The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial

324-ball Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2010 - 89HPES12NT12G2

Abstract: PCIe Switches 89HPES32NT24AG2 89HPES32NT8AG2 1156-BALL 324-BALL 89HPES24NT6AG2 gen2 pcie Gen2 payload "PCIe Switches"
Text: Gen2 2.0 23 x 23 484- ball BGA 89HPES12NT12G2 12 12 Gen2 2.1 19 x 19 324-ball BGA 89HPES16NT16G2 16 16 Gen2 2.1 19 x 19 324-ball BGA 89HPES24NT24G2 24 24 Gen2 2.1 19 x 19 324-ball BGA 89HPES24NT6AG2 24 6 Gen2 2.1 23 x 23 , 4 Gen2 2.0 19x19 324-ball BGA 89HPES6T6G2 6 6 Gen2 2.0 19x19 324-ball BGA 89HPES10T4BG2 10 4 Gen2 2.0 19x19 324-ball BGA 89HPES12T3BG2 12 3


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PDF 2-10/MG/BWD/DC/PDF/r4v2 PCIe-210 89HPES12NT12G2 PCIe Switches 89HPES32NT24AG2 89HPES32NT8AG2 1156-BALL 324-BALL 89HPES24NT6AG2 gen2 pcie Gen2 payload "PCIe Switches"
324-BALL

Abstract: No abstract text available
Text: °C. Packages and Packing Publication Revision A (3/1/03) 7-55 u Chapter 7 Trays Plastic Ball Grid Array: 324-Ball (23 mm x 23 mm) LBB Notes: (See next page for detailed views) 1 All dimensions , Array: 324-Ball (23 mm x 23 mm) LBB Notes: 1 All dimensions are in millimeters. 2 Trays can , u Chapter 7 Trays Plastic Ball Grid Array: 176- Ball (13 mm x 13 mm) LBA Notes: (See next , u Chapter 7 Trays Plastic Ball Grid Array: 176- Ball (13 x 13 mm) LBA Notes: 1 All dimensions


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PDF 176-Ball 324-Ball 424-Ball 324-BALL
2013 - SMD MARKING CODE sdp

Abstract: sama5d35
Text: Impedance Control on DDR I/Os Package  324-ball LFBGA, 15 x 15 x 1.4 mm, pitch 0.8 mm  324-ball TFBGA, 12 x 12 x 1.2 mm, pitch 0.5 mm Table 1-1. SAMA5D3 Device Differences , packages:   4.1 324-ball LFBGA (15 x 15 x 1.4 mm, pitch 0.8 mm) 324-ball TFBGA (12 x 12 x 1.2 mm, pitch 0.5 mm) 324-ball LFBGA Package (15 x 15 x 1.4 mm, pitch 0.8 mm) Figure 4-1 shows the ball map of the 324-ball LFBGA package. Figure 4-1. 324-ball LFBGA Ball Map Bottom VIEW V U T


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1999 - 82439TX

Abstract: 324-Pin f 324
Text: the mechanical dimensions for the MTXC. The package is a 324 pin ball grid array (BGA). Figure 98. MTXC 324-pin Ball Grid Array (BGA) TOP VIEW Pin #1 Corner SIDE VIEW D D1 Pin #1 I.D . , -pin Ball Grid Array (BGA) Ball Pattern Pin #1 Corner 1 2 3 4 5 6 7 8 9 10 11 , ) Table 125. MTXC 324-pin Ball Grid Array (BGA) Symbol e=1.27 (solder ball pitch) Min1 Nominal1 , millimeters. 2. `M' represents the maximum solder ball matrix size. 3. `N' represents the maximum allowable


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PDF 82439TX 324-pin f 324
2004 - Not Available

Abstract: No abstract text available
Text: with DMA Maximum Power Dissipation (W) 1 1 0.75 0.75 2.1 2.1 2.1 456 ball PBGA 456 ball PBGA 456 ball PBGA 456 ball PBGA 552 ball PBGA 552 ball PBGA 552 ball PBGA 324 ball PBGA 324 ball PBGA 324 ball PBGA 324 ball PBGA 324 ball PBGA 324 ball PBGA # of Streams Programmable at 2/4/8 Mbps Maximum


