The Datasheet Archive

4E320K482-BGA352 datasheet (1)

Part ECAD Model Manufacturer Description Type PDF
4E320K482-BGA352 4E320K482-BGA352 ECAD Model LightSpeed Semiconductor Module Based Array - 0.25 Micron Original PDF

4E320K482-BGA352 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1995 - CE51484

Abstract: micron 100 ball BGA BGA 256 PACKAGE power dissipation BGA256 CG51114 CE51364 BGA576 BGA352 BGA-576 CG51284
Text: CG46154 352 CE46194 400 BGA-256 (Type-B) BGA-352 (Type-B) BGA-352 (Type-C) BGA-416 (Type-C , Pads CE46533 208 CE46713 240 CE46833 256 CE46903 272 BGA-256 (Type-B) BGA-352 (Type-B) 3 BALL GRID ARRAY (BGA) PACKAGES ASIC TECHNOLOGY BRIEF PACKAGE DIMENSIONS BGA352 , INDEX PIN 1 5 BALL GRID ARRAY (BGA) PACKAGES ASIC TECHNOLOGY BRIEF BGA352 (Type-B


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PDF CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA 256 PACKAGE power dissipation BGA256 CG51114 CE51364 BGA576 BGA352 BGA-576 CG51284
2004 - Not Available

Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA352 package SOT581-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste SP SL occupied area SR solder resist detail X DIMENSIONS in mm P SL SP SR 1.27 0.600 0.500 0.750 Hx Hy 35.575 35.575 SOT581-1_fp PDF Â


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PDF BGA352 OT581-1 OT581-1
2001 - fujitsu fr-v

Abstract: BGA352 FR-500 VLIW
Text: Frequency - 266MHz 0.18µm CMOS Data Cache 16kB/4way Dual Port BGA352 MB93501 SPECIFICATIONS Process , Bus Pipelined Power Consumption 1.5W for core 2.0W for chip Package BGA352 Sample Now FR500


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PDF
1996 - BGA352

Abstract: sot581
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA352 : plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e w M y y1 C v M A AF AE AC AA W U R N L J G E C AD AB e Y V T e1 P M K H F D B A 2 1 4 3 6 5 7 8 10 12 14 16 18 20 22 24 26 9 11 13 15 17 19 21 23 25 X 0 10 20


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PDF BGA352: OT581-1 BGA352 sot581
LightSpeed Semiconductor

Abstract: lightspeed 4E14
Text: No file text available


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PDF 020799R3 LightSpeed Semiconductor lightspeed 4E14
1996 - BGA352

Abstract: MS-034 ED-7311-9A
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA352 : plastic ball grid array package; 352 balls; body 35 x 35 x 1.75 mm SOT581-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 y y1 C v M C A B b 1/2 e e w M C AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A e e2 1/2 e 1 shape 2 optional (4x) 3 5 4 7 6 9 11 13 15 17 19 21 23 25 8 10 12 14 16 18 20 22 24 26 X 0


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PDF BGA352: OT581-1 MS-034 ED-7311-9A BGA352 MS-034 ED-7311-9A
CG46533

Abstract: . rp 700 pc -24 CG46134 CG46833 SQFP100 CE46F20 CE46F40 CE46F50 CE46F60 CE46F70
Text: SQFP144 SQFP176 SQFP208 SQFP240 SQFP256 TQFP100 BGA256(B) BGA352 (B) BGA352 (C) NOTES: P: Plastic C


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PDF CG/CE46 CG/CE46 374175b 001173b CG46533 . rp 700 pc -24 CG46134 CG46833 SQFP100 CE46F20 CE46F40 CE46F50 CE46F60 CE46F70
130 nm CMOS standard cell library

Abstract: 130 nm CMOS standard cell library fujitsu 130 nm CMOS standard cell library ST
Text: SQFP208 SQFP 240 SQFP256 TQFP100 BGA256, (Type B) BGA352 , (Type B) BGA352 , (Type C) Notes: C = Ceramic P


