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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
TPA2005D1GQYRQ1 Texas Instruments 1.45W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA
TPA2005D1ZQYRQ1 Texas Instruments 1.45W, 1 CHANNEL, AUDIO AMPLIFIER, PBGA, 2.5 X 2.5 MM, LEAD FREE
TMS320C6201GJLA200 Texas Instruments Fixed-Point Digital Signal Processor 352-FCBGA
TMS320C6202GJLA233 Texas Instruments Fixed-Point Digital Signal Processor 352-FCBGA
TMS320C6202BZNZ300 Texas Instruments Fixed-Point Digital Signal Processor 352-FCBGA
TMS320C6203BZNZ300 Texas Instruments Fixed-Point Digital Signal Processor 352-FCBGA

352-PBGA Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
proteus

Abstract:
Text: PQFP 352 PBGA XC4028XL-HQ160C XC4028XL-HQ208C XC4028XL-HQ240C XC4028XL-PG299C XC4028XL-HQ304C , CPGA 304 PQFP 352 PBGA XC4028XL-HQ160I XC4028XL-HQ208I XC4028XL-HQ240I XC4028XL-PG299I , HQFP 240 HQFP 304 PQFP 352 PBGA 432 PBGA XC4036XL-HQ160C XC4036XL-HQ208C XC4036XL-HQ240C , Industrial Industrial Industrial Package Type 304 PQFP 352 PBGA 432 PBGA Xilinx Equivalent , 160 HQFP 208 HQFP 240 HQFP 304 PQFP 352 PBGA 432 PBGA XC4044XL-HQ160C XC4044XL-HQ208C


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PDF 4000E/EX 4000XL/XLA 1-800-95CHIPX proteus HQFP 208 XC4013XL-PQ240C XC4013XL-HT176C pbga 144 144T xc4013xla-pq208c XC4013XL-HT144I R4036XLA-I-160H XC4020XLA-PQ160
1998 - NEC VR4300

Abstract:
Text: NEC BGA family 1. BGA - -BGA Ball Grid Array - PBGA Plastic BGA TBGA Tape BGA 2. NEC BGA NEC PBGA ABGA Advanced BGA 1TBGA 2TBGA 4 BGA PBGA 300 ABGA 700 PBGA Si 1 TBGA 700 2 TBGA 1000 TBGA TAB 3 NEC BGA family 3. NEC BGAQFP PBGA * * Q1 QFP , % 1.5mm 0.2 0.2 0.75 0.75 Q2 1 PBGA QFP 225 208 256 1.27 0.5 0.4 27×27 28×28 28×28


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PDF 208QFP 225BGA 20down 56down 225BGA C13550JJ1V0PF00 NEC VR4300 225PBGA BGA313 EDR-7315 HG7900 JIS-Z0202 nec bga QFP28
1995 - CE51484

Abstract:
Text: PBGA Package 3. Improved thermal resistance: Thermal vias allow up to a 33% reduction in thermal , type of BGA packages to suit a wide variety of performance needs. Type A PBGA Package Epoxy Resin Wire Bonding Potting Resin Solder Ball Wire Bonding The Type "C" PBGA is a high performance , reliability. PC Board Type D PBGA Package Area Bump Encapsulation Metal Plate LSI Chip LSI Chip Thermal Via Solder Ball The Type "A" PBGA is used primarily as a prototyping vehicle. It


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PDF CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA 256 PACKAGE power dissipation BGA256 CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
337 PBGA

Abstract:
Text: FCBGA/ PBGA [FC] QON/ TQON/VQON PFBGA PFBGA PFBGA PFBGA Stacked Stacked MCP MCP FLGA EBGA FLGA FLGA TBGA TCP/CO G TBGA PBGA PBGA TCP/CO G PBGA CCD/CM OS , PBGA /PFBGA/PTFBGA/PVFGA 9 PBGA / PBGA [4L] PBGA [FC] PBGA [4L] 10 PBGA [FC , Package 4 PBGA / PBGA [4L] PBGAPlastic Ball Grid Array 2or4 PBGA [FC] PBGA [FC]Flip ChipPlastic Ball Grid Array 1000 Network


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PDF 65mmt 1000Line 2000pinPackage 24pin1yo SCJ0006C SCJ0006B 337 PBGA ebga 304
2000 - Not Available

Abstract:
Text: ­PQFP 160­PQFP 152- PBGA 352-PBGA 352-PBGA Temp. Range Ind. Ind. Ind. Ind. Ind. Operating Power Supply 5.0V


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PDF 111mA 106mA 133mA XRT7295 XRT7295E XRT7296 XRT7298 XRT7300 XRT73L00
88E1111-BAB