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PDF MEB90880 ZLE50111 MT90880-1-2-3 ZL50110-1-4
1999 - 4-Layer

Abstract: PIIX4 82371AB 324-PIN f 324 data sheet of Ball grid array
Text: outlines the mechanical dimensions for PIIX4. The package is a 324-pin ball grid array (BGA). Figure 36. PIIX4 324-Pin Ball Grid Array (BGA) TOP VIEW Pin #1 Corner SIDE VIEW D D1 Pin #1 I.D. E1 , -Pin Ball Grid Array (BGA) Ball Pattern Pin #1 Corner 2 1 3 4 5 6 7 8 9 10 11 , ) Table 70. PIIX4 324-Pin Ball Grid Array (BGA) e=1.27 (solder ball pitch) Symbol Min1 Nominal1 , ball matrix size. 3. `N' represents the maximum allowable number of solder balls. 4. PIIX4 is


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PDF 82371AB 324-pin 324-P2 4-Layer PIIX4 f 324 data sheet of Ball grid array
2013 - Not Available

Abstract: No abstract text available
Text: Output, Filtering Slew Rate Control on High Speed I/Os Impedance Control on DDR I/Os Package 324-ball , ] 11121BS–ATARM–08-Mar-13 9 4. Package and Pinout The SAMA5D3 product is available in a 324-ball LFBGA package. 4.1 Mechanical Overview of the 324-ball LFBGA Package Figure 4-1 shows the orientation of the 324-ball BGA Package. Figure 4-1. Orientation of the 324-ball LFBGA Package Bottom VIEW , 17 18 SAMA5D3 Series [SUMMARY DATASHEET] 11121BS–ATARM–08-Mar-13 10 4.2 324-ball


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PBSRAM

Abstract: 512 552 ZL50114 ZL50112 ZL50111 ZL50110 MT90883 MT90882 MT90881 ZL50117
Text: · 256 8 · 1 456 ball PBGA · · 2 2 · PBSRAM ZBT SSRAM · · 1 456 ball PBGA · · 2 2 · PBSRAM ZBT SSRAM · · 0.75 456 ball PBGA 8/0 · · 2 2 · PBSRAM ZBT SSRAM · · 0.75 456 ball PBGA 8/2 · , 552 ball PBGA ZL50111 · · · · · · · · · · · · · 1024 , 2.1 552 ball PBGA ZL50112 · · · · · · · · · · · · ·


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PDF MT90881 MT90882 MT90883 ZL50110 ZL50118 ZL50119 ZL50120 MEB90880 ZLE50111 MT90880-1-2-3 PBSRAM 512 552 ZL50114 ZL50112 ZL50111 ZL50110 MT90883 MT90882 MT90881 ZL50117
2007 - FTN256

Abstract: ft324 LCMXO640C-3TN144C F324 EUROPE lattice machxo lcmxo1200c MachXO2280C cd 7231 SO-DIMM 100-pin LFXP3C demo BP5867
Text: 211 211 324-ball ftBGA (19 x 19 mm) 271 * Number of LVDS outputs can be increased by , 256- BALL FTBGA 256- BALL FPBGA 324-BALL FPBGA 8 x 8 mm 0.5 mm pitch 14 x 14 mm 0.5 mm , FTN256 = 256- ball Lead-Free ftBGA FTN324 = 324-ball Lead-Free ftBGA Logic Capacity 3K LUTs = 3 6K , F324 = 324-ball fpBGA FT256 = 256- ball ftBGA FT324 = 324-ball ftBGA T100 = 100-pin Lead-Free TQFP , 256- ball Lead-Free fpBGA F324 = 324-ball Lead-Free fpBGA FT256 = 256- ball Lead-Free ftBGA FT324 =


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PDF TR-34742 D-59439 PL-41-800 FTN256 ft324 LCMXO640C-3TN144C F324 EUROPE lattice machxo lcmxo1200c MachXO2280C cd 7231 SO-DIMM 100-pin LFXP3C demo BP5867
2003 - Yamaichi IC51-1444-1354-7 footprint

