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1998 - 1Mx16x4

Abstract: 54TSOP PC100 54-TSOP UPD4564163G5-A10B
Text: 100 3.3 6 4K/64 `PC100' 3.3 6 4K/64 `PC100' 3.3 Package 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II 54TSOP II SQP £ each POA POA POA POA POA POA POA POA POA · · · ·


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PDF 54PIN PD4564441G5-A10B PD4564441G5-A10 PD4564441G5-A80 PD4564841G5-A10B PD4564841G5-A10 PD4564841G5-A80 PD4564163G5-A10B PD4564163G5-A10 PD4564163G5-A80 1Mx16x4 54TSOP PC100 54-TSOP UPD4564163G5-A10B
2006 - pc2-5300

Abstract: ELPIDA PC2-3200 ECL120ACECN ELPIDA DDR2 elpida 1gb pc2 Elpida DDR2 SDRAM component EDE1108ABSE EDE1108AASE DDR2-533
Text: -E 75-E 6B-E 75-E 6B-E 75-E 75-E 75-E 6B-E 75-E 75-E 6B-E 75-E 3.3+/-0.3V 54-TSOP II 90-FBGA 2.5+/-0.2V Product Status Ask MP MP UD 4K/64ms 1.8+/-0.1V G 54-TSOP II , 54-TSOP II Ask J 2.5+/-0.2V H 3.3+/-0.3V 2.5+/-0.2V 3.3+/-0.3V UD: Under , status Selection Guide E0853E70 (Ver.7.0) Package 7 ES F 2K/32ms 60-FBGA 54-TSOP II , Rev. 1.8+/-0.1V 8K/64ms B Package 54-TSOP II Product Status Ask A75T A75I-E


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PDF E0853E70 240-pin 200-pin M01E0107 pc2-5300 ELPIDA PC2-3200 ECL120ACECN ELPIDA DDR2 elpida 1gb pc2 Elpida DDR2 SDRAM component EDE1108ABSE EDE1108AASE DDR2-533
2010 - MR4A16BC

Abstract: MR4A16BCMA35 tsop-ii tray 11.76 54-TSOP MR4A MR4A16B MR4A16BM TSOP 54 tray MR4A16BMYS3 BGA Package 0.35mm pitch
Text: MRAM 48-BGA 3.3 V 1Mx16 MRAM 48-BGA 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP Commercial Industrial Automotive Commercial Industrial Automotive Note 1: These , © 2010 13 Document Number: MR4A16B Rev. 5, 4/2010 MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP , , 2010 Added 54-TSOP package options. How to Reach Us: Home Page: www.everspin.com E-Mail


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PDF MR4A16B 20-years MR4A16B 216-bit 20-years. EST00352 MR4A16B, MR4A16BC MR4A16BCMA35 tsop-ii tray 11.76 54-TSOP MR4A MR4A16BM TSOP 54 tray MR4A16BMYS3 BGA Package 0.35mm pitch
2010 - Not Available

Abstract: No abstract text available
Text: 1Mx16 MRAM 48-BGA 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP 3.3 V 1Mx16 MRAM 54-TSOP , Document Number: MR4A16B Rev. 4, 3/2010 MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP D 54 28 A2 , 54-TSOP package options. How to Reach Us: Home Page: www.everspin.com E-Mail


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PDF MR4A16B 20-years MR4A16B 216-bit 20-years.
2010 - K9F2G08U0C

Abstract: K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0
Text: www.samsung.com/semi/dram SDRAM COMPONENTS Notes: Refresh Remarks 8Mx8 K4S640832N-LC75000 54-TSOP 133 4K EOL with no replacement 4Mx16 K4S641632N-LC(L)(75/60)000 54-TSOP 133/166 4K EOL with no replacement 16Mx8 K4S280832O-LC(L)75000 54-TSOP 133 4K 8Mx16 K4S281632O-LC(L)(75/60)000 54-TSOP 133/166 4K K4S560432N-LC(L)75000 54-TSOP 133 8K 32Mx8 K4S560832N-LC(L)75000 54-TSOP 133 8K K4S561632N-LC(L)(75/60)000 54-TSOP 133/166 8K