Abstract:
Text: 256 KB 32/64-bit data 256- PBGA 32 KB data w/ECC 32-bit address (27x27 , V/1.8 or 2.5 V 0ºC to 95ºC 32 KB instruction Internal 256 KB 32/64-bit data 256- PBGA , ) 10/100 2 665 PBGA 4 GB 64240 , 32-bit 133 MHz (2) 32-bit PCI (2) 10/100 2 665 PBGA 4 GB 64241 . SysAD 133 MHz Discovery Discovery II 64262 (1) 32/64-bit PCI - - 665 PBGA 4 GB


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PDF 750CXe Hz-600 88E1111-BAB 88E1145-BBM 88E1111-CAA marvell 64360 Marvell 64460 88E1011S-RCJ 88E1043-BCA 88E1141 88E1011S-BAB 88E1111
1996 - Not Available

Abstract:
Text: BGA Technology f eatures v JEDEC compliant standard PBGA packages v Extensive experience in mass producing cost-effective & high-volume singlechip and multichip PBGA packages v , Grid Array ( PBGA ) packages to the market. Leveraging the strength and experience in decades of product design and manufacturing, Fujitsu is in a position to offer customers the most costeffective PBGA , manufacturing facilities support either singlechip or multichip PBGA packages that are ideal for minimum space


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PDF APT-BGATB-20380-1
1998 - 35 x 35 PBGA, 580 100 balls

Abstract:
Text: further classified by interposer material: PBGA (Plastic BGA) uses a printed wire board (PWB), TBGA (Tape , BGA. PBGA (Plastic BGA, using a single layer PWB) ABGA (Advanced BGA, using a multiple-layer PWB) 1 , ) Standard type High speed type PBGA up to 300pin ABGA up to 700pin Wire Resin Heat spreader Si chip PBGA Ag paste Si chip PWB Resin Via hole Cu pattern Low cost , count NEC BGA family 3. Advantages PBGA and TBGA are smaller, lighter packages than the


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PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls HG7900 Enplas drawings BGA Ball Crack PEAK TRAY bga NEC stacked CSP 2000 BGA-35 153pin Lead Free reflow soldering profile BGA sumitomo 3m
bc600

Abstract:
Text: PS240 Cl Cl Cl 256-Pin PBGA BA256 Cl 352-Pin PBGA BA352 Cl Cl 432-Pin EBGA BC432 - Cl Cl , 160-Pin QFP J160 Cl Cl Cl Cl - - - - 256-Pin PBGA BA256 - Cl Cl Cl Cl Cl - - 352-Pin PBGA , not offered in the 304-pin SQFP/SGFP2 packages. The OR2C4QA is not offered in a 352-pin PBGA . Table


OCR Scan
PDF C/2T04A OR2C/2T06A OR2C/2T08A OR2C/2T10A OR2C/2T12A OR2C/2T15A OR2C/2T26A OR2C/2T40A OR2OT15A, OR2GT26A bc600 2T12A BA352
pcb design 0,5 mm pitch

Abstract:
Text: Samsung ASIC Appendix D Package s In-house Sub-contractor PBGA (2L) Package Pitch 1422 mm 1.27 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 4242 mm 1.27 PBGA (ML , 180 196 208 256 280 s s s s PBGA Thermal Resistance Package Type PBGA (2L) 19 - 20 (°C/W) PBGA (ML) 15 - 15.5 (°C/W) FBGA (Tape) 59 (°C/W) FBGA


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PDF STD150 pcb design 0,5 mm pitch PBGA 1515 D 4242 fbga 153 Samsung ASIC STD150
pcb design 0,5 mm pitch

Abstract:
Text: 52 28 68 Remarks 84 s s s < 5nH 1.27 s s s < 13nH PBGA (2L , 4242 mm 1.27 PBGA (ML) 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 , s s 1.27 s 0.65 s 0.75 0.8 1.00 s s PBGA Thermal Resistance Package Type PBGA (2L) 19 ~ 20 (°C/W) PBGA (ML) 15 ~ 15.5 (°C/W) FBGA (Tape) 59 (°C/W) FBGA (PCB


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PDF STDL130 pcb design 0,5 mm pitch QFP PACKAGE thermal resistance SAMSUNG 834 12 x 12 fbga thermal resistance package tsop1
SAMSUNG 834