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PDF 374T7Sfc. cl75b 130 nm CMOS standard cell library 130 nm CMOS standard cell library fujitsu 130 nm CMOS standard cell library ST
1994 - CG46533

Abstract: CG46713 CE46F10 BGA-35 CE46F70 CE46F60 CE46F50 CE46F40 CE46F30 CE46F20
Text: TQFP100 P BGA256(B) BGA352 (B) BGA352 (C) P P P P P P NOTES: P: Plastic C


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PDF CG/CE46 ASIC-DS-20084-11/95 CG46533 CG46713 CE46F10 BGA-35 CE46F70 CE46F60 CE46F50 CE46F40 CE46F30 CE46F20
CG46713

Abstract: CG46194 CG46533 CG46134 CG46104
Text: SQFP240 SQFP256 TQFP100 BGA256(B) BGA352 (B) BGA352 (C) P,C P P P P.C P P P P,C P P P P.C P


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PDF CG/CE46 CG46713 CG46194 CG46533 CG46134 CG46104
1996 - Gate level simulation without timing

Abstract: No abstract text available
Text: P P P P P P P P P P P P P BGA352 , (Type B) BGA352 , (Type C


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PDF ASIC-DS-20247-6/96 Gate level simulation without timing
2004 - Yamaichi ic354

Abstract: IC354 IC51-2084-1052-36 YAMAICHI ic234 IC234-1004-023P IC51-0484-806 648-0482211 IC51-1004-809 QP1-120050-272 IC234-1444-053P
Text: Electronics Co., Ltd. 2352-9228-01-1401 Takachiho Electric Co., Ltd. BGA-352 (841)-1.27-14 Enplas , Takachiho Electric Co., Ltd. BGA-352 (841)-1.27-19 BGA-352P-M05 Yamaichi Electronics Co., Ltd. BGA-352 (841)-1.27-14 BGA-352P-M03 NP276-40009.AC-06524 2352-9228-01-1401 352 Sensata


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PDF LGA-80P-M02 IC280-080-252 LGA-80P-M04 LGA-144P-M02 IC280-144-249 LGA-176P-M01 IC280-176-254 F0606 Yamaichi ic354 IC354 IC51-2084-1052-36 YAMAICHI ic234 IC234-1004-023P IC51-0484-806 648-0482211 IC51-1004-809 QP1-120050-272 IC234-1444-053P
1998 - str 6307 datasheet

Abstract: str 6307 STR 6307 POWER ic str 6307 data sheet str 6307 STR S 6307 D-71229 PAN 6595 str 6700 s 6307
Text: digital video output 3.3 V/5 V supply voltage External OSD data support Compact BGA352 package


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PDF TC81203TB TC81203TB 256-byte str 6307 datasheet str 6307 STR 6307 POWER ic str 6307 data sheet str 6307 STR S 6307 D-71229 PAN 6595 str 6700 s 6307
1998 - NEC VR4300

Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
Text: 2031308202255019002 BGA352 (841)1.2701 203520834200019200 2TBGA 576 868 696 39


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PDF 208QFP 225BGA 20down 56down 225BGA C13550JJ1V0PF00 NEC VR4300 JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
1999 - PQFP160 XILINX

Abstract: XC9536-44 XC9500 pinout tas t23 plcc44 pinout numbers PLCC84 package XC9500 Family XC95216 xc95288 xc9536
Text: XILINX PROGRAMMER QUALIFICATION SPECIFICATION XC9500 FAMILY Introduction This document pertains to the following devices and packages: device addresses are contained on the included Add.dat floppy disk. Signature String 9536 - PLCC44, CSP48, and VQFP44 9572 - PLCC44, PLCC84, PQFP100, TQFP100 95108 - PLCC84, PQFP100, TQFP100, PQ160 95144 - PQFP100, TQFP100, and PQFP100 95216 - PQFP160, HQFP208, and BGA352 95288 - HQFP208, and BGA352 The device programming and verification procedures are


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PDF XC9500 PLCC44, CSP48, VQFP44 PLCC84, PQFP100, TQFP100 PQFP160 XILINX XC9536-44 XC9500 pinout tas t23 plcc44 pinout numbers PLCC84 package XC9500 Family XC95216 xc95288 xc9536
1997 - PXB 4325

