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Part Manufacturer Description Datasheet Download Buy Part
SP35W000000 APEM Inc Pushbutton Switch, SPDT, On-(on), Latched And Momentary, 0.1A, 30VDC, Solder Terminal, Through Hole-right Angle,
14-35W000-10 Aries Electronics Inc IC Socket, SOWIC14-DIP14, 14 Contact(s), ROHS COMPLIANT
SP35W00000026 APEM Inc SWITCH PB SNP-ACT SELD
24-35W000-10 Aries Electronics Inc IC Socket, SOWIC24-DIP24, 24 Contact(s), ROHS COMPLIANT
16-35W000-11-RC-P (220 UP) Aries Electronics Inc SOCKET ADAPT SOIC-W TO 16DIP 0.3
18-35W000-10-P Aries Electronics Inc SOCKET ADAPT SOIC-W TO 18DIP 0.3
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  You can filter table by choosing multiple options from dropdownShowing 12 results of 12
Part Manufacturer Supplier Stock Best Price Price Each Buy Part
14-35W000-10 Aries Electronics Inc Future Electronics - $10.88 $10.64
16-35W000-11-RC Aries Electronics Inc Future Electronics - $16.13 $12.90
16-35W000-11-RC-P Aries Electronics Inc Future Electronics - $16.49 $12.87
18-35W000-10 Aries Electronics Inc Future Electronics - $9.97 $9.97
18-35W000-10 Aries Electronics Inc Heilind Electronics 4 $12.11 $12.11
18-35W000-10 Aries Electronics Inc Interstate Connecting Components 4 $12.11 $12.11
20-35W000-10 Aries Electronics Inc Future Electronics - $15.17 $10.62
28-35W000-10 Aries Electronics Inc Future Electronics - $12.02 $11.17
28-35W000-11-RC Aries Electronics Inc Future Electronics - $20.51 $14.35
SP35W000000 APEM Inc PUI 49 - -
SP35W000000 APEM Inc Master Electronics 45 $9.12 $5.92
SP35W000007 APEM Inc Bristol Electronics 30 - -

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35W000 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2006 - Not Available

Abstract: No abstract text available
Text: Series 35W000 SOWIC to DIP Adapters - 14/28Pins FEATURES: · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR-4 with 1 oz. Copper traces, both sides. · Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85. · Pin plating is 200 [5.08m] min.Tin per MIL-T-10727 Type 1 or Tin/Lead 90/100 MIL-P


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PDF 35W000 14/28Pins C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290.
ASTM-B16-85

Abstract: No abstract text available
Text: Series 35W000 SOWIC to DIP Adapters - 14/28Pins FEATURES: · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR-4 with 1 oz. Copper traces, both sides. · Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85. · Pin plating is 200µ [5.08µm] min.93/7 Tin/Lead per MILP-81728 over 100µ


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PDF 35W000 14/28Pins C36000 ASTM-B16-85. MILP-81728 QQ-N-290. ASTM-B16-85
2009 - IS410

Abstract: AMS-QQ-N-290 AMS-QQ-N-29
Text: Series 35W000 RoHS/WEEE-Compliant SOWIC-to-DIP 14- to 28-Pin Adapter FEATURES ·Pb-Free RoHS/WEEE-Compliant ·A cost-effective means of upgrading to SOIC without changing your PCB layout ·Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16], or 0.600 [15.24] centers. GENERAL SPECIFICATIONS ·BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101A/26 with 1-oz. Cu traces, both sides finished with ENIG (Immersion Au over electroless Ni) ·PINS: Brass 360 1/2-hard per


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PDF 35W000 28-Pin IS410 101A/26 C36000, B16/B16M MIL-G-45204 AMS-QQ-N-290 18-35W000-11-RC 20-35W000-11-RC AMS-QQ-N-290 AMS-QQ-N-29
2012 - 18007RC

