374624B00035 Search Results
374624B00035 Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Curated | Type | |
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374624B00035 |
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TAPE Attachment Method | Original |
374624B00035 Price and Stock
BOYD Laconia 374624B00035GHeat Sinks Heat Sink for Plastic BGA Packages, Black, 35x35x10mm, IC Pkg=35 x 35, Tape #35 |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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374624B00035G | 1,024 |
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374624B00035G |
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BOYD Laconia 374624B00035 |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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374624B00035 | 117 |
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Boyd Corporation 374624B00035GHeatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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374624B00035G | 930 |
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374624B00035G | 8 Weeks | 100 |
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