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5206C SL005 UNSHLD FLEX CABLE, 37COND, 24AWG, 30M 5206C SL005 ECAD Model
Distributors Part Package Stock Lead Time Min Order Qty 1 10 100 1,000 10,000
Farnell element14 5206C SL005 0 1 £1934.48 £1805.51 £1805.51 £1805.51 £1805.51 More Info

5206C SL005 datasheet (2)

Part ECAD Model Manufacturer Description Type PDF
5206C SL005 5206C SL005 ECAD Model Alpha Wire Cables, Wires - Multiple Conductor Cables - CABLE 37COND 24AWG SLATE 100" Original PDF
5206C-SL005 5206C-SL005 ECAD Model Alpha Wire Multiple Conductor Cables, Cables, Wires, 5206C SLATE 100 FT Original PDF

5206C SL005 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2013 - Not Available

Abstract: No abstract text available
Text: Alpha Wire | 711 Lidgerwood Avenue, Elizabeth, NJ 07207 Tel: 1-800-52 ALPHA (25742), Web: www.alphawire.com Customer Specification PART NO. 5206C Construction Diameters (In) 1) Component 1 37 X 1 COND a) Conductor 24 (7/32) AWG TC 0.024 b) Insulation 0.010" Wall, Nom. PVC, Semi , ) Print ALPHA WIRE-* P/N 5206C 37C 24 AWG XTRAGUARD(R) 1 (UL) TYPE CM 105C OR AWM 2343 VW-1 - , COMPLIANCE To Whom It May Concern: Alpha Wire Part Number: 5206C 5206C , RoHS-Compliant Commencing With 8


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PDF 5206C
2008 - DDR4 pcb layout guidelines

Abstract: ddr3 pcb design guide DDR3 pcb layout motherboard DDR3 pcb layout guide TPS51200DRCT TPS51200DRCR TPS51200 lpddr3 TPS51100 SON10
Text: resistance JP is 10.24°C/W. Junction to ambient thermal resistance JA is 52.06°C /W. RECOMMENDED OPERATING , , 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9 mm with four vias (0.33-mm via diameter


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PDF TPS51200 SLUS812 10-mA DDR4 pcb layout guidelines ddr3 pcb design guide DDR3 pcb layout motherboard DDR3 pcb layout guide TPS51200DRCT TPS51200DRCR TPS51200 lpddr3 TPS51100 SON10
2008 - DDR3 pcb layout guide

Abstract: M/sh 40/085/21/DDR3 layout DDR3 layout TI UDG-08034 TPS51200DRCT TPS51200 TPS51100 SON-10 TPS51200DRCR DDR4
Text: resistance JP is 10.24°C/W. Junction to ambient thermal resistance JA is 52.06°C /W. RECOMMENDED OPERATING , , 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9 mm with four vias (0.33-mm via diameter


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PDF TPS51200 SLUS812 10-mA DDR3 pcb layout guide M/sh 40/085/21/DDR3 layout DDR3 layout TI UDG-08034 TPS51200DRCT TPS51200 TPS51100 SON-10 TPS51200DRCR DDR4
2009 - Not Available

Abstract: No abstract text available
Text: to ambient thermal resistance JA is 52.06°C /W. THERMAL INFORMATION THERMAL METRIC (1) JA JCtop JB , heatspreader. The typical thermal resistance, JA, 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9


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PDF TPS51200-Q1 SLUS984A 10-mA
2008 - DDR4 pcb layout guidelines

Abstract: DDR3 pcb layout guide RFID Tracking Pad 770 tps51200drct DDR3 pcb layout DDR3 pcb layout motherboard TPS51200-EVM DDR4 DIMM SPD JEDEC ddr3 pcb design guide TPS51200DRCR
Text: resistance JP is 10.24°C/W. Junction to ambient thermal resistance JA is 52.06°C /W. RECOMMENDED OPERATING , , 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9 mm with four vias (0.33-mm via diameter


Original
PDF TPS51200 SLUS812 10-mA DDR4 pcb layout guidelines DDR3 pcb layout guide RFID Tracking Pad 770 tps51200drct DDR3 pcb layout DDR3 pcb layout motherboard TPS51200-EVM DDR4 DIMM SPD JEDEC ddr3 pcb design guide TPS51200DRCR
2009 - DDR3 layout

Abstract: DDR4 jedec
Text: , junction to thermal pad resistance JP is 10.24°C/W. Junction to ambient thermal resistance JA is 52.06°C /W , heatspreader. The typical thermal resistance, JA, 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9


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PDF TPS51200-Q1 SLUS984 10-mA DDR3 layout DDR4 jedec
2009 - JEDEC DDR4 pcb layout

Abstract: DDR4 pcb layout guidelines
Text: , junction to thermal pad resistance JP is 10.24°C/W. Junction to ambient thermal resistance JA is 52.06°C /W , heatspreader. The typical thermal resistance, JA, 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9


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PDF TPS51200-Q1 SLUS984 10-mA JEDEC DDR4 pcb layout DDR4 pcb layout guidelines
2009 - DDR3 pcb layout motherboard