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PDF BR-10-ALL-001 K9F2G08U0C K9K8G08U0D K9ABG08U0A K4X2G323PC K9F4G08U0B-PCB0 K9F1G08U0C K9F2G08U0B K9F2G08U0B-PCB0 K9F1G08U0D-SCB0 K9WBG08U1M-PIB0
2011 - BGA OUTLINE DRAWING

Abstract: mr4a16bmys351
Text: 54-TSOP2 Commercial 3.3 V 1Mx16 MRAM 54-TSOP 2 Industrial 3.3 V 1Mx16 MRAM 54-TSOP2 AEC3.3 V 1Mx16 MRAM 54-TSOP2 T&R Commercial 3.3 V 1Mx16 MRAM 54-TSOP 2 T&R Industrial 3.3 V 1Mx16 MRAM 54-TSOP2 T&R , : MR4A16B Rev. 6, 10/2011 MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP2 D 54 28 A2 A1 A 2 3 , . Changed speed marking and timing specs to 35 ns part. Changed BGA package to 10 mm x 10mm Added 54-TSOP


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PDF MR4A16B 20-years AEC-Q100 MR4A16B 216-bit MR4A16B, EST352 BGA OUTLINE DRAWING mr4a16bmys351
2009 - K9F2G08U0B

Abstract: K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B
Text: Speed (Mbps) Refresh Remarks 8Mx8 K4S640832N-UC(75)000 54-TSOP 133 4K K-die changing to N-die 4Mx16 K4S641632N-UC(L)(75/60)000 54-TSOP 133/143/166 4K K-die changing to N-die 16Mx8 K4S280832K-UC(L)(75)000 54-TSOP 133 4K I-die changing to K-die 8Mx16 K4S281632K-UC(L)(75/60)000 54-TSOP 133/166 4K I-die changing to K-die K4S560432J-UC(L)(75)000 54-TSOP 133 8K H-die changing to J-die 32Mx8 K4S560832J-UC(L)(75)000


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PDF BR-09-ALL-001 K9F2G08U0B K9HCG08U1M-PCB0 K9NCG08U5M-PCB0 K9F1G08U0C K9F4G08U0B-PCB0 K9F2G08U0B-PCB0 K9F4G08U0B K9WBG08U1M K9F1G08U0C-PCB0 K9G4G08U0B
2012 - aec-q100 package

Abstract: MR4A16BCYS35R
Text: Parts Grade Temp Range Package 48-BGA Commercial 0 to +70 °C 54-TSOP 48-BGA Industrial -40 to +85°C 54-TSOP2 , MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP2 D 54 28 A2 A1 A 2 3 E1 E 1 0.20(0.008 , marking and timing specs to 35 ns part. Changed BGA package to 10 mm x 10mm Added 54-TSOP package options , View. Figure 2.1 Power Up and Power Down Timing redrawn. Added 54-TSOP illustrations. Reformatted all


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PDF MR4A16B AEC-Q100 MR4A16B 216-bit 1-877-347-MRAM EST00352 aec-q100 package MR4A16BCYS35R
2012 - Not Available

Abstract: No abstract text available
Text: Package 48-BGA Commercial 0 to +70 °C 54-TSOP 48-BGA Industrial -40 to +85°C 54-TSOP2 , Figure 5.2 54-TSOP2 A2 D A1 A 54 28 θ3 L1 E E1 θ2 c 27 1 ⊕0.20 , mm x 10mm 5 Apr 7, 2010 Added 54-TSOP package options. 6 Oct 7, 2011 Added , . Added 54-TSOP illustrations. Reformatted all parametric tables. Reformatted Table 4.1 Ordering Part


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PDF MR4A16B AEC-Q100 MR4A16B 216-bit EST00352
2009 - EDE2116ACBG

