The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial

336-BGA Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1999 - PAL 22V10H

Abstract: ALL-07A 16v8z 22v10h 16R8-7 29MA16 dip-28 all-07a Programmer 22V10Z 2.70E 24
Text: 208 240 256 160 208 240 256 Package PLCC TQFP PQFP TQFP PQFP BGA PLCC TQFP TQFP PLCC TQFP TQFP TQFP TQFP PQFP TQFP PQFP BGA TQFP TQFP PLCC TQFP PQFP BGA TQFP PQFP TQFP PQFP BGA TQFP TQFP PLCC PLCC PQFP TQFP TQFP PQFP BGA PLCC TQFP TQFP PLCC TQFP , PQFP BGA PQFP PQFP PQFP BGA Advin U40/MVP 10.86J 10.86J 10.86J N/A 10.85E N/A 10.91A , 44 44 44 68 68 Package PQFP PQFP PQFP BGA BGA PQFP TQFP PQFP PQFP PQFP TQFP TQFP


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PDF M4-128N/64 M4-128/64 M4-192/96 M4-256/128 M4-32/32 M4-64/32 PAL 22V10H ALL-07A 16v8z 22v10h 16R8-7 29MA16 dip-28 all-07a Programmer 22V10Z 2.70E 24
2000 - IM4A5-64

Abstract: lattice im4a3-32 IM4A5 im4a3-32 im4a5-128 im4a3-64 all-07a Programmer im4a3 im4a3-128 im4a5-32
Text: PLCC PQFP TQFP PQFP BGA TQFP PLCC TQFP TQFP PLCC TQFP TQFP TQFP PLCC PQFP TQFP TQFP PQFP BGA PLCC TQFP TQFP PLCC TQFP TQFP TQFP PQFP TQFP PLCC TQFP TQFP PLCC TQFP TQFP TQFP TQFP TQFP PQFP TQFP PQFP BGA PQFP fpBGA PQFP BGA PQFP TQFP PQFP PQFP PQFP TQFP PQFP PQFP PQFP PQFP TQFP PQFP PQFP TQFP Advin U40/MVP , PQFP PQFP TQFP PQFP PQFP PQFP PQFP PQFP PQFP PQFP BGA PQFP PQFP PQFP BGA PQFP PQFP PQFP BGA BGA PQFP TQFP TQFP PQFP TQFP PQFP PQFP TQFP TQFP PQFP TQFP PQFP PQFP PQFP PQFP PQFP BGA PQFP PQFP PQFP BGA PQFP


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PDF M4-32/32 M4-64/32 M4-96/48 M4-128N/64 MACH436) M4-128/64 IM4A5-64 lattice im4a3-32 IM4A5 im4a3-32 im4a5-128 im4a3-64 all-07a Programmer im4a3 im4a3-128 im4a5-32
al9v576

Abstract: multi S-Video Input to rgb AL37219 AL240 bt.656 parallel to RGB AL37204 AL37219C-PC-PBF ITUR-656 256-LQFP DVR Surveillance
Text: AL37219C-LF-PBF 256-LQFP +1.8/3.3V AL37219C-PC-PBF 336-BGA +1.8/3.3V DISTRIBUTED BY: VERSION , - 336-pin 27x27 mm BGA package VERSION 0.3 www.averlogic.com Functional Block Diagram


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PDF AL37219 AL37219 16X12 16-CH AL9V576) AL240) 1-F-PMK119-0001 AL37219C-LF-PBF al9v576 multi S-Video Input to rgb AL240 bt.656 parallel to RGB AL37204 AL37219C-PC-PBF ITUR-656 256-LQFP DVR Surveillance
2000 - CY7C4271-JC

Abstract: cypress 98267 9832 CY5037
Text: Quarter 4, 1998 Issued: 3/7/2000 CY37256P256-BGC 98193 9825 619805724 256 MCEL CMOS TW BGA TAIWAN-G 292 128 45 0 45 0 140C/5.5V PLD 37K CY37256P256-BGC 98193 9828 619807607 256 MCEL CMOS TW BGA , MCEL CMOS TW BGA TAIWAN-G 292 48 250 76 0 0 0 CY37256VP160-AC 98423 9838 619810670 256 MCEL , 108 CMOS TW BGA TAIWAN-G 292 48 250 CMOS TW BGA TAIWAN-G 292 80 76 0 500 76 0 , 48 0 CY37256P256-BGC 98193 9825 619805724 256 MCEL CMOS TW BGA TAIWAN-G 292 336 45 1000 45 0


