The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
TPS60300DGSRG4 Texas Instruments Single-Cell to 3.0V/3.3V, 20mA Dual Output, High Efficiency Charge Pump 10-VSSOP -40 to 85
TPS60303DGSG4 Texas Instruments Single-Cell to 3.0V/3.3V, 20mA Dual Output, High Efficiency Charge Pump 10-VSSOP -40 to 85
TWL6030B1A0CMR Texas Instruments Fully Integrated Power Management IC (PMIC) with Switch Mode Charger 187-FCBGA
TPA6030A4PWPRG4 Texas Instruments Wide Supply Voltage, Low Power, Class-AB Audio Amplifier 28-HTSSOP -40 to 85
TPS60300DGSR Texas Instruments Single-Cell to 3.0V/3.3V, 20mA Dual Output, High Efficiency Charge Pump 10-VSSOP -40 to 85
TPS60303DGS Texas Instruments Single-Cell to 3.0V/3.3V, 20mA Dual Output, High Efficiency Charge Pump 10-VSSOP -40 to 85

6030 LED Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1995 - NSB5881

Abstract: MICROPROCESSOR Z80 7segment NSB3881 NSN581 9 digit display NSA1298 NSB7881 MM74C917 MM74C912 NSB3881 equivalent z80 in calculator
Text: MM74C917 4 (a) (b) TL F 6030 ­ 10 TL F 6030 ­ 9 FIGURE 9 Average LED Segment Current vs , to Common Anode LED Interface Using 9 Digit Driver TL F 6030 ­ 18 FIGURE 16 MM74C912 MM74C917 , FIGURE 19 Discrete LED Matrix Display 10 TL F 6030 ­ 22 FIGURE 20 Dual 16 Element Bar Graph , ) Display with 8 Discrete LED 's (b) Inputs for LED Output Table 14 (a) TL F 6030 ­ 27 (b) ``ON'' , MM74C911 MM74C912 and MM74C917 are CMOS display controllers that control multiplexing of 8-segment LED


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PDF MM74C911 MM74C912 MM74C917 MM74C912 NSB5881 MICROPROCESSOR Z80 7segment NSB3881 NSN581 9 digit display NSA1298 NSB7881 NSB3881 equivalent z80 in calculator
1999 - 6030 LED

Abstract: LED 6030 EN6030 C703 SPI-336-99-T1 sanyo phototransistor SPI-336-99
Text: Ordering number : EN6030 Infrared LED SPI-336-99-T1 SPI-336-99-T1 Ultraminiature photoreflector supporting reflow soldering (Single transistor type) Features · Infrared LED plus , Taping type Absolute Maximum Ratings at Ta=25°C, 65%RH (as per JIS C7032) Input LED Output , , Taito-ku, TOKYO, 110-8534 JAPAN 72199 GI, (MI) No. 6030 1/6 SPI-336-99-T1 Typical Characteristics , 25 50 75 100 Ambient Temperature Ta (°C) No. 6030 2/6 SPI-336-99-T1 Typical


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PDF EN6030 SPI-336-99-T1 C7032) 6030 LED LED 6030 EN6030 C703 SPI-336-99-T1 sanyo phototransistor SPI-336-99
Not Available

Abstract: No abstract text available
Text: 1000mA | LED Driver Derating Free Air Convection Output Power (%) 100 AMLDW- 6030 -RZ AMLDW , Click on Series name for product info on aimtec.com Series AMLDW-RZ Up to 1000mA | LED Driver FEATURES: • Step Down DC/DC LED driver • Constant current output • Ultra Wide (7:1) input voltage , • Open and Short LED Protection • PWM / Digital Voltage dimming • Output power up to 56 , Current (mA) Max Capacitive Load (uF) Efficiency (%) Ripple & Noise (mV p-p) AMLDW- 6030


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PDF 1000mA AMLDW-6030-RZ AMLDW-6035-RZ AMLDW-6050-RZ
Not Available