Abstract: IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 enplas SY-PQ240 FPQ-256
Text: Package Actel Part Number Vendor Part Number 144- ball (13mmx13mm) SE-FG144-H E-tec: BPW144-1028-12AB01 256- ball (17mmx17mm) SE-FG256-H E-tec: BPW256-1028-16AB01 324-ball (19mmx19mm) SE-FG324-H E-tec: BPW324-1028-18AA01L 484- ball (23mmx23mm) SE-FG484-S-H E-tec: BPW484-1028-22AB01L 484- ball , -1028-26AB01 SE-FG676 E-tec: BPW676-1030-26AB01L or SE-FG676-H E-tec: BPW676-1028-26AB01L 896- ball (31mmx31mm) SE-FG896 E-tec: BPW896-1030-30AB01L 1152- ball (35mmx35mm) FBGA (1.00mm) Lead Count


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PDF piec-256 FPQ-256 Yamaichi IC51-1444-1354-7 footprint IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 enplas SY-PQ240 FPQ-256
2002 - BU-6474XB

Abstract: BU-64840R3 BU-64860B3
Text: ] (REF) Smallest Extended Industrial Temperature Range MIL-STD-1553 Micro-ACE TE Terminal - 324-Ball , - FEATURES .8 X .8 inches, 1 mm Ball Grid Array â , €¢ 324 Ball 1.0 mm Pitch Ball Grid Array 0.64 in2 Footprint • 0.120" Max Height • Fully , Micro-ACE verison is available in a 128- ball BGA package, rated for -40°C to +85°C operation. The , ] (TYP) Triangle denotes Ball A1 .065 [1.65] (TYP) TOP VIEW SIDE VIEW 0.140 [3.58] (MAX


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PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-6474XB BU-64840R3 BU-64860B3
2002 - BU-61860B

Abstract: bu61740b BU-61740B DDC total ace 1553 chip pcb footprint BU-BU-64863B 61840B 3E02 324 bga thermal BU-64863B BU-61840B
Text: Terminal 324-Ball Plastic BGA Single 3.3V supply required for 3.3V transceiver versions 5 Volt-Tolerant , , 5.0 Volt Only or Mixed Voltage Operation · 324 Ball 1.0 mm Pitch Ball Grid Array 0.64 in² Footprint , % Rollover Interrupts for Stacks & Circular Buffers .8 X .8 inches, 1 mm Ball Grid Array DESCRIPTION , for mixed 3.3V/5V operation. The Micro-ACE version is available in a 128- ball BGA package, rated for , ] (TYP) .065 [1.65] (TYP) .0394 [1.00] (TYP) .065 [1.65] (TYP) Triangle denotes Ball A1 TOP VIEW


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PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 BU-61860B bu61740b BU-61740B DDC total ace 1553 chip pcb footprint BU-BU-64863B 61840B 3E02 324 bga thermal BU-64863B BU-61840B
2002 - STANAG 3838

Abstract: BU-BU-64863B BU-64840R3 BU-61860B3-601
Text: 324-Ball Plastic BGA Single 3.3V supply required for 3.3V transceiver versions 5 Volt-Tolerant Logic , , 5.0 Volt Only or Mixed Voltage Operation · 324 Ball 1.0 mm Pitch Ball Grid Array 0.64 in² Footprint , % Rollover Interrupts for Stacks & Circular Buffers .8 X .8 inches, 1 mm Ball Grid Array DESCRIPTION , for mixed 3.3V/5V operation. The Micro-ACE version is available in a 128- ball BGA package, rated for , [1.65] (TYP) .0394 [1.00] (TYP) .065 [1.65] (TYP) Triangle denotes Ball A1 TOP VIEW SIDE


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PDF 6XB/6584XB/6586XB/61740B3/61840B3/61860B3 553A/B 20-Instruction 1-800-DDC-5757 A5976 STANAG 3838 BU-BU-64863B BU-64840R3 BU-61860B3-601
2008 - FTBGA

