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Part ECAD Model Manufacturer Description Datasheet Download Buy Part
0580030000 0580030000 ECAD Model Molex CONNECTOR GUIDE PIN
0621001000 0621001000 ECAD Model Molex HDM BACKPLANE SINGLE PIN
0638000116 0638000116 ECAD Model Molex GUIDE PIN DRAG FRAME
0503988000 0503988000 ECAD Model Molex 2.5 W-W CRIMP PIN (CHAIN)
0740760001 0740760001 ECAD Model Molex CONN GUIDE PIN FREE STANDING
0428244002 0428244002 ECAD Model Molex CONN PIN TERM 12AWG TIN

352-PIN Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
RTAX1000S

Abstract: RTAX250S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
Text: 339 338 337 336 335 334 333 332 331 352 351 350 349 352-Pin CQFP Pin 1 1 2 3 , 220 219 218 217 216 215 352-Pin CQFP 173 174 175 176 127 128 129 130 131 132 133 134 135 180 179 178 177 89 90 91 92 85 86 87 88 Figure 3-2 · 352-Pin CQFP Note: The 352-pin CQFP pin assignments for both RTAX1000S and RTAX2000S are compatible except for the , devices. 3- 4 A d v an c e d v0 . 5 RTAX-S RadTolerant FPGAs 352-Pin CQFP 352-Pin CQFP


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PDF 208-Pin RTAX250S IO43PB2F2 IO76PB5F5/CLKGP IO02NB0F0 IO44NB2F2 RTAX1000S RTAX2000S CCGA CQFP 208 RTAX2000 rtax2000* cqfp 292 CCGA RTAX-S 624 CCGA
RTAX2000S

Abstract: RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
Text: 352-Pin CQFP Pin 1 1 2 3 4 264 263 262 261 Ceramic Tie Bar 41 42 43 44 45 46 47 48 49 223 222 221 220 219 218 217 216 215 352-Pin CQFP 173 174 175 176 , Figure 3-3 · 352-Pin CQFP Note: The 352-pin CQFP pin assignments for RTAX250S/SL, RTAX1000S/SL and , :// . v5.4 3-9 RTAX-S/SL RadTolerant FPGAs 352-Pin CQFP 352-Pin CQFP RTAX250S/SL Function 352-Pin CQFP Bank 0 RTAX250S/SL Function Pin


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PDF 208-Pin RTAX250S/SL IO43PB2F2 IO76PB5F5/CLKGP IO02NB0F0 RTAX2000S RTAX1000S-SL cga 624 RTAX1000S RTAX250S RTAX2000 624 CCGA SL D8 E26 RTAX4000S CCGA
2012 - DIODE SG 61A

Abstract: mosfet 352 STK681-332-E stk681-332 BPR38CFR10J stk681
Text: +0.05 -0.05 Lead Frame 2/32 APPLICATION NOTE Pin Assignment STK681-332-E STK681-332/352 , Vdf(High side) Vdf(Low side) STK681-332-E/352-E FAULT output voltage 0.6 Pin 13 Output voltage V , NOTE Pin Functions Pin Name IN1 Pin No. 16 Pin Function Input pin for turning F2 and F4 ON and OFF At low level F2: ON and F4: OFF; at high level, F2: OFF and F4: ON Input pin for turning F1 and F3 ON and OFF At low level F1: ON and F3: OFF; at high level, F1: OFF and F3: ON Pin for turning F3 and F4 ON


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PDF ANDSTK681332E352E STK681-332-E STK681-352-E STK681-352-E DIODE SG 61A mosfet 352 stk681-332 BPR38CFR10J stk681
1996 - XC95216-20PQG160I

Abstract: XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
Text: 0 XC95216 In-System Programmable CPLD R 0 5 Note: The 352-pin BGA packages are , recommends replacing XC95216 in 352-pin BGA packages with XC95288 devices in 352-pin BGA packages in all , recomendations for the XC95216 352-pin BGA CPLD. · · 10 ns pin-to-pin logic delays on all pins fCNT to , one XC9500 concurrently Available 160- pin PQFP, 352-pin BGA, and 208- pin HQFP packages (Note: 352-pin , . Global control pin . 2. 352-pin BGA package is being discontinued for the XC95216. See XCN07010 for


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PDF XC95216 352-pin XC95288 XCN07010 352-pin XC95216-20PQG160I XC95216-15PQ160I 471 E25 XC95216 Family XC95216-10PQ160C XC95216-10PQ160I XC95216-15PQG160C XC95216-15PQG160I XC95216-10PQG160I XC9500
1997 - T0-50

Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M01 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA (BGA-352P-M01) 352-pin plastic BGA (BGA-352P-M01) 35.00±0.20(1.378±.008)SQ 31.75±0.20(1.250±.008) INDEX C1.0 (.039) 1.27±0.20 (.050±.008) 0.635(.025) 1.625(.064) 1.625(.064) 1.27±0.20 (.050±.008) 31.75±0.20 (1.250±.008) 0.635 (.025) 352-Ø0.75±0.15 (352-Ø.030±.006) C 1996 FUJITSU LIMITED BGA352002SC-1-1 3.20±0.20 (.126±.008) 0.75±0.10


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PDF BGA-352P-M01 50mil 352-pin BGA-352P-M01) BGA352002SC-1-1 T0-50
1999 - Not Available

Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M04) 352-pin plastic BGA (BGA-352P-M04) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008) B 1.27±0.20 (.050±.008) 12.88(.507) [SR OPEN AREA] 1.625(.064) 0.635(.025) 1.625(.064) via 1.27±0.20 (.050±.008) A 31.75±0.20 (1.250±.008) 0.635 (.025) Au AREA


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PDF BGA-352P-M04 352-pin BGA-352P-M04) BGA352005SC-3-1
1999 - Not Available

Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M05 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M05) 352-pin plastic BGA (BGA-352P-M05) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008) 1.625(.064) B 25.50±0.10(1.004±.004)SQ 1.27±0.20 (.050±.008) 0.635(.025) 1.625(.064) 1.27±0.20 (.050±.008) A 31.75±0.20 (1.250±.008) 0.635 (.025) INDEX C1.0(.039) S


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PDF BGA-352P-M05 352-pin BGA-352P-M05) BGA352006SC-1-1
1997 - BGA-35

Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M05 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M05) 352-pin plastic BGA (BGA-352P-M05) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008) 1.625(.064) B 25.50±0.10(1.004±.004)SQ 1.27±0.20 (.050±.008) 0.635(.025) 1.625(.064) 1.27±0.20 (.050±.008) A 31.75±0.20 (1.250±.008) 0.635


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PDF BGA-352P-M05 352-pin BGA-352P-M05) BGA352006SC-1-1 BGA-35
AX125

Abstract: FBGA 896 896-Pin
Text: Axcelerator Family FPGAs Package Pin Assignments 180- Pin CSP A1 Ball Pad Corner 14 13 , Figure 3-1 · 180- Pin CSP (Bottom View) Note For Package Manufacturing and Environmental information , Axcelerator Family FPGAs 180- Pin CSP 180- Pin CSP AX125 Function 180- Pin CSP Bank 0 AX125 Function Pin Number AX125 Function Pin Number IO32NB3F3 Pin Number H11 IO59NB5F5 N2 , M3 GND E5 v2.8 Axcelerator Family FPGAs 180- Pin CSP 180- Pin CSP AX125 Function


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PDF 180-Pin AX125 IO32NB3F3 IO59NB5F5 FBGA 896 896-Pin
1997 - BGA-35

Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M01 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M01) 352-pin plastic BGA (BGA-352P-M01) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008) 1.625(.064) B 25.50±0.10(1.004±.004)SQ 1.27±0.20 (.050±.008) 0.635(.025) 1.625(.064) 1.27±0.20 (.050±.008) A 31.75±0.20 (1.250±.008) 0.635


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PDF BGA-352P-M01 352-pin BGA-352P-M01) BGA352002SC-2-2 BGA-35
1997 - 352-pin

Abstract: led matrix circuits
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M04 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M04) 352-pin plastic BGA (BGA-352P-M04) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008) B 1.27±0.20 (.050±.008) 12.88(.507) [SR OPEN AREA] 1.625(.064) 0.635(.025) 1.625(.064) via 1.27±0.20 (.050±.008) A 31.75±0.20 (1.250±.008


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PDF BGA-352P-M04 352-pin BGA-352P-M04) BGA352005SC-3-1 led matrix circuits
1999 - Not Available

Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M01 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M01) 352-pin plastic BGA (BGA-352P-M01) 35.00±0.10(1.378±.004)SQ 31.75±0.20(1.250±.008) 1.625(.064) B 25.50±0.10(1.004±.004)SQ 1.27±0.20 (.050±.008) 0.635(.025) 1.625(.064) 1.27±0.20 (.050±.008) A 31.75±0.20 (1.250±.008) 0.635 (.025) INDEX C1.0(.039) S


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PDF BGA-352P-M01 352-pin BGA-352P-M01) BGA352002SC-2-2
1997 - BGA-352

Abstract: 352-PIN
Text: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M02 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA (BGA-352P-M02) 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008) 0.60±0.10 (.024±.004) 31.75±0.20(1.250±.008) 1.27±0.20 (.050±.008) 0.15(.006) INDEX C 1996 FUJITSU LIMITED BGA352003SC-1-1 Ø0.75±0.15(Ø.030±.006) 1PIN Dimensions in mm (inches). Fujitsu