Abstract: No abstract text available
Text: Series 35W000 RoHS/WEEE-Compliant SOWIC-to-DIP 14- to 28-Pin Adapter FEATURES · Pb-Free RoHS/WEEE-Compliant · A cost-effective means of upgrading to SOIC without changing your PCB layout · Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16], or 0.600 [15.24] centers. GENERAL SPECIFICATIONS · BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101A/26 with 1-oz. Cu traces, both sides finished with ENIG (Immersion Au over electroless Ni) · PINS: Brass 360 1/2-hard per


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PDF 35W000 28-Pin IS410 101A/26 C36000, B16/B16M MIL-G-45204 AMS-QQ-N-290 18007RC
2010 - 18007

Abstract: SOWIC-to-DIP Adapter
Text: Series 35W000 SOWIC-to-DIP Adapter ­ 14/28 Pins FEATURES · A cost-effective means of upgrading to SOIC without changing your PCB layout · Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16] or 0.600 [15.24] centers GENERAL SPECIFICATIONS · BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides · PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 · PIN PLATING: Sn/Pb 93/7 per ASTM B 545 over 100 [2.54] Ni per SAE AMSQQ-N-290 · OPERATING TEMPERATURE: 221°F [105


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PDF 35W000 C36000 ASTM-B16-00 AMSQQ-N-290 18007 SOWIC-to-DIP Adapter
2007 - Not Available

Abstract: No abstract text available
Text: Series 35W000 SOWIC to DIP Adapters - 14/28Pins FEATURES: · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR-4 with 1 oz. Copper traces, both sides. · Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-00. · Pin plating is 200 [5.08m] min.Tin per ASTM B 545 Type 1 or Tin/Lead 93/7 per ASTM B 545


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PDF 35W000 14/28Pins C36000 ASTM-B16-00. SAE-AMS-QQ-N-290.
2004 - ASTM-B16-85

Abstract: MIL-T-10727
Text: Series 35W000 SOWIC to DIP Adapters - 14/28Pins FEATURES: · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR-4 with 1 oz. Copper traces, both sides. · Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85. · Pin plating is 200µ [5.08µm] min.Tin per MIL-T-10727 Type 1 or Tin/Lead 90/100 MIL-P


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PDF 35W000 14/28Pins C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. ASTM-B16-85 MIL-T-10727
2003 - ASTM-B16-85

Abstract: MIL-T-10727
Text: Series 35W000 SOWIC to DIP Adapters - 14/28Pins FEATURES: · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR-4 with 1 oz. Copper traces, both sides. · Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85. · Pin plating is 200µ [5.08µm] min.Tin per MIL-T-10727 Type 1 or Tin/Lead 90/100 MIL-P


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PDF 35W000 14/28Pins C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. ASTM-B16-85 MIL-T-10727
Not Available

Abstract: No abstract text available
Text: Series 35W000 SOWIC to DIP Adapters - 16/24 Pins FEATURES: · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR-4 with 1 oz. Copper traces, both sides. · Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85. · Pin plating is 200µ [5.08µm] min.93/7 Tin/Lead per MILP-81728 over 100µ [2.54µm] min. Nickel


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PDF 35W000 C36000 ASTM-B16-85. MILP-81728 QQ-N-290.
2008 - Not Available

Abstract: No abstract text available
Text: Series 35W000 SOWIC-to-DIP Adapters ­ 14/28 Pins FEATURES ·A cost effective means of upgrading to SOIC without changing your PCB layout · Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for adapters on 0.400 [10.16], or 0.600 [15.24] centers SPECIFICATIONS ·Board Material: 0.062 thick FR-4 with 1-oz. Copper traces, both sides ·Pins: Brass Alloy 360 1/2-hard per UNS C36000 ASTM-B16-00 ·Pin Plating: 200 [5.08] min. Tin per ASTM B 545 Type 1 or Tin/Lead 93/7 per ASTM B 545 over 100 [2.54


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PDF 35W000 C36000 ASTM-B16-00 SAE-AMS-QQ-N-290
2009 - Not Available