Abstract: 4032V ispMACH 4128V Telematic 4256ZC ispMACH 4000Z 132-ball package
Text: 2.2 267 1.8 20 48-pin TQFP 56- ball csBGA ispMACH 4064ZC 64 32+4 32+12 64+10 64+10 3.7 3.2 2.5 250 1.8 25 48-pin TQFP 56- ball csBGA 100-pin TQFP 132- ball , 132- ball csBGA ispMACH 4256ZC 256 64+10 96+6 128+4 4.5 3.8 2.9 200 1.8 55 100-pin TQFP 132- ball csBGA 176-pin TQFP ispMACH 4000V/B/C Family Attributes V = 3.3V, B = 2.5V , 2.0 322 3.3/2.5/1.8 2.0 100-pin TQFP 144-pin TQFP* 176-pin TQFP 256- ball ftBGA


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PDF 4000Z 4000Z 1-800-LATTICE I0160G FTBGA 4032V ispMACH 4128V Telematic 4256ZC ispMACH 4000Z 132-ball package
2003 - 4032V

Abstract: BC128 TQFP 132 PACKAGE ispMACH 4000 4128V ieee 1532 ISP e2cmos technology 132-ball package TQFP 256 4256ZC
Text: 2.2 267 1.8 20 48-pin TQFP 56- ball csBGA ispMACH 4064ZC 64 32+4 32+12 64+10 64+10 4 3.3 2.8 250 1.8 25 48-pin TQFP 56- ball csBGA 100-pin TQFP 132- ball csBGA ispMACH 4128ZC 128 64+10 96+4 4.5 3.9 2.9 220 1.8 30 100-pin TQFP 132- ball , -pin TQFP 132- ball csBGA 176-pin TQFP ispMACH 4000V/B/C Family Attributes V = 3.3V, B = 2.5V, C = 1.8V , 2.0 100-pin TQFP 144-pin TQFP* 176-pin TQFP 256- ball fpBGA* ispMACH 4384V/B/C 384


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PDF 4000Z 4000Z 1-800-LATTICE I0160INTL 4032V BC128 TQFP 132 PACKAGE ispMACH 4000 4128V ieee 1532 ISP e2cmos technology 132-ball package TQFP 256 4256ZC
2003 - XCR3384XL-10TQ144C

Abstract: t11 2581 FT256 DS024 XCR3384XL TQ144 PQ208 FG324 DS023 F1959
Text: user I/O) - 256- ball FBGA (212 user I/O) - 324-ball FBGA (220 user I/O) Optimized for 3.3V systems , -7FT256C 7.5 ns FT256 256- ball Fine-Pitch BGA (FT) C XCR3384XL-7FG324C 7.5 ns FG324 324-ball , FG324 324-ball Fineline BGA Package (FG) C XCR3384XL-10TQ144I 10 ns TQ144 144 , XCR3384XL-10FG324I 10 ns FG324 324-ball Fineline BGA Package (FG) I XCR3384XL , Fine-Pitch BGA (FT) C XCR3384XL-12FG324C 12 ns FG324 324-ball Fineline BGA Package (FG


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PDF XCR3384XL: DS024 XCR3384XL TQ144 XCR3384XL-10TQ144C t11 2581 FT256 DS024 PQ208 FG324 DS023 F1959
2003 - marking w13

Abstract: No abstract text available
Text: footprint packages - 144-pin TQFP (118 user I/O) - 208-pin PQFP (172 user I/O) - 256- ball FBGA (212 user I/O) - 324-ball FBGA (220 user I/O) Optimized for 3.3V systems - Ultra low power operation - 5V tolerant , FT256 FG324 No. of Pins 144-pin 208-pin 256- ball 324-ball 144-pin 208-pin 256- ball 324-ball 144-pin 208-pin 256- ball 324-ball 144-pin 208-pin 256- ball 324-ball 144-pin 208-pin 256- ball 324-ball , I/V curve, Figure 2; added Table 2: Total User I/O; changed VOH spec. Added 324-ball Fineline BGA


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PDF XCR3384XL: DS024 144-pin 208-pin 256-ball 324-ball TQ144 marking w13
2005 - TQ-144