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PDF CY62128V-VC CY62128V-ZSC CY7C4271-JC cypress 98267 9832 CY5037
MP3 Decode Module

Abstract: semicon arm9 TX39 TX49 NAND memory
Text: RLC (HSPICE IBIS) 9 2 3 SiP BGA () BGA () 2 10 3


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PDF 900/H1 SCJ0010A MP3 Decode Module semicon arm9 TX39 TX49 NAND memory
1999 - tw 9907

Abstract: W48C101-01H MR841 MR840 CY7C63101A-SC 99141 M99219 MR92184 malaysia 99052 M99213
Text: CY37512P352-BG 99043 9902 619900229 512 MCEL CMOS TW BGA TAIWAN-G 388 128 50 0 , 1000 50 50 0 0 CY37512P256-BGC 98403 9901 619817515 512 MCEL CMOS TW BGA TAIWAN-G 292 CY37512P352-BG 99043 9902 619816568 512 MCEL CMOS TW BGA TAIWAN-G 388 336 48 0 , MCEL 512 MCEL CMOS CMOS TW TW BGA TAIWAN-G 292 168 55 0 168 47 0 288 47 0 , TW BGA TAIWAN-G 388 100 48 Page 11 of 40 CYPRESS SEMICONDUCTOR CORPORATION


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PDF SRAM/LOGIC-R52LD CY62137VL-ZSIB tw 9907 W48C101-01H MR841 MR840 CY7C63101A-SC 99141 M99219 MR92184 malaysia 99052 M99213
2013 - Not Available

Abstract: No abstract text available
Text: Code and Available Options for Cyclone V E Devices—Preliminary Package Type F : FineLine BGA (FBGA) U : Ultra FineLine BGA (UBGA) M : Micro FineLine BGA (MBGA) Operating Temperature C : Commercial , controllers Family Signature 5C : Cyclone V 5C GX Package Type F : FineLine BGA (FBGA) U : Ultra FineLine BGA (UBGA) M : Micro FineLine BGA (MBGA) Transceiver Count B : 3 F : 4 A : 5 C : 6 D : 9 , logic elements D7 : 149.5K logic elements D9 : 301K logic elements Package Type F : FineLine BGA


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PDF CV-51001
2002 - dallas date code ds1230

Abstract: No abstract text available
Text: 300 1000 100 100 77 77 33 28 0 0 0 1 0 1 Module w/Hi Densit BGA Module BGA Module Module w/Hi , Fastech Fastech Dallas Dallas Dallas Dallas PACKAGE Module w/SMT Module w/SMT Module w/SMT BGA Module BGA Module BGA Module READ POINT QTY FAIL 48 48 48 336 336 1000 2000 200 200 200 77 33 30 29 0 0 1 , BGA Module & DS3801 26055 RELIABILITY MONITOR STRESS: INFANT LIFE CONDITIONS: 85C LOT NO , (Anam, K) PACKAGE Power Cap BGA Module READ POINT QTY FAIL 2 2 3 225 99 206 0 0 0 DN042297AAA


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PDF DH046190AAI DS1620 DS1869 DH833210AAB DS5002 DN028766AAD DN030363AAA J-STD-020 DS1302 dallas date code ds1230
99043

Abstract: bga 388 140C JESD22 ASE BGA
Text: Cypress Semiconductor Qualification Report QTP# 99043 VERSION 1.0 May, 1999 388 Ld BGA , : 388Ld BGA QTP# 99043, V. 1.0 Page 2 of 4 May, 1999 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: 388 Ld BGA Mold Compound Name/Manufacturer: Lead Frame material , BGA QTP# 99043, V. 1.0 Page 3 of 4 May, 1999 RELIABILITY TESTS PERFORMED Stress/Test , BGA QTP# 99043, V. 1.0 Page 4 of 4 May, 1999 RELIABILITY TEST DATA QTP#: 99043 DEVICE


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PDF 388Ld 30C/60 CY37512P352-BG 99043 bga 388 140C JESD22 ASE BGA
1997 - bga 208 PACKAGE