Abstract: DDR3 pcb layout guide DDR4 pcb layout guidelines DDR3 pcb layout TPS51200-Q1 DDR3 pcb layout guidelines lpddr3 TPS51200-EVM
Text: to ambient thermal resistance JA is 52.06°C /W. THERMAL INFORMATION THERMAL METRIC (1) JA JCtop JB , heatspreader. The typical thermal resistance, JA, 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9


Original
PDF TPS51200-Q1 SLUS984A 10-mA DDR3 pcb layout motherboard DDR3 pcb layout guide DDR4 pcb layout guidelines DDR3 pcb layout TPS51200-Q1 DDR3 pcb layout guidelines lpddr3 TPS51200-EVM
2008 - DDR4 pcb layout guidelines

Abstract: TPS51200-EVM DDR3 pcb layout motherboard DDR4 spd DDR4 jedec DDR4 DIMM SPD JEDEC JESD8-15a UDG-08034 UDG-08023 JEDEC DDR4 pcb layout
Text: pad resistance JP is 10.24°C/W. Junction to ambient thermal resistance JA is 52.06°C /W. RECOMMENDED , ground trace acts as a both a heatsink and heatspreader. The typical thermal resistance, JA, 52.06°C /W


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PDF TPS51200 SLUS812 10-mA DDR4 pcb layout guidelines TPS51200-EVM DDR3 pcb layout motherboard DDR4 spd DDR4 jedec DDR4 DIMM SPD JEDEC JESD8-15a UDG-08034 UDG-08023 JEDEC DDR4 pcb layout
2008 - DDR3 pcb layout guide

Abstract: ddr3 ram TPS51200DRCR SON-10 TPS51100 TPS51200 TPS51200DRCT DDR3 pcb layout
Text: resistance JP is 10.24°C/W. Junction to ambient thermal resistance JA is 52.06°C /W. RECOMMENDED OPERATING , , 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9 mm with four vias (0.33-mm via diameter


Original
PDF TPS51200 SLUS812 10-mA DDR3 pcb layout guide ddr3 ram TPS51200DRCR SON-10 TPS51100 TPS51200 TPS51200DRCT DDR3 pcb layout
2009 - DDR4 pcb layout guidelines

Abstract: TPS51200-Q1 DDR4 "application note" DDR3 layout guidelines lpddr3 SLUS984A
Text: to ambient thermal resistance JA is 52.06°C /W. THERMAL INFORMATION THERMAL METRIC (1) JA JCtop JB , heatspreader. The typical thermal resistance, JA, 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9


Original
PDF TPS51200-Q1 SLUS984A 10-mA DDR4 pcb layout guidelines TPS51200-Q1 DDR4 "application note" DDR3 layout guidelines lpddr3 SLUS984A
2008 - DDR4 pcb layout guidelines

Abstract: DDR3 pcb layout motherboard DDR3 pcb layout DIMM DDR4 socket pcb layout design mobile DDR DDR4 DIMM SPD JEDEC DDR4 jedec
Text: pad resistance JP is 10.24°C/W. Junction to ambient thermal resistance JA is 52.06°C /W. RECOMMENDED , ground trace acts as a both a heatsink and heatspreader. The typical thermal resistance, JA, 52.06°C /W


Original
PDF TPS51200 SLUS812 10-mA DDR4 pcb layout guidelines DDR3 pcb layout motherboard DDR3 pcb layout DIMM DDR4 socket pcb layout design mobile DDR DDR4 DIMM SPD JEDEC DDR4 jedec
2008 - DDR4 pcb layout guidelines

Abstract: TPS51200DRCR JESD8-15a DDR4 jedec DIMM DDR4 socket UDG-08034 lpddr3 SON-10 TPS51100 TPS51200
Text: resistance JP is 10.24°C/W. Junction to ambient thermal resistance JA is 52.06°C /W. RECOMMENDED OPERATING , , 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9 mm with four vias (0.33-mm via diameter


Original
PDF TPS51200 SLUS812 10-mA DDR4 pcb layout guidelines TPS51200DRCR JESD8-15a DDR4 jedec DIMM DDR4 socket UDG-08034 lpddr3 SON-10 TPS51100 TPS51200
2009 - DDR4 pcb layout guidelines

Abstract: TPS51200QDRCRQ1 DDR4 DIMM SPD JEDEC Top side device marking of TPS51200 tps51100 marking TPS51100 TPS51200-Q1 tps51200 marking ddr3 termination lpddr3
Text: resistance JA is 52.06°C /W. RECOMMENDED OPERATING CONDITIONS PARAMETER Supply voltage EN, VLDOIN , typical thermal resistance, JA, 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9 mm with four


Original
PDF TPS51200-Q1 SLUS984 10-mA DDR4 pcb layout guidelines TPS51200QDRCRQ1 DDR4 DIMM SPD JEDEC Top side device marking of TPS51200 tps51100 marking TPS51100 TPS51200-Q1 tps51200 marking ddr3 termination lpddr3
2009 - DDR3 pcb layout motherboard

