SC14448
Renesas Electronics Corporation
Fully integrated, monolithic DECT/CAT-iq processor ICs
92634-448HLF
Amphenol Communications Solutions
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 48 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
68464-448HLF
Amphenol Communications Solutions
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 48 Positions, 2.54 mm (0.100in) Pitch.
10153118-130KDLF
Amphenol Communications Solutions
WireLock®, 1.80mm Pitch, WTB connector, USCAR-2 V2 compatible, Right Angle - Through Hole, Type 30pin Header D Coding
10146175-130KLF
Amphenol Communications Solutions
Minitek MicroSpace™ 1.80mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Vertical, Header, Surface mount, 30 position
10153118-130KALF
Amphenol Communications Solutions
WireLock®, 1.80mm Pitch, WTB connector, USCAR-2 V2 compatible, Right Angle - Through Hole, Type 30pin Header A Coding