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PDF BGA-352P-M02 50mil 352-pin BGA-352P-M02) BGA352003SC-1-1 BGA-352
729-Pin

Abstract: Axcelerator FPGAs AX125 IO126PB3F11 AG18 FBGA 896 896-Pin Axcelerator Family FPGAs
Text: Axcelerator Family FPGAs Package Pin Assignments 180- Pin CSP A1 Ball Pad Corner 14 13 , Figure 3-1 · 180- Pin CSP (Bottom View) Note For Package Manufacturing and Environmental information , Axcelerator Family FPGAs 180- Pin CSP 180- Pin CSP AX125 Function 180- Pin CSP Bank 0 AX125 Function Pin Number AX125 Function Pin Number IO32NB3F3 Pin Number H11 IO59NB5F5 N2 , M3 GND E5 v2.7 Axcelerator Family FPGAs 180- Pin CSP 180- Pin CSP AX125 Function


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PDF 180-Pin AX125 IO32NB3F3 IO59NB5F5 729-Pin Axcelerator FPGAs IO126PB3F11 AG18 FBGA 896 896-Pin Axcelerator Family FPGAs
CCGA

Abstract: 896-Pin 624 CCGA AD 149 AE9 FBGA 63 AX125 FBGA 896
Text: Axcelerator Family FPGAs Package Pin Assignments 180- Pin CSP A1 Ball Pad Corner 14 13 , Figure 3-1 · 180- Pin CSP (Bottom View) v2.3 3-1 Axcelerator Family FPGAs 180- Pin CSP 180- Pin CSP AX125 Function 180- Pin CSP Bank 0 AX125 Function Pin Number AX125 Function Pin Number IO32NB3F3 Pin Number H11 IO59NB5F5 N2 IO59PB5F5 P2 IO00NB0F0 B3 , GND E5 v2.3 Axcelerator Family FPGAs 180- Pin CSP 180- Pin CSP AX125 Function Pin


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PDF 180-Pin AX125 IO32NB3F3 IO59NB5F5 CCGA 896-Pin 624 CCGA AD 149 AE9 FBGA 63 FBGA 896
1998 - xc95216-20pq160c

Abstract: No abstract text available
Text: Available 160- pin PQFP, 352-pin BGA, and 208- pin HQFP packages (Note: 352-pin BGA packages are being , 432 Notes: 1. Global control pin . 2. 352-pin BGA package is being discontinued for the XC95216. See , 222 219 216 Notes: 1. Global control pin . 2. 352-pin BGA package is being discontinued for the , 15 12 9 6 3 0 Notes: 1. Global control pin . 2. 352-pin BGA package is being discontinued for the , Commercial: TA = 0° to +70°C; I = Industrial: TA = ­40° to +85°C 2. 352-pin BGA package is being discontinued


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PDF XC95216 DS068 36V18 BG352 BGG252 XCN11010 352-pin XCN07010 xc95216-20pq160c
1999 - BGA-352P-M03

Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M03 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M03) 352-pin plastic BGA (BGA-352P-M03) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008) 0.60±0.10 (.024±.004) 31.75±0.20(1.250±.008) 1.27±0.20 (.050±.008) 0.15(.006) INDEX C 1996 FUJITSU LIMITED BGA352004SC-1-1 Ø0.75±0.15(Ø


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PDF BGA-352P-M03 352-pin BGA-352P-M03) BGA352004SC-1-1 BGA-352P-M03
1999 - Not Available

Abstract: No abstract text available
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M02 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M02) 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008) 0.60±0.10 (.024±.004) 31.75±0.20(1.250±.008) 1.27±0.20 (.050±.008) 0.15(.006) INDEX C 1996 FUJITSU LIMITED BGA352003SC-1-1 Ø0.75±0.15(Ø


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PDF BGA-352P-M02 352-pin BGA-352P-M02) BGA352003SC-1-1
1997 - BGA-352P-M03

Abstract: 352-PIN
Text: BALL GRID ARRAY PACKAGE 352 PIN PLASTIC BGA-352P-M03 Lead pitch 50mil Pin matrix 26 Sealing method Resin seal 352-pin plastic BGA (BGA-352P-M03) 352-pin plastic BGA (BGA-352P-M03) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008) 0.60±0.10 (.024±.004) 31.75±0.20(1.250±.008) 1.27±0.20 (.050±.008) 0.15(.006) INDEX C 1996 FUJITSU LIMITED BGA352004SC-1-1 Ø0.75±0.15(Ø.030±.006) 1PIN Dimensions in mm (inches). Fujitsu


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PDF BGA-352P-M03 50mil 352-pin BGA-352P-M03) BGA352004SC-1-1 BGA-352P-M03
1998 - led matrix circuits