Abstract: No abstract text available
Text: Click on Series name for product info on aimtec.com Series AMLD-RZ Up to 1000mA | LED Driver FEATURES: • Step Down DC/DC LED driver • Constant current output • Ultra Wide (7:1) input voltage , Short LED Protection • PWM / Digital Voltage dimming • Output power up to 56 Watts Models , Capacitive Load (uF) Efficiency (%) Ripple & Noise (mV p-p) AMLD- 6030 -RZ 9-60 2-56 300 2.2 , AMLD-RZ Up to 1000mA | LED Driver Safety Specifications Parameters Standards CE EN 55015 : 2006


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PDF 1000mA AMLD-6030-RZ AMLD-6035-RZ AMLD-6050-RZ AMLD-6060-RZ
2003 - 107D

Abstract: No abstract text available
Text: 600.0 H23 600.0 603.0 H24 603.0 606.5 H25 606.5 610.0 H26 610.0 , such as isopropyl alcohol to clean the LED . 4. Forming & Mounting When forming a lead, the leads , mounted through hole type LED lamp, avoid the occurrence of residual mechanical stress due to clinching , stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering , sec. Max. 6. Drive Method LED is a current operated device, and therefore, requires some kind of


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PDF LTL8166FTNN-004A MIL-STD-202F 30mins MIL-STD-750D MIL-STD-883D 107D
2003 - LTL102SFK

Abstract: No abstract text available
Text: 603.0 H24 603.0 606.5 H25 BNS-OD-C131/A4 Max. H23 Part No. : LTL102SFK Min , Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens , any external stress to the lead frame during soldering while the LED is at high temperature , temperature and / or time might result in deformation of the LED lens or catastrophic Temperature Soldering time 300°C Max. 3 sec. Max. (one time only) failure of the LED . Part No. : LTL102SFK


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PDF LTL102SFK BNS-OD-C131/A4 30mins 10CYCLES MIL-STD-883D 10mins MIL-STD-202F MIL-STD-750D LTL102SFK
2004 - LED 6030

Abstract: 100-lead 6030 LED 107D LTL102SFK LTL102SFKH006B
Text: color is black. 4. The holder raw material is PC(Fireproof). 5. The LED lamp is LTL102SFK. Part No , . H23 600.0 603.0 H24 603.0 606.5 H25 606.5 610.0 Part No. : LTL102SFKH006B , alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED . 4. Forming & Mounting When , normal temperature. When mounted through hole type LED lamp, avoid the occurrence of residual mechanical , stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering


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PDF LTL102SFK LTL102SFK. LTL102SFKH006B BNS-OD-C131/A4 IL-STD-883D MIL-STD-202F 30min 30mins MIL-STD-750D MIL-STD-883D LED 6030 100-lead 6030 LED 107D LTL102SFK LTL102SFKH006B
2014 - Not Available

Abstract: No abstract text available
Text: . Max. H22 598.0 600.0 H23 600.0 603.0 H24 603.0 606.5 H25 606.5 , alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED . 4. Forming & Mounting When , normal temperature. When mounted through hole type LED lamp, avoid the occurrence of residual mechanical , apply any stress to the lead frame during soldering while the LED is at high temperature. Recommended , °C Max. 10 sec. Max. 6. Drive Method LED is a current operated device, and therefore, requires some


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PDF DS-20-98-0287 BNS-OD-FC001/A4 T-13/4 MIL-STD-202F 30mins MIL-STD-750D MIL-STD-883D
2006 - wireless mouse circuit diagram

Abstract: PC usb mouse CIRCUIT diagram wireless usb mouse circuit diagram mouse encoder schematic mouse microcontroller interface dr-15v optical mouse microcontroller circuit diagram of 2.4ghz rf transmitter mouse optical receiver circuit diagram ADNV6340
Text: ADNS- 6030 low power laser mouse sensor, Texas Instruments MSP430F1222 microcontroller, Nordic , package. · Complete laser mouse reference design kit The Avago Technologies ADNS- 6030 low power , essential in demanding wireless applications. The ADNS- 6030 sensor along with the ADNS-6120 or ADNS , ADNS- 6030 10 11 9 1 TD1 17 TD0 18 VDD 16 GND GND 7 15 NTE151P Q101 , Blk W10 BIL R111 10R Figure 2. Circuit diagram of ADNS- 6030 sensor, buttons and Z-wheel