Abstract: No abstract text available
Text: Series 35W000 SOWIC-to-DIP Adapter ­ 14/28 Pins FEATURES ·A cost-effective means of upgrading to SOIC without changing your PCB layout · Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16] or 0.600 [15.24] centers GENERAL SPECIFICATIONS ·BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides ·PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 ·PIN PLATING: 200 [5.08] min. Sn per ASTM B 545 Type 1 or Sn/Pb 93/7 per ASTM B 545 over 100 [2.54] Ni per SAE


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PDF 35W000 C36000 ASTM-B16-00 AMS-QQ-N-290
2010 - 24-SOIC

Abstract: 24-35W000-10
Text: Series 35W000 SOWIC-to-DIP Adapter ­ 14/28 Pins FEATURES ·A cost-effective means of upgrading to SOIC without changing your PCB layout · Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16] or 0.600 [15.24] centers GENERAL SPECIFICATIONS ·BOARD MATERIAL: 0.062 thick FR-4 with 1-oz. Cu traces, both sides ·PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 ·PIN PLATING: Sn/Pb 93/7 per ASTM B 545 over 100 [2.54] Ni per SAE AMSQQ-N-290 ·OPERATING TEMPERATURE


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PDF 35W000 C36000 ASTM-B16-00 AMSQQ-N-290 18-35W000-10 20-35W000-10 24-35W000-10 28-35W000-10 24-SOIC 24-35W000-10
2012 - Not Available

Abstract: No abstract text available
Text: Series 35W000 RoHS/WEEE-Compliant SOWIC-to-DIP 14- to 28-Pin Adapter FEATURES ·Pb-Free RoHS/WEEE-Compliant ·A cost-effective means of upgrading to SOIC without changing your PCB layout ·Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adapters on 0.400 [10.16], or 0.600 [15.24] centers. GENERAL SPECIFICATIONS ·BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101A/26 with 1-oz. Cu traces, both sides finished with ENIG (Immersion Au over electroless Ni) ·PINS: Brass 360 1/2-hard per


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PDF 35W000 28-Pin IS410 101A/26 C36000, B16/B16M MIL-G-45204 AMS-QQ-N-290 18007RC
ht 13003

Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e 87c196 HT 1000-4 amp 12011p
Text: .pdf Series 35W000 SOWIC-to-DIP Adapter ­ www.arieselec.com/products/18007.pdf Series 652000/653000 PLCC-to-DIP Adapter ­ www.arieselec.com/products/18014.pdf Series 35W000-11-RC SOWIC-to-DIP Adapter ­


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PDF com/products/18012 com/products/18003 com/products/18013 350000-HT com/products/18005 com/products/18013RC 35W000 com/products/18007 com/products/18014 35W000-11-RC ht 13003 LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e 87c196 HT 1000-4 amp 12011p
2006 - Not Available

Abstract: No abstract text available
Text: Series 35W000-11-RC SOWIC to DIP Adapters - 14/28Pins FEATURES: · Lead Free RoHS/ WEEE Compliant. · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR406 or IS410 per IPC4101A/26 with 1 oz. Copper traces, both sides finished with ENIG (Immersion Gold over Electroless Nickel.) · Pins are Brass Alloy 360 1/2 hard


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PDF 35W000-11-RC 14/28Pins FR406 IS410 IPC4101A/26 C36000 ASTMB16-00. MIL-G-45204 SAE-AMS-QQ-N-290. 18007RC
2006 - Not Available

Abstract: No abstract text available
Text: Series 35W000-11-RC SOWIC to DIP Adapters - 14/28Pins FEATURES: · Lead Free RoHS/ WEEE Compliant. · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR406 or IS410 per IPC4101A/26 with 1 oz. Copper traces, both sides. · Pins are Brass Alloy 360 1/2 hard per UNS C36000 ASTM-B16-85. · Pin plating is 10u" Min Gold


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PDF 35W000-11-RC 14/28Pins FR406 IS410 IPC4101A/26 C36000 ASTM-B16-85. MIL-G-4524 QQ-N-290. 18007RC
2006 - Not Available