Abstract:
Text: 1.27 s s s < 13nH PBGA (2L) Package Pitch 1422 mm 1.27 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 4242 mm 1.27 PBGA (ML) 1515 mm 1.0 2323 mm 1.27 1.5 , 0.65 s 0.75 0.8 1.00 s s PBGA Thermal Resistance Package Type PBGA (2L) 19 ~ 20 (˚C/W) PBGA (ML) 15 ~ 15.5 (˚C/W) FBGA (Tape) 59 (˚C/W) FBGA (PCB) STD131 θ ja


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PDF STD131 SAMSUNG 834
Not Available

Abstract:
Text: . Provisions for 64-bit PCI bus capability in 352-pin PBGA package. Pinout compatible with the ORCA PCI Master , -pin PBGA , and 352-pin PBGA (64-bit PCI in 352-pin PBGA only). Pin-selectable I/O clamping diodes to allow , Seríes 3+ Package Matrix Package Device 240-Pin EIAJ/ SQFP2 PS240 Cl 256-Pin PBGA BA256 Cl 352-Pin PBGA , available only in 352-pin PBGA package. Table 4. Package Options Table 6. Embedded Core Type Symbol BA PS Description Plastic Ball Grid Array ( PBGA ) Power Quad Shrink Flat Package Symbol P1 Description 32-/64-bit, 33


OCR Scan
PDF OR3TP12 OR3TP12, 32-/64-bit PN99-047FPGA PN98-054FPGA)
1999 - Not Available

Abstract:
Text: for 64-bit PCI bus capability in 352-pin PBGA package. s Pinout compatible with the ORCA PCI , -pin , PBGA , and 352-pin PBGA (64-bit PCI in 352-pin PBGA only). s Product Brief February 1999 , -Pin PBGA 352-Pin PBGA PS240 CI BA256 CI BA352 CI Key: C = commercial, I = industrial. Note: 64-bit PCI available only in 352-pin PBGA package. Table 4. Package Options Table 6. Embedded Core Type Symbol Description BA PS Plastic Ball Grid Array ( PBGA ) Power Quad Shrink Flat


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PDF OR3TP12 32-bit 32-bit PN99-047FPGA PN98-054FPGA)
SAMSUNG 834

Abstract:
Text: 52 28 68 Remarks 84 s s s < 5nH 1.27 s s s < 13nH PBGA (2L , 4242 mm 1.27 PBGA (ML) 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 , s s 1.27 s 0.65 s 0.75 0.8 1.00 s s PBGA Thermal Resistance Package Type PBGA (2L) 19 - 20 (°C/W) PBGA (ML) 15 - 15.5 (°C/W) FBGA (Tape) 59 (°C/W) FBGA (PCB


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PDF STD130 SAMSUNG 834 pcb design 0,5 mm pitch STD130
D 4242

Abstract:
Text: Samsung ASIC Appendix D Package s In-house Sub-contractor PBGA (2L) Package Pitch 1422 mm 1.27 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 4242 mm 1.27 PBGA (ML , 180 196 208 256 280 s s s s PBGA Thermal Resistance Package Type PBGA (2L) 19 - 20 (°C/W) PBGA (ML) 15 - 15.5 (°C/W) FBGA (Tape) 59 (°C/W) FBGA


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PDF STDH150 D 4242 pcb design 0,5 mm pitch FBGA PACKAGE thermal resistance Samsung 3232 STDH150
proteus

Abstract:
Text: PBGA 240 HQFP 240 PQFP X X X X N/A N/A N/A N/A X 299 CPGA 304 HQFP , SERIES 208 HQFP 240 HQFP 299 CPGA 304 HQFP 352 PBGA 411 CPGA 432 PBGA


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PDF 4000E/EX 4000XL/XLA 1-800-95CHIPX proteus XC4013E-PQ160C XC4013EPQ160 XC4013E-HQ208I pq208C "CHIP EXPRESS" XC4013E-PQ208C XC4013E-PQ240 xc4013epq208 XC4028EX-HQ208I
1998 - atmel 0945

Abstract:
Text: . 4-18 PBGA , , 100, 120, 132, 144, 160, 224, 340 PBGA 121, 169, 225, 313, 352, 388 Super PBGA 168, 204 , 4-19 ® pkg-3.5-04/98 121 PBGA Ortho View (Ball Grid Array Package) 4-20 Packaging pkg-3.5-04/98 169 PBGA Ortho View 4-21 ® pkg-3.5-04/98 225 PBGA Ortho View 4-22 Packaging pkg-3.5-04/98 256 PBGA Ortho View 1.27 4-23 ® pkg-3.5-04/98 313 PBGA Ortho