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PDF ADNK-6033-ND24 ADNS-6030 MSP430F1222 nRF2402 nRF2401A CY7C63231A 18-pin 5989-3605EN AV01-0280EN wireless mouse circuit diagram PC usb mouse CIRCUIT diagram wireless usb mouse circuit diagram mouse encoder schematic mouse microcontroller interface dr-15v optical mouse microcontroller circuit diagram of 2.4ghz rf transmitter mouse optical receiver circuit diagram ADNV6340
6030 LED

Abstract: H8580 H8630 C0480 C0430 30.1.14.0 C0430A led lamp 230v E63363 C6030
Text: Indicator Lights To match 8500, 8600, R13, 1500, 1550, 5500, 6000, 8300 and 7000 switches Colours and voltages: Neon Available with Red, Amber, Green or Clear lenses Filament lamp Mains LED Indicator lights Neon or filament lamp 100/130V (marked 110V), 200/250V (marked 230V) Available with Red, Amber or Green lenses 6V, 12/14V, 24/28V 6030 only Bezel sizes from 6.7 to 16.3mm , in panels thickness up to 3.0 C0430 A C 6.3 Body Code A B L R K 2.8 6030 - L body


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PDF 100/130V 200/250V 12/14V, 24/28V C6030 6030 LED H8580 H8630 C0480 C0430 30.1.14.0 C0430A led lamp 230v E63363
2003 - 107D

Abstract: No abstract text available
Text: 603.0 H24 603.0 606.5 H25 606.5 610.0 H26 610.0 613.5 Note: Tolerance of , alcohol to clean the LED . 4. Forming & Mounting When forming a lead, the leads should be bent at a , hole type LED lamp, avoid the occurrence of residual mechanical stress due to clinching as figure , frame during soldering while the LED is at high temperature. Recommended soldering condition Soldering , . 6. Drive Method LED is a current operated device, and therefore, requires some kind of current


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PDF T-13/4 BNS-OD-C131/A4 MIL-STD-202F 30mins MIL-STD-750D MIL-STD-883D 107D
Not Available

Abstract: No abstract text available
Text: KiLIN- 6030 2U rack-mount network server with Cavium Octeon processor and redundant PSU n n n n n n MIPS64 Cavium Octeon processor with 16 cores and up to 600MHz Security, Regular expression and Decom/ compression functions inside Optional COM-Express module supported Up to , -buttons, option for 6-buttons LEDs 350W 1+1 redundant PSU LED indicators for power status and storage , % to 95% RH Certification ORDERING GUIDE CE/FCC/UL MIPS 64 Architecture / KiLIN- 6030 26


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PDF KiLIN-6030 MIPS64 600MHz DDR400/DDRII 256MB CN3860 400/500/600MHz DDR400/DDRI KiLIN-6030-4300 CN3860-
cambasic

Abstract: BEST BIOS PROGRAMMING AND DATA FOR EEPROM Octagon Systems octagon IEEE1284 IEC1000 386SX 16C550 nec floppy circuit LED 6030
Text: on a bi­color LED . LAN software provided A networking kernel is built into the 60x0 BIOS that , protection 60X0 I/O COMPARISON CHART Features: 6010 6020 6030 6040 6050 COM1/2 , bi­color LED . These tests are performed automatically every time the system is reset or powered up. No , SPECIFICATIONS 5V ±5%: 6010: 470/175 6020: 490/180 6030 : 440/175 6040: 590/250 6050: 435/170 mA mA , INFORMATION 6010 MULTIFUNCTION CPU 6020 MULTIFUNCTION CPU 6030 MULTIFUNCTION CPU #4735 6010


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2005 - Not Available

Abstract: No abstract text available
Text: H23 600.0 603.0 H24 603.0 606.5 H25 606.5 610.0 H26 610.0 613.5 , should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame , during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering , . Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED . IR reflow is not suitable process for through hole type LED lamp product