Abstract: DDR3 pcb layout DDR4 pcb layout guidelines TPS51200 DDR3 layout TI DDR4 DIMM SPD JEDEC ddr3 ram TPS51200-EVM DDR3 pcb layout guide GRM21BR60J475KA11L
Text: resistance JA is 52.06°C /W. RECOMMENDED OPERATING CONDITIONS PARAMETER Supply voltage EN, VLDOIN , typical thermal resistance, JA, 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9 mm with four


Original
PDF TPS51200-Q1 SLUS984 10-mA DDR3 pcb layout motherboard DDR3 pcb layout DDR4 pcb layout guidelines TPS51200 DDR3 layout TI DDR4 DIMM SPD JEDEC ddr3 ram TPS51200-EVM DDR3 pcb layout guide GRM21BR60J475KA11L
2009 - SLUS984A

Abstract: No abstract text available
Text: to ambient thermal resistance JA is 52.06°C /W. THERMAL INFORMATION THERMAL METRIC (1) JA JCtop JB , heatspreader. The typical thermal resistance, JA, 52.06°C /W, is achieved based on a land pattern of 3 mm × 1.9


Original
PDF TPS51200-Q1 SLUS984A 10-mA SLUS984A
55199

Abstract: awm style 2464 AWM 1015 AWG 20 awm style 2464 vw-1 24 awg awm style 2464 vw-1 2464 CSA AWM II A 24 AWG ft1 awm 2464 cable specification awm 2464 ft1 awm 20234 awm 2343
Text: 0.333 8,46 5204C 19 0.063 1,60 0.350 8,89 5206C XTRA·GUARD® 1 APPLICATIONS


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PDF
AWM 20234

Abstract: 2464 CSA AWM II A 24 AWG ft1 awm 2587 45272 computer 86012 IT700 5225C FIT-221
Text: ) Insulation thickness: 0.010 (0.25 mm) Part Number 5201C 5202C 5203C 5204C 5206C Conductors 7 12 15 19 37


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PDF 87603CY 87604CY 87605CY 87607CY 87703CY 87704CY 87705CY 87707CY AWM 20234 2464 CSA AWM II A 24 AWG ft1 awm 2587 45272 computer 86012 IT700 5225C FIT-221
AD0912UB-A7

Abstract: AD0812HB-C71GP AD2512HB-BV7 AD4512LX-D03 AB7505HX-HB3 AD0812XB-D91GP AD0612XB AD0812HB ad6505 AD0912
Text: No file text available


OCR Scan
PDF AD0912UB-A73GL 49/22i AD0912UB-A7 AD0812HB-C71GP AD2512HB-BV7 AD4512LX-D03 AB7505HX-HB3 AD0812XB-D91GP AD0612XB AD0812HB ad6505 AD0912
6Bs smd transistor

Abstract: e 156176 smd code 6Bs HDC-HE-16SS crimp tools kit 163356 163063 RSV 1.6 ZE 36 6BS SMD pcb connectors 163953
Text: No file text available


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PDF 24/RS DC-200 6Bs smd transistor e 156176 smd code 6Bs HDC-HE-16SS crimp tools kit 163356 163063 RSV 1.6 ZE 36 6BS SMD pcb connectors 163953
2013 - Not Available

Abstract: No abstract text available
Text: No file text available


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PDF 1000uF 7343H)
RG2012P-472-B-T5

Abstract: RG2012P-681-B-T5 rg2012p RG2012P-105-B-T5 RG2012P-22 RG2012P-242-B-T5 RG2012P-243-B-T5
Text: No file text available


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PDF RG2012PB-KIT RG2012PB RG2012P-101-B-T5 RG2012P-102-B-T5 RG2012P-103-B-T5 RG2012P-104-B-T5 RG2012P-105-B-T5 RG2012P-111-B-T5 RG2012P-112-B-T5 RG2012P-113-B-T5 RG2012P-472-B-T5 RG2012P-681-B-T5 rg2012p RG2012P-105-B-T5 RG2012P-22 RG2012P-242-B-T5 RG2012P-243-B-T5
2011 - ta035tcm105

Abstract: TA006TCM226 TA010TCM475 TA020TCM475 TA025TCM TA025TCM106
Text: No file text available


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PDF TA050TCM225 TA050TCM335 TA050TCM475 TA050TCM685 TA050TCM106 TA050TCM156 TA050TCM226 ta035tcm105 TA006TCM226 TA010TCM475 TA020TCM475 TA025TCM TA025TCM106
2008 - Not Available

Abstract: No abstract text available
Text: No file text available


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PDF
AD2512HB-BV7

Abstract: AD0524HB-G76 ad09 AD0612UB-A72GL AD0212 AD0812MB-D76 AD0412 AD0505M AD0612H BD0412MS-G70
Text: No file text available


OCR Scan
PDF AD0512HB-D71 QS-9000 0512X E/00740 AD2512HB-BV7 AD0524HB-G76 ad09 AD0612UB-A72GL AD0212 AD0812MB-D76 AD0412 AD0505M AD0612H BD0412MS-G70
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