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PDF
2000 - Not Available

Abstract:
Text: Software Features ADSP-21mod980-240 Voice Solution (600 MIPs) 40 G.711 352 PBGA (35mm) ADSP-21mod980-216 Voice Solution (600 MIPs) 16 G.729 A/B, G.711 352 PBGA (35mm) ADSP-21mod980-110 Integrated Modem Solution (600 MIPs) 8 Modem 352 PBGA (35mm) ADSP-21mod970-110 Integrated Modem Solution (312 MIPs) 6 Modem 304 PBGA (31mm) ADSP-21mod870-110 Integrated Modem Solution (52 , (16mm) ADSP-21mod970-000 Device (312 MIPs) - - 304 PBGA (31mm) ADSP


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PDF ADSP-21mod D-81373 ADSP-21modXX0-000 K56FLEX H3693b-10-2/00
IDT package marking

Abstract:
Text: Type Package Type Package Type CABGA 100 PBGA 196 PLCC 32 SOJ 32 CPGA 208 CABGA 144 PBGA 208 PLCC 44 SOJ 36 CPGA 223 CABGA 256 PBGA 240 PLCC 52 SOJ 44 CPGA 296 FPBGA 165 PBGA 256 PLCC 68 TQFP 100 CPGA 447 FCBGA 372 PBGA 260 PLCC 84 TQFP 120 CPGA 68 FCBGA 472 PBGA 272 PQFP 100 TQFP 128 CPGA 84 FCBGA 616 PBGA 324 PQFP 128/132 TQFP 144 CQSOP 84 FCBGA 900 PBGA 388 PQFP 144 TQFP 44 LCC


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PDF
1997 - Intel reflow soldering profile BGA

Abstract:
Text: 2 14 An Introduction to Plastic Ball Grid Array ( PBGA ) Packaging 1/17/97 9:57 AM , BALL GRID ARRAY ( PBGA ) PACKAGING 14.1. INTRODUCTION The plastic ball grid array ( PBGA ) is today on , leads, the PBGA has reduced coplanarity problems and minimized handling issues. During reflow the , that of conventional QFPs or PQFPs. The PBGA has a rapid design-to-production cycle time and can also , 14-1. PBGA /HL-PBGA Package Attributes PBGA Lead Count HL-PBGA 208 272 324 352 S


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PDF CH14WIP Intel reflow soldering profile BGA socket s1 REFLOW PROFILE outline of the heat slug for JEDEC intel topside mark heat pipes intel pbga package weight intel mother board circuit JEDEC bga 63 tray land pattern BGA 0,50 Lead Free reflow soldering profile BGA
z80 vhdl

Abstract:
Text: PC DVD PBGA / PBGA 4L PBGAPlastic Ball Grid Array , PC PBGA FC PBGA FC Flip Chip Plastic Ball Grid Array , BGA() SiP BGA() 9 100 200 300 256 PBGA 1.0 mm 97 121 141 , mm EBGA[4L] 1.27mm PBGA [FC] 128 352 1.0 mm 625


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PDF TC320 TC300 TC280 TC260 TC200 TC203 TC220 TC223 TC190 TX49RISC z80 vhdl TC190 TOSHIBA TC160 LSI CMOS GATE ARRAY tc260c PLL in RTL toshiba TC200 TOSHIBA TC203 Celaro P-FBGA 169
35 x 35 PBGA, 580 100 balls

Abstract:
Text: Higher Pin Count 700 P-BGA 600 500 400 CSP family Wire 300 1.5-mm pitch 200 QFP , Cavity up PBGA Pin count: up to 300 Advanced BGA Pin count: up to 700 Chip PBGA Gold wire , package family, PBGA and TBGA NEC offers two types of BGA packages depending on the base materials used for the balls: plastic BGA ( PBGA ) and tape BGA (TBGA). These two types of BGA packages are further , (mm) 27 x 27 PBGA cavity up 35 x 35 Ball Pitch (mm) 119 256 1.5 1.27 2.54 staggered


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2000 - bga 0,8 mm

Abstract:
Text: Overview PBGA Construction EBGA Construction Package Handling/Shipping Media Design Recommendations , ( PBGA ) packages as well as provide information about their implementation into products and surface mount assembly, see Figure 1. BGA (Ball Grid Array) BGA (Ball Grid Array) AN101094-10 PBGA AN101094-9 © 2000 National Semiconductor Corporation AN101094 EBGA FIGURE 1. PBGA & EBGA AN , www.national.com AN-1126 PACKAGE OVERVIEW PBGA Construction AN101094-11 FIGURE 2. Cross-Sectional


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1996 - Not Available

Abstract:
Text: available in 208-PQFP, 352-PBGA , and over 500-pin PBGA packages. Software support for the complete pASIC 1


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PDF QL2020
Supplyframe Tracking Pixel