concurrent operation • VDD = V DDQ = +1.8V ±0.1V • JEDEC-standard 63-ball , Ball Assignments and Descriptions Ball Assignments and Descriptions Figure 1: 63-Ball FBGA – x4 , , x8 TwinDie DDR2 SDRAM Ball Assignments and Descriptions Table 3: FBGA 63-Ball Descriptions Symbol , Assignments and Descriptions Table 3: FBGA 63-Ball Descriptions (Continued) Symbol Type RDQS, RDQS


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PDF MT47H512M4 MT47H256M8 63-ball DDR2-800) DDR2-667) DDR2-533) 09005aef8266acfe MT47H512M4
2006 - Not Available

Abstract: No abstract text available
Text: ) – 63-ball FBGA (9mm x 11.5mm) Rev. C • Timing – cycle time1 – 2.5ns @ CL = 5 (DDR2 , has 8 internal banks for concurrent operation • VDD = V DDQ = +1.8V ±0.1V • JEDEC-standard 63-ball , Descriptions Ball Assignments and Descriptions Figure 1: 63-Ball FBGA – x4, x8 Ball Assignments (Top View , Assignments and Descriptions Table 3: FBGA 63-Ball Descriptions Symbol Type Description A[14:0 , reserved. 4Gb: x4, x8 TwinDie DDR2 SDRAM Ball Assignments and Descriptions Table 3: FBGA 63-Ball


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PDF MT47H1G4 MT47H512M8 63-ball DDR2-800) DDR2-667) DDR2-533) 09005aef8227ee4d mt47h1g
BD48B

Abstract: No abstract text available
Text: Range °C 45 N/A 7.8 650 1050 1050 2650 22 10.4 44.3 -10 to +70 . BD12S3H 030960 Ball 12 6-14 35 , +70 45 20-28 6.3 260 440 440 2450 21 9.9 43.2 -10 to +70 ■BD24S3H 030961 Ball 24 12-28 35 14-28 , 45 45-56 8.9 185 210 210 2800 23 10.9 45.9 - 10 to +70 BD48S3H 030962 Ball 48 24-56 35 30-56 6.1 130 , 10 to +70 3.3 85% 10-14 6.3 520 1000 1000 H 2300 19 9.0 42.6 -10 to +70 BD12R3 030963 Ball 12 , % 18-28 5.5 230 420 420 H 2300 19 9.0 42.6 - 10 to +70 BD24R3 030964 Ball 24 12-28 1.2 60% 13-28 2.9 120


OCR Scan
PDF E31293 LR52898 R97229 BD48B3V BD12H3V BD24H3V BD48H3V BD12F3V BD24F3V BD48F3V BD48B
2001 - 63-Ball

Abstract: fbe063-63-ball ei 306 20 64
Text: current s Package options - 56-pin TSOP - 63-ball Fine-Pitch BGA (LV640MU only) - 64- ball Fortified , and the Ordering Information sections. The device is offered in a 56-pin TSOP or 63-ball Fine-Pitch , I N F O R M A T I O N CONNECTION DIAGRAMS 63-Ball Fine-Pitch BGA (FBGA) Top View, Balls , Ball Grid Array (fBGA), 1.0 mm pitch, 13 x 11 mm package (LAA064) WH = 63-Ball Fine Pitch Ball Grid , description of chip-scale package from 63-ball FBGA to 64- ball Fortified BGA. Changed RFU (reserved for


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PDF Am29LV640M 16-Bit 16-Bit/8 128-word/256-byte 8-word/16-byte 63-ball TS056 LAA064 fbe063-63-ball ei 306 20 64
2006 - axial fans CSA ebm-papst

Abstract: p 551 ac W6E330-CP02-70
Text: W 4E 330A S er ies ø A x ia l 330mm S-Range ebm-papst offers a wide range of AC axial fans to optimally fit any application. Discharge over struts: Dir. of rotation is CCW looking at rotor. Inlet over struts: Dir. of rotation is CW looking at rotor. Maintenance-free ball bearings , 1840 115 115 50/60 50/60 145 145 63 63 40 40 Ball Ball Leads Leads 14 , 145 145 54 54 63 63 70 70 40 40 Ball Ball Ball Ball Leads Leads Leads Leads


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PDF 330mm W4E330-CP22-70 W4E330-CP22-71 axial fans CSA ebm-papst p 551 ac W6E330-CP02-70
AM29LV640T

Abstract: AM29LV640T datasheet TSOP 48 pin flash gbit 120r MirrorBit kb 2736 110R 101R uAM29LV640T KB-162
Text: ) Am29LV033M Am29LV033M 63-ball FBGA Am29LV065M Am29LV065M Notes: 1. Am29LV116M has boot sectors , ) MirrorBit products in these packages will include 512 Mbit and 1 Gbit devices. (3) 48- to 63-ball migration , Package (Pin/ Ball Count) 3 Temp. Range Voltage Supply VIO4 Page Mode Organization , / ball count is provided in parenthesis for information only, and is not included in the actual ordering , Ordering Part Number1 Density Device Number Sector Access Times (ns)2 Package (Pin/ Ball


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PDF Am29LV033C Am29LV160M Am29LV017M Am29LV116M Am29LV320MT/B Am29LV320MH/L Am29LV033M Am29LV640T/B Am29LV320D1 Am29LV640D AM29LV640T AM29LV640T datasheet TSOP 48 pin flash gbit 120r MirrorBit kb 2736 110R 101R uAM29LV640T KB-162
2010 - 63-ball

