374124B00035G Search Results
374124B00035G Datasheets (1)
Part | ECAD Model | Manufacturer | Description | Curated | Type | |
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374124B00035G |
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Heat Sink; Package/Case:Ball Grid Array; Thermal Resistance:23.4 C/W; Mounting Type:Tape; Length:23mm; Height:18mm; Width:23mm; Body Material:Plastic; Color:Black; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes | Original |
374124B00035G Price and Stock
BOYD Laconia 374124B00035GHEATSINK BGA W/ADHESIVE TAPE |
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374124B00035G | Bulk | 1 |
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374124B00035G |
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374124B00035G |
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Boyd Corporation 374124B00035GHeatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm |
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Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
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374124B00035G | 560 |
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374124B00035G | Each | 3,088 | 1 |
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