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PDF T-13/4 BNS-OD-C131/A4 MIL-STD-202F MIL-STD-750D 1000HRS -24HRS, 72HRS)
2007 - AN-1142

Abstract: ASMT-FJ30-AB000 ASMT-FJ30 6030 LED
Text: ASMT-FJ30 Mini Surface Mount AF LED Data Sheet Description Features Avago , environmental friendly green product of unique PCB based, namely Miniature Surface Mount AF LED . · Smooth, Consistent Narrow Radiation Pattern This lamp type LED utilizes Aluminum Indium Gallium Phosphide , slowly. If the LEDs were placed in a product, they would create a Class 1 LED to IEC/EN 60825-1 (2001 , POLARITY LED DICE SOLDERING TERMINAL Anode MASK 3.20 2.20 0.55 0.50 2.40 1.00


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PDF ASMT-FJ30 ASMT-FJ30-AB000 612nm AV02-0996EN AN-1142 ASMT-FJ30 6030 LED
2009 - LTL1CHJFTNN

Abstract: MN 6030
Text: change without notice. 6. The LED lamp original is LTL1CHJFTNN Part No. : LTL1CHJFTNN , @20mA Bin Code Max. H22 598.0 600.0 H23 600.0 603.0 H24 603.0 606.5 , Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens , must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is , and/or time might result in deformation of the LED lens or catastrophic failure of the LED Part No


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PDF LTL1CHJFTNN-001A 10mins MIL-STD-202F MIL-STD-750D MIL-STD-883D LTL1CHJFTNN MN 6030
2005 - RF2401A

Abstract: H102 mps430 h102 eeprom con8a 7c6323 wireless mouse circuit diagram ADNS laserstream agilent rf transmitter circuit diagram C106 capture
Text: solution in one neat package. The Agilent Technologies ADNS- 6030 low power laser mouse sensor, an 18 , areas essential in demanding wireless applications. The ADNS- 6030 sensor along with the ADNS-6120 or , AGND 13 LASER_NEN 6 XY_LASER 8 U101 ADNS- 6030 JP103 12 TAP TD1 17 TD0 18 , ADNS- 6030 sensor, buttons and Z-wheel schematic in ADNK-6033-ND24 designer's kit wireless laser mouse , . 3k D 101 Gr een + C109 4, 7uF USB 5V R111 CS5V D R1-5V CLK 15V DA TA-5 V LED


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PDF ADNK-6033-ND24 ADNS6030 MSP430F1222 nRF2402 nRF2401A CY7C63231A -6033-ND24 5989-3605EN RF2401A H102 mps430 h102 eeprom con8a 7c6323 wireless mouse circuit diagram ADNS laserstream agilent rf transmitter circuit diagram C106 capture
2004 - LTL1KH

Abstract: No abstract text available
Text: 598.0 600.0 H23 600.0 603.0 H24 603.0 606.5 H25 606.5 610.0 H26 , Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens , any external stress to the lead frame during soldering while the LED is at high temperature , result in deformation of the LED lens or catastrophic failure of the LED . IR reflow is not suitable process for through hole type LED lamp product. Part No. : LTL1KHKFD BNS-OD-C131/A4 Page : 7


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PDF BNS-OD-C131/A4 L-STD-883D 10mins MIL-STD-202F MIL-STD-750D MIL-STD-883D 1000HRS LTL1KH
2014 - Not Available

Abstract: No abstract text available
Text: Unit : nm @20mA Bin Code Min. Max. H22 598.0 600.0 H23 600.0 603.0 H24 603.0 606.5 H25 606.5 610.0 H26 610.0 613.5 Note: Tolerance of each bin limit is , 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming , LED is at high temperature. Recommended soldering conditions : Soldering iron Temperature , soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of


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PDF DS20-2004-162 BNS-OD-FC001/A4 NMIL-STD-750D MIL-STD-883D 10mins MIL-STD-202F MIL-STD-750D
2009 - MP 1008 es