Abstract: EDE2116ACBG-1J-F EDE1116AGBG-1J-F DDR3-800D DDR3-800E ELPIDA lpddr EDE1116AGBG EDJ1108DBSE DDR3 layout EDE1032AGBG
Text: 4 166MHz(3-3-3) 133MHz(3-3-3) EDS2516AFTA 6B-E 75-E 3.3+/-0.3V 8K/64ms F 54-TSOP , -E 3.3+/-0.3V 4K/64ms H 54-TSOP II Ask 4M x 32 4 166MHz(3-3-3) 133MHz(3-3-3


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PDF E1454E90 240-pin M01E0706 EDE2116ACBG EDE2116ACBG-1J-F EDE1116AGBG-1J-F DDR3-800D DDR3-800E ELPIDA lpddr EDE1116AGBG EDJ1108DBSE DDR3 layout EDE1032AGBG
2010 - CY14B108N-BA25XI

Abstract: 54TSOP CY14B108L-BA25XI
Text: A18 A8 Figure 2. Pin Diagram - 44/54-Pin TSOP II 44-TSOP II 54-TSOP II (x8) NC [4 , to Case) Test Conditions 48-FBGA 44-TSOP II 54-TSOP II Test conditions follow standard test , values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns *B


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PDF CY14B108L CY14B108N 1024K 8/512K CY14B108L) CY14B108N) CY14B108L/CY14B108N CY14B108N-BA25XI 54TSOP CY14B108L-BA25XI
2012 - samsung ddr3 ram MTBF

Abstract: KLM2G1HE3F-B001 KLM4G1FE3B-B001 k4B2G1646 KLMAG KLMAG2GE4A-A001 K4B2G0446 klm8g KLM8G2FE3B-B001 K4H561638N
Text: Organization K4S560432N-LC(L)75 54-TSOP 133 8K EOL end of 2011 32Mx8 K4S560832N-LC(L)75 54-TSOP 133 8K EOL end of 2011 16Mx16 128Mb Notes: 8 K4S561632N-LC(L)(75/60) 54-TSOP 133/166 8K EOL end of 2011 16Mx8 K4S280832O-LC(L)75 54-TSOP 133 4K EOL end of 2011 8Mx16 K4S281632O-LC(L)(75/60) 54-TSOP 133/166 4K Voltage: 3.3V All


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PDF BR-12-ALL-001 samsung ddr3 ram MTBF KLM2G1HE3F-B001 KLM4G1FE3B-B001 k4B2G1646 KLMAG KLMAG2GE4A-A001 K4B2G0446 klm8g KLM8G2FE3B-B001 K4H561638N
2008 - PC2-6400

Abstract: DDR3-800D PC3-8500 DDR3-1066E pc2-5300 DDR3-1333G EDE5116AJBG EDD1232 ELPIDA DRAM selection guide ddr2 533
Text: Supply Voltage 3.3+/-0.3V 3.3+/-0.3V Refresh Cycles 8K/64ms 4K/64ms Rev. F H Package 54-TSOP II 54-TSOP


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PDF J1241E80 240-pin 204-pin x32/x16 512Mbit EDX5116ADSE 104-FBGA PC2-6400 DDR3-800D PC3-8500 DDR3-1066E pc2-5300 DDR3-1333G EDE5116AJBG EDD1232 ELPIDA DRAM selection guide ddr2 533
2009 - CY14B108N-BA20XIT

Abstract: 54-TSOP
Text: 2. Pin Diagram - 44/54-Pin TSOP II 44-TSOP II (x8) 54-TSOP II (x16) NC [4] NC A0 A1 A2 A3 , thermal impedance, in accordance with EIA/JESD51. Figure 4. AC Test Loads 48-FBGA 44-TSOP II 54-TSOP II , resistance values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns Added


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PDF CY14B108L, CY14B108N 1024K 8/512K CY14B108L/CY14B108N CY14B108N-BA20XIT 54-TSOP
2009 - cy14b108l-zs20xi