Abstract: No abstract text available
Text: Series 35W000-11-RC SOWIC to DIP Adapters - 14/28Pins FEATURES: · Lead Free RoHS/ WEEE Compliant. · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR406 or IS410 per IPC4101A/26 with 1 oz. Copper traces, both sides finished with ENIG (Immersion Gold over Electroless Nickel.) · Pins are Brass Alloy 360 1/2 hard


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PDF 35W000-11-RC 14/28Pins FR406 IS410 IPC4101A/26 C36000 ASTMB16-00. MIL-G-45204 SAE-AMS-QQ-N-290. 18007RC
2007 - Not Available

Abstract: No abstract text available
Text: Series 35W000-11-RC SOWIC to DIP Adapters - 14/28Pins FEATURES: · Lead Free RoHS/ WEEE Compliant. · A cost effective means of upgrading to SOIC without changing your PCB layout. · Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: · Board material is .062 thick FR406 or IS410 per IPC4101A/26 with 1 oz. Copper traces, both sides finished with ENIG (Immersion Gold over Electroless Nickel.) · Pins are Brass Alloy 360 1/2 hard


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PDF 35W000-11-RC 14/28Pins FR406 IS410 IPC4101A/26 C36000 ASTMB16-00. MIL-G-45204 SAE-AMS-QQ-N-290. 18007RC
2008 - Not Available

Abstract: No abstract text available
Text: Series 35W000-11-RC SOWIC-to-DIP Adaptors ­ 14/28 Pins FEATURES ·Lead-free RoHS/WEEE Compliant ·A cost-effective means of upgrading to SOIC without changing your PCB layout ·Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adaptors on 0.400 [10.16], or 0.600 [15.24] centers SPECIFICATIONS ·Board Material: 0.062 thick FR406 or IS410 per IPC4101A/26 with 1-oz. Copper traces, both sides finished with ENIG (Immersion Gold over Electroless Nickel) ·Pins: Brass Alloy 360 1/2-hard per UNS C36000


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PDF 35W000-11-RC FR406 IS410 IPC4101A/26 C36000 ASTM-B16-00 MIL-G-45204 AMS-QQ-N-290 Temperatur00 18007RC
2006 - Not Available

Abstract: No abstract text available
Text: Series 35W000-11-RC SOWIC to DIP Adapters - 14/28Pins FEATURES: • Lead Free RoHS/ WEEE Compliant. • A cost effective means of upgrading to SOIC without changing your PCB layout. • Available on .300 [7.62] centers. Consult Data Sheet No. 18011 for adapters on .400 [10.16], or .600 [15.24] centers. SPECIFICATIONS: • Board material is .062 thick FR406 or IS410 per IPC4101A/26 with 1 oz. Copper traces, both sides finished with ENIG (Immersion Gold over Electroless Nickel.) • Pins are


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PDF 35W000-11-RC 14/28Pins FR406 IS410 IPC4101A/26 C36000 ASTMB16-00. MIL-G-45204 SAE-AMS-QQ-N-290. 18007RC
2008 - Not Available

Abstract: No abstract text available
Text: Series 35W000-11-RC SOWIC-to-DIP Adaptors ­ 14/28 Pins FEATURES ·Lead-free RoHS/WEEE Compliant ·A cost-effective means of upgrading to SOIC without changing your PCB layout ·Available on 0.300 [7.62] centers. Consult Data Sheet 18011 for Adaptors on 0.400 [10.16], or 0.600 [15.24] centers SPECIFICATIONS ·Board Material: 0.062 thick FR406 or IS410 per IPC4101A/26 with 1-oz. Copper traces, both sides finished with ENIG (Immersion Gold over Electroless Nickel) ·Pins: Brass Alloy 360 1/2-hard per UNS C36000


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PDF 35W000-11-RC FR406 IS410 IPC4101A/26 C36000 ASTM-B16-00 MIL-G-45204 AMS-QQ-N-290 Temperatur00 18007RC
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