Abstract: XCR3384XL-10FG324C
Text: -pin TQFP (118 user I/O) - 208-pin PQFP (172 user I/O) - 256- ball FBGA (212 user I/O) - 324-ball FBGA (220 , FG324 TQ144 PQ208 FT256 FG324 TQ144 PQ208 FT256 FG324 No. of Pins 144-pin 208-pin 256- ball 324-ball 144-pin 208-pin 256- ball 324-ball 144-pin 208-pin 256- ball 324-ball 144-pin 208-pin 256- ball 324-ball 144-pin 208-pin 256- ball 324-ball Package Type Thin Quad Flat Pack (TQFP) Plastic Quad Flat Pack , I/V curve, Figure 2; added Table 2: Total User I/O; changed VOH spec. Added 324-ball Fineline BGA


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PDF XCR3384XL: DS024 144-pin 208-pin 256-ball 324-ball TQ144 TQ-144 XCR3384XL-10FG324C
2003 - Not Available

Abstract: No abstract text available
Text: user I/O) - 208-pin PQFP (172 user I/O) - 256- ball FBGA (212 user I/O) - 324-ball FBGA (220 user I/O , FT256 256- ball Fine-Pitch BGA (FT) C XCR3384XL-7FG324C 7.5 ns FG324 324-ball , FG324 324-ball Fineline BGA Package (FG) C XCR3384XL-10TQ144I 10 ns TQ144 144 , XCR3384XL-10FG324I 10 ns FG324 324-ball Fineline BGA Package (FG) I XCR3384XL , Fine-Pitch BGA (FT) C XCR3384XL-12FG324C 12 ns FG324 324-ball Fineline BGA Package (FG


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PDF XCR3384XL: DS024 XCR3384XL TQ144
FTBGA 256

Abstract: LCMXO2280C-3FTN256I LCMXO256C-3TN100I LCMXO1200C-3FTN256I LCMXO640C-3TN100I LCMXO1200C FTN256 LCMXO2280C-4FTN324C LCMXO2280C-3FTN324C DS1002
Text: ) 100- ball csBGA (8x8 mm) 78 74 132- ball csBGA (8x8 mm) 101 101 101 256- ball ftBGA (17x17 mm) 159 211 211 324-ball ftBGA (19x19 mm) 271 1-1 DS1002 Introduction , T144 = 144-pin TQFP M100 = 100- ball csBGA M132 = 132- ball csBGA FT256 = 256- ball ftBGA FT324 = 324-ball , 100-pin Lead-Free TQFP TN144 = 144-pin Lead-Free TQFP MN100 = 100- ball Lead-Free csBGA MN132 = 132- ball Lead-Free csBGA FTN256 = 256- ball Lead-Free ftBGA FTN324 = 324-ball Lead-Free ftBGA Speed 3 = Slowest 4


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PDF DS1002 N144I LCMXO2280C-4TN144I LCMXO2280C-3MN132I LCMXO2280C-4MN132I LCMXO2280C-3FTN256I LCMXO2280C-4FTN256I LCMXO2280C-3FTN324I LCMXO2280C-4FTN324I FTBGA 256 LCMXO2280C-3FTN256I LCMXO256C-3TN100I LCMXO1200C-3FTN256I LCMXO640C-3TN100I LCMXO1200C FTN256 LCMXO2280C-4FTN324C LCMXO2280C-3FTN324C DS1002
FTBGA

Abstract: LCMXO2280C-3MN132C DS1002 LCMXO1200E-3FTN256C LCMXO2280C-4FTN324C FTBGA 256 fT324 tsum_pfu LCMXO2280C-3FTN256C LCMXO2280C-3FTN324C
Text: ) 100- ball csBGA (8x8 mm) 78 74 132- ball csBGA (8x8 mm) 101 101 101 256- ball ftBGA (17x17 mm) 159 211 211 324-ball ftBGA (19x19 mm) 271 1-1 DS1002 Introduction , T144 = 144-pin TQFP M100 = 100- ball csBGA M132 = 132- ball csBGA FT256 = 256- ball ftBGA FT324 = 324-ball , 100-pin Lead-Free TQFP TN144 = 144-pin Lead-Free TQFP MN100 = 100- ball Lead-Free csBGA MN132 = 132- ball Lead-Free csBGA FTN256 = 256- ball Lead-Free ftBGA FTN324 = 324-ball Lead-Free ftBGA Speed 3 = Slowest 4