Abstract: 352-PIN matrix led
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M02 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M02) 352-pin plastic BGA (BGA-352P-M02) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008) 0.60±0.10 (.024±.004) 31.75±0.20(1.250±.008) 1.27±0.20 (.050±.008) 0.15(.006) INDEX C 1996 FUJITSU LIMITED BGA352003SC


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PDF BGA-352P-M02 352-pin BGA-352P-M02) BGA352003SC-1-1 led matrix circuits matrix led
JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: carrier and a box to protect products during transport and storage Pin rigid plastic pin that closes , tube for PLCCs or SILs by insertion into its end Turnlock rigid plastic pin that closes a tube , (tube/ pin ) handbook, full pagewidth Weight(1) (g) Item Stacking method Material Box , Endplug (white) Stacked tubes Endplug (green) Product orientation in tube ( pin 1 towards this , Preprinted ESD warning Barcode label QA seal Strap MSC042 Fig.1 Packing for DIP (tube/ pin ).


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PDF manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
1999 - Not Available

Abstract: No abstract text available
Text: TAB BALL GRID ARRAY FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC BGA-352P-M08 352-pin plastic TAB-BGA Lead pitch 0.80 mm Package width × package length 23.00 × 23.00 mm Lead shape Ball Sealing method Resin seal Mounting height 1.20 mm Max (BGA-352P-M08) 352-pin plastic TAB-BGA (BGA-352P-M08) Note: The actual shape of coners may differ from the dimension. 23.00±0.10(.906±.004)SQ 352-Ø0.45±0.15 (352-Ø.018±.006) 22.40±0.20(.882±.008)SQ Ø0.30(.012) M S AB


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PDF BGA-352P-M08 352-pin BGA-352P-M08) BGA352010SC-1-1
1998 - led matrix circuits

Abstract: BGA-352P-M03
Text: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 352 PIN PLASTIC To Top / Package Lineup / Package Index BGA-352P-M03 352-pin plastic BGA Lead pitch 50 mil Pin matrix 26 Sealing method Resin seal (BGA-352P-M03) 352-pin plastic BGA (BGA-352P-M03) 35.00±0.20(1.380±.008)SQ 32.50±0.10(1.280±.004)SQ 2.30±0.20 (.091±.008) 0.60±0.10 (.024±.004) 31.75±0.20(1.250±.008) 1.27±0.20 (.050±.008) 0.15(.006) INDEX C 1996 FUJITSU LIMITED BGA352004SC


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PDF BGA-352P-M03 352-pin BGA-352P-M03) BGA352004SC-1-1 led matrix circuits BGA-352P-M03
ITT2110AH

Abstract: ITT2111AH ITT2112AH ITT211X ITTT2112AH
Text: Typical 3.5 Volt Performance VG RFOUT VSENSE GND 28 pin narrow body SSOP ITT2110AH , Gate Bias Voltage ( Pin 21) DC Supply Voltage (NVG ­ ITT2110AH, ITT2111AH: Pins 1, 28) RF Input Power Junction Temperature Storage Temperature Range Symbol VDD VG VOSC,VNVG PIN TJ TSTG Value 10 , =3.5 V, PIN =0 dBm, TA=25 °C, Input and output externally matched to 50 . Characteristic Frequency Range , Resistance (Junction of 4th stage FET to solder point of pin 11) Load Mismatch (VDD = 5.1V, VSWR = 10:1, PIN


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PDF ITT2110AH ITT2111AH ITT2112AH ITT211X ITT2112AH ITT2110AH, ITT2111AH) ITTT2112AH
bc600

Abstract: 2T12A BA352
Text: PS240 Cl Cl Cl 256- Pin PBGA BA256 Cl 352-Pin PBGA BA352 Cl Cl 432- Pin EBGA BC432 - Cl Cl , 160- Pin QFP J160 Cl Cl Cl Cl - - - - 256- Pin PBGA BA256 - Cl Cl Cl Cl Cl - - 352-Pin PBGA , not offered in the 304- pin SQFP/SGFP2 packages. The OR2C4QA is not offered in a 352-pin PBGA. Table , Speed -70 *10fr -125 -5 -4 -3 -70 68- Pin 84- Pin 44- Pin PLCC PLCC PLCC M84 M44 M68 . '-.4-' · : Cl Cl . , ATT3090 -5 -4 -3 - - - _ - Cl a : a Cl C C Cl : Cl Cl Cl : 132- Pin 100- Pin PPGA QFP


OCR Scan
PDF C/2T04A OR2C/2T06A OR2C/2T08A OR2C/2T10A OR2C/2T12A OR2C/2T15A OR2C/2T26A OR2C/2T40A OR2OT15A, OR2GT26A bc600 2T12A BA352
Supplyframe Tracking Pixel