Abstract: CY14B108L-ZS45XI CY14B108N-BA25XI 164uf
Text: ) 54-TSOP II (x16) NC [4] NC A0 A1 A2 A3 A4 CE DQ0 DQ1 VCC VSS DQ2 DQ3 WE A5 A6 A7 A8 A9 NC NC 1 , Loads 48-FBGA 44-TSOP II 54-TSOP II 28.82 7.84 31.11 5.56 30.73 6.08 Unit °C/W °C/W JA JC 3.0V , -FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns Added maximum accumulated


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PDF CY14B108L, CY14B108N 1024K 8/512K CY14B108L/CY14B108N cy14b108l-zs20xi CY14B108L-ZS45XI CY14B108N-BA25XI 164uf
2009 - cy14b108n

Abstract: No abstract text available
Text: ] HSB NC A18 A8 A18 A8 Figure 2. Pin Diagram - 44/54-Pin TSOP II 44-TSOP II 54-TSOP , (Junction to Case) Test Conditions 48-FBGA 44-TSOP II 54-TSOP II Test conditions follow standard , resistance values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns *B


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PDF CY14B108L, CY14B108N 1024K 8/512K CY14B108L) CY14B108N) 48-ball 44-pin 54-pin cy14b108n
2009 - 54-pin TSOP thermal resistance junction to case

Abstract: No abstract text available
Text: 44/54-Pin TSOP II 44-TSOP II (x8) 54-TSOP II (x16) NC [4] NC A0 A1 A2 A3 A4 CE DQ0 DQ1 VCC , accordance with EIA/JESD51. Figure 4. AC Test Loads 48-FBGA 44-TSOP II 54-TSOP II 28.82 7.84 31.11 5.56 30.73 , resistance values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns Added


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PDF CY14B108L, CY14B108N 1024K 8/512K CY14B108L/CY14B108N 54-pin TSOP thermal resistance junction to case
2009 - TSOP II 54

Abstract: No abstract text available
Text: -Pin TSOP II 44-TSOP II 54-TSOP II (x8) NC [4] NC A0 A1 A2 A3 A4 CE DQ0 DQ1 VCC VSS , (Junction to Case) Test Conditions 48-FBGA 44-TSOP II 54-TSOP II Test conditions follow standard , industrial and Commercial temperature Grade Updated Thermal resistance values for 48-FBGA,44-TSOP II and 54-TSOP


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PDF CY14B108L, CY14B108N 1024K 8/512K CY14B108L) CY14B108N) 48-Ball 44/54-Pin CY14B108L/CY14B108N TSOP II 54
CPU-A13

Abstract: R32237 10uf,16v 10uf16v CTD12 CER-0805
Text: ViaTP VCC_3V MEM_CLK_OUT2 37 38 CKE CLK NC NC uPD4564163 54-TSOP II 4M x 16 3130-00194 3V 40 36 VCC_3V MEM_CLK_OUT2 37 38 CKE CLK NC NC uPD4564163 54-TSOP II 4M x 16 3130-00194 3V 40 36


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PDF MT9044 MT9042 16OMT9044 32MHZ CPU-A13 R32237 10uf,16v 10uf16v CTD12 CER-0805
2010 - Not Available

Abstract: No abstract text available
Text: 44/54-Pin TSOP II 44-TSOP II (x8) 54-TSOP II (x16) NC [4] NC A0 A1 A2 A3 A4 CE DQ0 DQ1 VCC , Loads 48-FBGA 44-TSOP II 54-TSOP II 28.82 7.84 31.11 5.56 30.73 6.08 Unit °C/W °C/W JA JC 3.0V , values for 48-FBGA,44-TSOP II and 54-TSOP II packages Changed tCW value from 16ns to 15ns Added maximum


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PDF CY14B108L CY14B108N 1024K 8/512K CY14B108L/CY14B108N
2014 - Not Available