Abstract: ISB24077 ISB24060 ISB24046 ISB24037 ISB24025 ISB24019 ISB24013 ISB24007 ISB24005
Text: ISB24133 ISB24157 ISB24166 ISB24203 ISB24254 ISB24288 Package BGA PLCC PQFP TQFP BGA PLCC PQFP TQFP BGA PLCC PQFP TQFP BGA PLCC PQFP TQFP BGA PQFP TQFP BGA PQFP TQFP BGA PQFP TQFP BGA PQFP BGA PQFP Pins 256 44 to 84 64 to 208 100, 144, 176 256 68, 84 64 to 208


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PDF ISB24004 ISB24005 ISB24007 ISB24013 ISB24019 ISB24025 ISB24037 ISB24046 ISB24060 ISB24077 bga 208 PACKAGE ISB24077 ISB24060 ISB24046 ISB24037 ISB24025 ISB24019 ISB24013 ISB24007 ISB24005
2013 - EA-190-H095-T710

Abstract: EA-375-H125-T710 EA-375-H095-T710 EA-425-H245-T710 EA-375-H175-T710 EA-190-H245-T710 EA-190-H195-T710 EA-190-H175-T710 EA-190-H145-T710 EA-190-H125-T710
Text: Introducing Aavid’s line of clip attach heat sinks for BGA applications. The series utilizes an easy to , Assembled 2.5 mm Keep out zone BGA Size (45mm x 45mm) Heat Sink Height (17.5mm) Minimum 0.3mm , number: EA-MT001 USA: +1-603-528-3400 Solder Ball 2.5mm keep out zone Die BGA Height , size: 3 times BGA nominal width; 1mm from fin top (i.e. 27x27mm BGA , region size 3x27mm = 81mm width) Heat source size = BGA nominal size (i.e. 27x27mm BGA , heat source size 27x27mm) » TIM size: 1mm


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PDF UL94V-0 EA-190-H095-T710 EA-375-H125-T710 EA-375-H095-T710 EA-425-H245-T710 EA-375-H175-T710 EA-190-H245-T710 EA-190-H195-T710 EA-190-H175-T710 EA-190-H145-T710 EA-190-H125-T710
LVDSEXT-25

Abstract: 4564 RAM BLVDS-25 XC2V1000 Pin-out XC2VP70 FF1704 pinout XC2V1500 LVDSEXT25 XC2V3000 LVDS-25 XC2V2000
Text: wire-bond chip-scale BGA (0.8 mm ball spacing) 144 12 x 12 mm 88 92 FF896 92 8 8 8 , ) ­ flip-chip fine-pitch BGA (1.27 mm ball spacing) 957 20 0 FFA Packages (FF) ­ flip-chip fine-pitch BGA (1.0 mm ball spacing) 672 20 172 200 248 404 20 FF16966 10G FIBRE , wire-bond fine-pitch BGA (1.0 mm ball spacing) 4564 0 FF1517 16 G . 709 728 328 8 12 SONET OC-192 SDH STM - 64 575 XC2VPX70 8 8 FG676 FG672 BGA Packages (BG) ­


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PDF FF896 FF1152 FF11486 10Gbps LVDSEXT-25 4564 RAM BLVDS-25 XC2V1000 Pin-out XC2VP70 FF1704 pinout XC2V1500 LVDSEXT25 XC2V3000 LVDS-25 XC2V2000
1998 - bga 576 socket

Abstract: 7400 NP276-62525-A NP276-37206-AC03134 marcon+capacitor+5840 65227 AC-09801 AC-06524 NP276-37206-AC03327 NP276-37206AC-03134
Text: BGA NP276 Series Arrays Insulation Resistance: Withstanding Voltage: Contact Resistance , Packages Small Outline Packages ± ± ± Speciality Test Products ± ± 20 BGA , 596 625 600 600 640 652 672 753 768 873 969 976 1105 T y pe e BGA SBGA BGA SBGA BGA BGA BGA BGA SBGA BGA BGA BGA BGA SBGA BGA BGA BGA BGA BGA BGA BGA BGA BGA SBGA SBGA BGA BGA BGA BGA BGA SBGA BGA SBGA BGA BGA BGA SBGA BGA BGA BGA BGA BGA SBGA BGA BGA BGA BGA SBGA BGA SBGA BGA SBGA BGA BGA BGA BGA BGA


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PDF NP276 10mA/20mV UL94V-0 NP276-372 NP276-11935 NP276-37206-AC03143 NP276-15334-* NP276-37206-A -AC09608 bga 576 socket 7400 NP276-62525-A NP276-37206-AC03134 marcon+capacitor+5840 65227 AC-09801 AC-06524 NP276-37206-AC03327 NP276-37206AC-03134
1998 - TQFP 100 pin Socket