Abstract: TN-00-08
Text: Meg x 8 x 8 banks x 2 ranks · FBGA package (lead-free) ­ 63-ball FBGA (8mm x 10mm) · Timing ­ cycle , concurrent operation · VDD = VDDQ = +1.8V ±0.1V · JEDEC-standard 63-ball ballout · Low-profile package size , Ball Assignments and Descriptions Figure 1: 63-Ball FBGA Assignments ­ x4, x8 (Top View) 1 A VDD , Descriptions Table 3: Symbol A[13:0] 63-Ball FBGA Ball Descriptions ­ x4, x8 Type Input Description , . Table 6: Die Rev H Thermal Impedance Package 63-ball JA (°C/W) JA (°C/W) JA (°C/W) Substrate


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PDF MT47H512M4 MT47H256M8 09005aef83fa94e3/Source: 09005aef8266ac6e 63-ball TN-00-08
Not Available

Abstract: No abstract text available
Text: Go To Image Index Wiha Quality Tools Go To Numerical Index Germany www.wihatools.com 151 Pico Soft Grip Ball End Inch & Metric SHOP SHOP 264 Ball End Hex Inch Screwdriver, With Precision Soft PicoFinish Handle Blade high alloy chrome-vanadium-molybdenum tool steel , dimensions actual - Inch dimensions approximate 264 Ball End Hex Metric Screwdriver, With Precision , *Metric dimensions actual - Inch dimensions approximate SHOP 264 93 Set 7 Pcs. Inch Ball End Hex


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ad0412

Abstract: AD0624HB-A72GL AD0624HX-D71GL ad7512ub AD0924UB ad0612mx AD1212HS ad0524hb AD0712UB-A76GL AD0912HS-A76GL
Text: ,1S 1B,1S 1B,1S HYPRO HYPRO 1B,1S 1B,1S HYPRO HYPRO Bor1B1S BALL Bor1B1S Bor1B1S HYPRO BALL BALL HYPRO HYPRO HYPRO HYPRO 1B,1S 1B,1S 1B,1S 1B,1S 1B,1S HYPRO HYPRO BALL BALL HYPRO HYPRO HYPRO HYPRO HYPRO HYPRO BALL BALL BALL BALL 5 5 5 5 5 5 5 12 12 12 12 , AD0305MB-G50 AD0305MB-G53 BALL BALL BALL HYPRO HYPRO HYPRO BALL BALL BALL HYPRO BALL BALL BALL BALL BALL HYPRO HYPRO HYPRO HYPRO HYPRO HYPRO 1B,1S 1B,1S BALL 1B,1S 1B,1S 1B,1S HYPRO


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2006 - MT29F1G08aba

Abstract: MT29F1G16ABA mt29f1g08 MT47H64M16 MT48LC32M16A2 MT48LC4M32B2 mt47h128m8 MT49H32M18FM Vfbga 10x19 MT9V022 note
Text: VFBGA VFBGA Balls Vcc Samples Production 63-ball 63-ball 1.70V­1.95V 1.70V­1.95V , 16Mb 1 Megx16 Async/Page/Burst MT45W1MW16BD 1.8V VFBGA 54- ball Now Now 1 Megx16 Async/Page MT45W1MW16PD 1.8V VFBGA 48- ball Now Now 32Mb 2 Megx16 Async/Page/Burst MT45W2MW16BA 1.8V VFBGA 54- ball Now Now 2 Megx16 Async/Page MT45W2MW16PA 1.8V VFBGA 48- ball Now Now 64Mb 4 Megx16 Async/Page/Burst MT45W4MW16BC 1.8V VFBGA 54- ball Now Now 4 Megx16 Async/Page


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PDF 52-ball MT29F1G08aba MT29F1G16ABA mt29f1g08 MT47H64M16 MT48LC32M16A2 MT48LC4M32B2 mt47h128m8 MT49H32M18FM Vfbga 10x19 MT9V022 note
2007 - GRM188R60J106

Abstract: GRM21BR60J226 GRM155R60J105 GRM21BR60J106 VLF3010AT-4R7MR70 VLF3012AT-4R7MR74
Text: turned on in the application: VAUX output ball must be left open. VAUX output capacitor is , connected to ground. USBRCV: this ball is always in output mode. When not used, it must be left open. IT_WAKE_UP: this ball is in output mode. When not used, it must be left open. 3.3.3 USBOEn: when not used, the USB transceiver is clamped in data transmit mode. As the USBOEn ball is pulled down internally by a 1.5 M resistor, this ball can be connected to a low level or can be left open. USB_INTn


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2009 - VLGA 64GB

Abstract: 29f2g08 nand flash 128g 32G nand flash 128GB Nand flash micron 1G SPI NAND flash Micron MLC temperature MICRON 1.8V 2GB NAND 100Ball Micron NAND Flash MLC Die
Text: WP = 48-pin TSOP I (CPL version) (Pb-free) WC = 48-pin TSOP I (OCPL version) (Pb-free) HC = 63-ball , 48-pad LLGA, 12 x 20 x 1.47 (8DP) C8 = 52-pad WLGA, 14 x 18 x 0.75 (DDP/QDP) H1 = 100- ball VBGA (Pb-free), 12 x 18 x 1.0 H2 = 100- ball TBGA (Pb-free), 12 x 18 x 1.2 H3 = 100- ball LBGA, (Pb-free) 12 x 18 x 1.4 (DDP/QDP/8DP) H4 = 63-ball VFBGA, 9 x 11 x 1 Interface Mark Interface A Async only B


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PDF 128Gb 256Gb 48-pad 52-pad 100-ball 63-ball VLGA 64GB 29f2g08 nand flash 128g 32G nand flash 128GB Nand flash micron 1G SPI NAND flash Micron MLC temperature MICRON 1.8V 2GB NAND 100Ball Micron NAND Flash MLC Die
Supplyframe Tracking Pixel