Abstract: Siemens SCR components Data Manual IBM0316169C-13 CRC-32 ITT102 8abm SCR Manual, siemens 23/SMD MARKING CODE UBR
Text: mode with resources of both directions usable BGA-352 · Up to 8192 connections per direction , per-VC queuing) Type Ordering Code PXB 4330 Semiconductor Group Package BGA-352 10 , Internal pointer supervision · Cell header protection function Technology · · · · 0.35 µ CMOS BGA-352


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PDF
vhdl code for DES algorithm

Abstract: CK50 case ck50 transistor 010C 3T125
Text: Package Device Family PFUs I/O ORCA 3T125-7- BGA352 82% used * 133 (169) * 1 Bitstream + , /28 August 2000 MESC_ST1 MACRO Data Sheet 1.9 FPGA Timing The ORCA 3T125-7- BGA352 respect


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PDF
C495 transistor

Abstract: r3272 MB2100H SN74LVC244A 14pin mc-156 32,768khz m1535d M1535 EG-2121CA-125 c5470 ah1 c541
Text: No file text available


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PDF VCC12V IRFL9110 ML310 C495 transistor r3272 MB2100H SN74LVC244A 14pin mc-156 32,768khz m1535d M1535 EG-2121CA-125 c5470 ah1 c541
M88E1111 ETHERNET

Abstract: c828 transistor datasheet M88E1111 M88E1111 datasheet c828 transistor transistor c828 XTAL_MA506 c828 datasheet c828 C641 transistor pinout
Text: No file text available


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PDF ML410 PCI164A FX100 220UF M88E1111 ETHERNET c828 transistor datasheet M88E1111 M88E1111 datasheet c828 transistor transistor c828 XTAL_MA506 c828 datasheet c828 C641 transistor pinout
1997 - 80386EX

Abstract: PXB 4325 386EX CRC-10
Text: insertion of OAM cells Type Ordering Code Package PXB 4340 Q67001-H9310 BGA-352 , one PXB 4340 AOP Technology · BGA-352 package · Expected power dissipation 2.2 W OAM Functions


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PDF T4340-XV11-O1-7600 80386EX PXB 4325 386EX CRC-10
1997 - PXB 4325

Abstract: PXB 4350 386EX 80386EX CRC-10
Text: insertion of OAM cells Type Ordering Code Package PXB 4340 Q67001-H9310 BGA-352 , one PXB 4340 AOP Technology · BGA-352 package · Expected power dissipation 2.2 W OAM Functions


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PDF T4340-XV11-O1-7600 PXB 4325 PXB 4350 386EX 80386EX CRC-10
2002 - LGA 1156 PIN OUT diagram

Abstract: QFP11T144-002 LGA 1156 Socket diagram Wells-CTI 36 lead Flat Pack 216-LQFP smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 Enplas drawings BGA136
Text: No file text available


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PDF
2000 - PQFP240

Abstract: PQFP208 lattice AMI 602 ZyMOS CHIP EXPRESS PQFP160 XILINX United Technologies Mostek Actel PQFP208 BGA432 l324
Text: , PQFP240, BGA352 PQFP208, PQFP240, BGA432 PQFP240, BGA432 PQFP240 BGA560 BGA560 BGA560 16


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PDF GA00011 CX3/00 PQFP240 PQFP208 lattice AMI 602 ZyMOS CHIP EXPRESS PQFP160 XILINX United Technologies Mostek Actel PQFP208 BGA432 l324
1998 - PXB 4325

Abstract: abm 4325 PXB 4310
Text: Boundary scan according to JTAG Technology · BGA-352 package · Extended temperature range from 0°C to


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PDF
1997 - PXB 4310

Abstract: PXB 4325 436AH T432
Text: (LIC) redundancy Boundary scan according to JTAG Technology · BGA-352 package · Extended


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PDF T4325-XV11-O1-7600 PXB 4310 PXB 4325 436AH T432
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