Abstract: MACH Programmer mach-355 1086H MACH 436 M4-256/128 HI-LO ALL-07 FLEX-700 Programming mach 130 tqfp 64 socket
Text: NS 3.26 M5-320/192 256 ball BGA 5.6 5.6 5.6 5.6 NS 3.26 M5-384/120 160 pin , ball BGA 5.6 5.6 5.6 5.6 NS 3.26 M5-512/120 160 pin PQFP 5.6 5.6 5.6 , 240 pin PQFP 5.6 5.6 5.6 5.6 NS 3.26 M5-512/192 256 ball BGA 5.6 5.6 5.6 5.6 NS 3.26 M5-512/256 352 ball BGA 5.6 5.6 5.6 5.6 NS General Information , 7.8.1 3.02 10.87C B0/97 2.35C M5-320/192 256 ball BGA 7.8.1 3.02C 10.86H B0


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PDF Pilot-U84 Pilot-U40 CP1128 BP1148 BP1200 BP1400 BP2100 BP2200 M2900 M3900 TQFP 100 pin Socket MACH Programmer mach-355 1086H MACH 436 M4-256/128 HI-LO ALL-07 FLEX-700 Programming mach 130 tqfp 64 socket
M51V

Abstract: hu7w M3900 1/160-N TQFP 100 pin ic XELTEK D-7988 1086H CIC-144QF MACH435
Text: -384/184 240 pin PQFP M5-384/192 256 ball BGA M5-512/120 160 pin PQFP M5-512/160 208 pin PQFP M5-512/184 240 pin PQFP M5-512/192 256 ball BGA M5-512/256 352 ball BGA Data I/O Autosite NA Data I/O , PQFP M5-320/120 160 pin PQFP M5-320/160 208 pin PQFP M5-320/184 240 pin PQFP M5-320/192 256 ball BGA M5-384/120 160 pin PQFP M5-384/160 208 pin PQFP M5-384/184 240 pin PQFP M5-384/192 256 ball BGA M5-512/120 160 pin PQFP M5-512/160 208 pin PQFP M5-512/184 240 pin PQFP M5-512/192 256 ball BGA M5-512/256 352


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PDF 1050-L D-7988 AL71LT, D-6798 M51V hu7w M3900 1/160-N TQFP 100 pin ic XELTEK 1086H CIC-144QF MACH435
130C

Abstract: JESD22 Ablebond 8355
Text: Cypress Semiconductor Qualification Report QTP# 98193 VERSION 1.0 December, 1998 292-Pin BGA , -pin BGA QTP# 98193, V. 1.0 Page 2 of 4 December, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: 292-Pin BGA Mold Compound Name/Manufacturer: Substrate material , , Taiwan Package: 292-pin BGA QTP# 98193, V. 1.0 Page 3 of 4 December, 1998 RELIABILITY TESTS , -pin BGA QTP# 98193, V. 1.0 Page 4 of 4 December, 1998 RELIABILITY TEST DATA QTP#: 98193 DEVICE


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PDF 292-Pin 30C/60 CY37256P256-BGC 7C37652AF-GBGC 130C JESD22 Ablebond 8355
2002 - 25821

Abstract: dallas date code ds12887 25854
Text: Can F50 Rev B 1000 BGA Module 300 & DS3801 26054 RELIABILITY MONITOR STRESS: STORAGE LIFE , BGA Module READ POINT QTY FAIL 48 48 48 336 1000 336 1000 336 200 200 200 11 11 11 11 33 0 0 0 0 0 , 960 Tch Can F50 SipStick w/Confor SipStick w/Confor SipStick w/Confor SipStick w/Confor BGA Module 288 , PACKAGE Power Cap READ POINT QTY FAIL 2 2 2 231 225 99 0 0 0 Low Profile Module BGA Module


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PDF DS1621 DS1869 DE940040AAC DH833210AAB DS2181A DS5002 DE004552ABD DN012259AAL DN028766AAD 25821 dallas date code ds12887 25854
SH77722

Abstract: digital car dashboard SH-navij2 R8A77722DA01BGV BODY CONTROL MODULES features in car R8A77722DA02BGV Renesas Technology Release automotive gdi bosch E10A-USB SH77721
Text: , such as the MOST interface, over the SH-NaviJ1, the SH-NaviJ2 is provided in a 21 × 21 mm 449-pin BGA , frequency SH77722 (R8A77722DA01BGV) Sample Price [Tax Included] (Yen) 336 MHz 449-pin BGA , supply backup mode Package 449-pin BGA (21 mm × 21 mm) -###* Information contained in this