Abstract: No abstract text available
Text: @20mA Bin Code Min. Max. H23 600.0 603.0 H24 603.0 606.5 H25 606.5 , Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens , any external stress to the lead frame during soldering while the LED is at high temperature , result in deformation of the LED lens or catastrophic failure of the LED . IR reflow is not suitable process for through hole type LED lamp product. Part No. : LTL2H3VFK-DL-032A (Preliminary) BNS-OD-C131


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PDF T-13/4 LTL2H3VFK-DL-032A ND-202F MIL-STD-750D MIL-STD-883D MIL-STD-202F MP 1008 es
2002 - 5050 LED amber

Abstract: 5050 plcc2 plcc 2 blue LED HSMU-A100-R00J1 HSMS-A100-J00J1 HSML-A100-Q00J1 HSMJ-A100-Q00J1 HSMH-A100-L00J1 HSMD-A100-J00J1 HSMA-A100-Q00J1
Text: Agilent Surface Mount PLCC-2 LED Products Selection Guide Features and Benefits · Industry , PLCC-2 SMT LEDs Background An industry leader in high brightness LED technology, Agilent , This surface-mount LED comes in PLCC-2 standard package dimension. It has a substrate made up of a , cavity and the cavity is encapsulated by an Agilent proprietary epoxy blend. The PLCC-2 SMT LED , brightness performance ­ only PLCC-2 SMT LED supplier offering TS AlInGaP material Special Product


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PDF 5988-5617EN 5050 LED amber 5050 plcc2 plcc 2 blue LED HSMU-A100-R00J1 HSMS-A100-J00J1 HSML-A100-Q00J1 HSMJ-A100-Q00J1 HSMH-A100-L00J1 HSMD-A100-J00J1 HSMA-A100-Q00J1
2005 - Not Available

Abstract: No abstract text available
Text: . H22 598.0 600.0 H23 600.0 603.0 H24 603.0 606.5 H25 606.5 610.0 , Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens , any external stress to the lead frame during soldering while the LED is at high temperature , result in deformation of the LED lens or catastrophic failure of the LED . IR reflow is not suitable process for through hole type LED lamp product. Part No. : LTL2V3VFD BNS-OD-C131/A4 Page : 7


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PDF T-13/4 BNS-OD-C131/A4 MIL-STD-202F MIL-STD-750D 1000HRS -24HRS, 72HRS)
2005 - Not Available

Abstract: No abstract text available
Text: . Max. F 597.0 600.0 G 600.0 603.0 H 603.0 606.5 J 606.5 610.0 K , Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens , any external stress to the lead frame during soldering while the LED is at high temperature , result in deformation of the LED lens or catastrophic failure of the LED . IR reflow is not suitable process for through hole type LED lamp product. Part No. : LTL2R3VFKNT-032A BNS-OD-C131/A4 Page


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PDF T-13/4 LTL2R3VFKNT-032A BNS-OD-C131/A4 10mins MIL-STD-202F MIL-STD-750D MIL-STD-883D
2004 - Not Available

Abstract: No abstract text available
Text: Bin Code Min. Max. H22 598.0 600.0 H23 600.0 603.0 H24 603.0 606.5 , Assembly During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens , any external stress to the lead frame during soldering while the LED is at high temperature , result in deformation of the LED lens or catastrophic failure of the LED . IR reflow is not suitable process for through hole type LED lamp product. Part No. : LTL2R3VFDS-132A BNS-OD-C131/A4 Page


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PDF T-13/4 LTL2R3VFDS-132A BNS-OD-C131/A4 10mins MIL-STD-202F MIL-STD-750D MIL-STD-883D
2009 - Not Available

Abstract: No abstract text available
Text: Unit : nm @20mA Bin Code Min. Max. H22 598.0 600.0 H23 600.0 603.0 H24 603.0 606.5 H25 606.5 610.0 H26 610.0 613.5 Note: Tolerance of each bin limit is , should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame , during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering , . Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or


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PDF T-13/4 LTL2R3KFTD-750D MIL-STD-883D 10mins MIL-STD-202F MIL-STD-750D
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