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PDF DS1002 LCMXO2280E-4MN132C LCMXO2280E-5MN132C LCMXO2280E-3FTN256C LCMXO2280E-4FTN256C LCMXO2280E-5FTN256C LCMXO2280E-3FTN324C LCMXO2280E-4FTN324C LCMXO2280E-5FTN324C FTBGA LCMXO2280C-3MN132C DS1002 LCMXO1200E-3FTN256C LCMXO2280C-4FTN324C FTBGA 256 fT324 tsum_pfu LCMXO2280C-3FTN256C LCMXO2280C-3FTN324C
2003 - Not Available

Abstract: No abstract text available
Text: user I/O) - 208-pin PQFP (172 user I/O) - 256- ball FBGA (212 user I/O) - 324-ball FBGA (220 user I/O , FT256 256- ball Fine-Pitch BGA (FT) C XCR3384XL-7FG324C 7.5 ns FG324 324-ball , FG324 324-ball Fineline BGA Package (FG) C XCR3384XL-10TQ144I 10 ns TQ144 144 , XCR3384XL-10FG324I 10 ns FG324 324-ball Fineline BGA Package (FG) I XCR3384XL , Fine-Pitch BGA (FT) C XCR3384XL-12FG324C 12 ns FG324 324-ball Fineline BGA Package (FG


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PDF XCR3384XL: DS024 XCR3384XL TQ144
2002 - Micro-ACE-TE

Abstract: No abstract text available
Text: €¢ RT Only Version Available • Small Plastic Package - 128- ball or 324-ball BGA Package - 0.815 , Conditions The Micro-ACE version is available in a 128- ball BGA package, rated for -40°C to +85°C , ) .0394 [1.00] (TYP) Triangle denotes Ball A1 SIDE VIEW 0.140 [3.58] (MAX) 0.015 [0.38] (REF) .025 [0.64] DIA Sn/Pb BALL (127 PLACES) Notes: 1) Dimensions are in inches (mm). Data Device , 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0.120 [3.05] (MAX) .022 [0.56] DIA Sn/Pb BALL


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PDF BU-6474XB, BU-6484/6486/6586XB, BU-61740/61840/61860B3 MIL-STD-1553 MIL-STD-1760 128-ball 324-ball AS9100 Micro-ACE-TE
2002 - 1156-BALL

Abstract: bga 896 411PI BF957 132-ball package
Text: PQ304, HQ304 SOIC SO8, VO8 256- ball Fine Pitch BGA 324-ball Fine Pitch BGA 456- ball Fine Pitch BGA 556- ball Fine Pitch BGA 676- ball Fine Pitch BGA 680- ball Fine Pitch Metal BGA - Cavity Down 860- ball Fine Pitch , PG411 PG475 PG559 Plastic DIP PD08 PD48 Chip Scale CP56 CS48 CS144 CS280 Package Description 1156- ball , -pin Ceramic PGA 559-pin Ceramic PGA 8-pin Plastic DIP 48-pin Plastic DIP 56- ball Chip Scale BGA (0.50mm Pitch) 48- ball Chip Scale BGA 144- ball Chip Scale BGA 280- ball Chip Scale BGA 460 KB (v1.0) 12/19/01


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PDF Q1-02 XAPP415 CG1156 CB100 CB164 CB196 CB228 PG120 PG132 PG156 1156-BALL bga 896 411PI BF957 132-ball package
2005 - xcr3512xl

Abstract: XCR3512XL-12PQ208I XCR3512XL-10FG324I FT256
Text: -pin PQFP (180 user I/O) - 256- ball FBGA (212 user I/O) - 324-ball FBGA (260 user I/O) Optimized for 3.3V , FG324 No. of Pins 208-pin 256- ball 324-ball 208-pin 256- ball 324-ball 208-pin 256- ball 324-ball 208-pin 256- ball 324-ball 208-pin 256- ball 324-ball Package Type Plastic Quad Flat Pack (PQFP) Fine-Pitch


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PDF XCR3512XL: DS081 208-pin 256-ball 324-ball xcr3512xl XCR3512XL-12PQ208I XCR3512XL-10FG324I FT256
Supplyframe Tracking Pixel