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PDF SH77722 SH77722 10-bit) 449-pin digital car dashboard SH-navij2 R8A77722DA01BGV BODY CONTROL MODULES features in car R8A77722DA02BGV Renesas Technology Release automotive gdi bosch E10A-USB SH77721
"Fast Cycle RAM"

Abstract: 256 PIN QFP ALTERA DIMENSION BGA and QFP Package altera cyclone 3 pins 256-pin Plastic BGA 100 PIN tQFP ALTERA DIMENSION 100 PIN PQFP ALTERA DIMENSION 240 PIN QFP ALTERA DIMENSION cyclone serial interface EP1C12
Text: FineLine® BGA packages (see Tables 1­2 through 1­3). Table 1­2. Cyclone Package Options and I/O Pin , ) FineLine BGA FineLine BGA FineLine BGA EP1C3 65 104 - - - - EP1C4 - - , . Cyclone QFP and FineLine BGA Package Sizes 100-Pin TQFP Dimension 144-Pin TQFP 240-Pin PQFP 256-Pin FineLine BGA 324-Pin FineLine BGA 400-Pin FineLine BGA Pitch (mm) 0.5 0.5


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PDF C51001-1 33-MHz, 32-bit 64-bit "Fast Cycle RAM" 256 PIN QFP ALTERA DIMENSION BGA and QFP Package altera cyclone 3 pins 256-pin Plastic BGA 100 PIN tQFP ALTERA DIMENSION 100 PIN PQFP ALTERA DIMENSION 240 PIN QFP ALTERA DIMENSION cyclone serial interface EP1C12
2008 - Not Available

Abstract: No abstract text available
Text: Product Number: 587-10-336-10-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 336-10-005 20 X 20 # Of Pins 336 Mill-Max Part Number 587-10-336-10-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737 BRASS ALLOY (UNS C36000) per ASTM B 16 Properties of BRASS ALLOY: Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1% Hardness as machined: 80-90 Rockwell B Density: .307 lbs/in3 Electrical conductivity: 26% IACS* Melting


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PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A
2009 - Not Available

Abstract: No abstract text available
Text: Product Number: 587-10-336-10-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 " Gold over 100 " Nickel 336-10-005 20 X 20 # Of Pins 336 Mill-Max Part Number 587-10-336-10-005437 RoHS Compliant LOOSE PIN: Pin Used: 8737 (Brass Alloy) BRASS ALLOY (UNS C36000) per ASTM B 16 Properties of BRASS ALLOY: Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1% Hardness as machined: 80-90 Rockwell B Density: .307 lbs/in3 Electrical conductivity: 26% IACS


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PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A
2005 - SF-BGA336B-B-32

Abstract: No abstract text available
Text: high temp material. Balls: Eutectic 63/37 SnPb. Description: Giga-snaP BGA SMT Foot 336 position (1.27mm pitch) gold plated female receptacle pins to SMT solder balls ( BGA type). Pin asignment 1:1


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PDF Alloy172, 254mm/0 203mm 254mm0 SF-BGA336B-B-32
2008 - Not Available

Abstract: No abstract text available
Text: Product Number: 587-10-336-10-007437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 336-10-007 20 X 20 # Of Pins 336 Mill-Max Part Number 587-10-336-10-007437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737 BRASS ALLOY (UNS C36000) per ASTM B 16 Properties of BRASS ALLOY: Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1% Hardness as machined: 80-90 Rockwell B Density: .307 lbs/in3 Electrical conductivity: 26% IACS* Melting


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PDF C36000) C/885 2002/95Annex 64-56A 64-22A/31A 65-17A
2003 - Not Available

Abstract: No abstract text available
Text: · Low output ripple · BGA /LGA construction · Temperature range: - 40°C to + 85°C · No external , ) under light load. The DC/DC converter is available in 20-ports BGA package. In order to satisfy the


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PDF FX5545G005 00W/inch3 30-Jun-03
2003 - Not Available

Abstract: No abstract text available
Text: · Low output ripple · BGA /LGA construction · Temperature range: - 40°C to + 85°C · No external , ) under light load. The DC/DC converter is available in 20-ports BGA package. In order to satisfy the


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PDF FX5545G305 80W/inch3 30-Jun-03
Supplyframe Tracking Pixel