Abstract: No abstract text available
Text: Temp Range Package 48-BGA Commercial 0 to +70 °C 54-TSOP2 48-BGA Industrial -40 to +85°C 54-TSOP2 AEC-Q100 Grade 1 1 -40 to +125 °C 54-TSOP2 Shipping Container Trays Tape , Figure 5.2 54-TSOP2 A2 D 54 A1 A 28 θ3 L1 E E1 θ2 c 27 1 ⊕0.20 , mm x 10mm 5 Apr 7, 2010 Added 54-TSOP package options. 6 Oct 7, 2011 Added AEC-Q100 , , 2013 Corrected the AEC Q-100 Grade A ordering option to be available in 54-TSOP2 , not 48BGA


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PDF MR4A16B AEC-Q100 MR4A16B 216-bit EST00352
2014 - MR4A16BCYS35

Abstract: No abstract text available
Text: -BGA Commercial 0 to +70 °C 54-TSOP2 48-BGA Industrial -40 to +85°C 54-TSOP2 Shipping Container , MR4A16B 5. MECHANICAL DRAWING Figure 5.2 54-TSOP2 A2 D 54 A1 A 28 θ3 L1 E E1 , specs to 35 ns part. Changed BGA package to 10 mm x 10mm 5 Apr 7, 2010 Added 54-TSOP package , in 54-TSOP2 , not 48BGA. 9.1 Jaunary 29, 2014 Corrected minor typo in Ordering PN table , View incorrectly labeled Bottom View. Figure 2.1 Power Up and Power Down Timing redrawn. Added 54-TSOP


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PDF MR4A16B MR4A16B 216-bit MR4A16BCYS35
2012 - Not Available

Abstract: No abstract text available
Text: Temp Range Package 48-BGA Commercial 0 to +70 °C 54-TSOP2 48-BGA Industrial -40 to +85°C 54-TSOP2 AEC-Q100 Grade 1 1 -40 to +125 °C 54-TSOP2 Shipping Container Trays Tape , Figure 5.2 54-TSOP2 A2 D 54 A1 A 28 θ3 L1 E E1 θ2 c 27 1 ⊕0.20 , mm x 10mm 5 Apr 7, 2010 Added 54-TSOP package options. 6 Oct 7, 2011 Added AEC-Q100 , Timing redrawn. Added 54-TSOP illustrations. Reformatted all parametric tables. Reformatted Table 4.1


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PDF MR4A16B AEC-Q100 MR4A16B 216-bit EST00352
2011 - K9HDG08U1A

Abstract: K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e hd204ui Ltn140at SAMSUNG HD502HJ K9F4G08U0B-PCB0
Text: K4S560832N-LC(L)75000 K4S561632N-LC(L)(75/60)000 K4S280832O-LC(L)75000 K4S281632O-LC(L)(75/60)000 54-TSOP 54-TSOP 54-TSOP 54-TSOP 54-TSOP 133 133 133/166 133 133/166 8K 8K 8K 4K 4K Banks


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PDF BR-11-ALL-001 K9HDG08U1A K9LCG08U0A k4g10325fe-hc04 KLM2G1DEHE-B101 K9WAG08U1B-PIB0 k9gag08u0e hd204ui Ltn140at SAMSUNG HD502HJ K9F4G08U0B-PCB0
176-PQFP

Abstract: RJ11 4/4 connector IBM POS schematics OCT8304 U11-U13 54TSOP PLCC20 MT92210 8DIP300 tdm telephone design RJ11
Text: POS FPGA External Memory MT92210 DSP MT92210 OCT8304 Device U11-U13 54TSOP II U17 , 100TQFP U6-U7 100TQFP Mezzanine FPGA U10-U12 54TSOP II J2 - Mezzanine Connector - 160 Pins


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PDF MT92210 176-PQFP RJ11 4/4 connector IBM POS schematics OCT8304 U11-U13 54TSOP PLCC20 MT92210 8DIP300 tdm telephone design RJ11
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