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TMS320C28344ZEPQ TMS320C28344ZEPQ ECAD Model Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
TMS320C28342ZEPQ TMS320C28342ZEPQ ECAD Model Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
TMS320C28343ZEPQ TMS320C28343ZEPQ ECAD Model Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
TMX320C28346ZFE TMX320C28346ZFE ECAD Model Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
TMS320C28341ZEPQ TMS320C28341ZEPQ ECAD Model Texas Instruments Delfino Microcontroller 256-BGA Visit Texas Instruments
AM1707DZKBT3 AM1707DZKBT3 ECAD Model Texas Instruments Sitara Processor 256-BGA Visit Texas Instruments

32.768 BGA Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1999 - Not Available

Abstract: No abstract text available
Text: · No calibration · Low power consumption · Surface mountable using BGA package VCC: VBAT: 32KHZ , MODULE (300 MIL) ORDERING INFORMATION Part Number DS32KHZ/ BGA DS32KHZN/ BGA DS32KHZ/DIP DS32KHZN/DIP Package 36­pin BGA 36­pin BGA 14­pin DIP 14­pin DIP Temp. Range Commercial Industrial Commercial , packaged in a small 36­pin SMD, utilizing Ball Grid Array ( BGA ) technology, with dimensions 0.400 inches , PATTERN LAYOUT (36­PIN BGA ) 081299 6/7 DS32kHz 14­PIN DIP MODULE 14 8 1 A 7 C E


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PDF DS32KHz DS32KHz 32KHZ: 32KHz
2000 - J-STD-020A

Abstract: No abstract text available
Text: mountable using BGA package VCC: VBAT: 32 kHz: GND: A D 2 3 4 5 6 7 8 9 DS32KHz 36 , -pin BGA 36-pin BGA 14-pin DIP 14-pin DIP C 1 NC NC 14 13 VCC 3 12 32 kHz , Commercial Industrial Commercial Industrial 1 2 ORDERING INFORMATION Part Number DS32KHZ/ BGA DS32KHZN/ BGA DS32KHZ/DIP DS32KHZN/DIP B 7 8 NC DS32KHz 14-Pin Dip Module (300 mil , is packaged in a small 36­pin SMD, utilizing Ball Grid Array ( BGA ) technology, with dimensions 0.400


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PDF DS32KHz DS32KHz 36-Pin 14-pin J-STD-020A
2000 - Not Available

Abstract: No abstract text available
Text: Surface mountable using BGA package VCC: VBAT: 32 kHz: GND: A D 2 3 4 5 6 7 8 9 , Package 36-pin BGA 36-pin BGA 14-pin DIP 14-pin DIP C 1 NC NC 14 13 VCC 3 12 , DS32KHZ/ BGA DS32KHZN/ BGA DS32KHZ/DIP DS32KHZN/DIP B 7 8 NC DS32KHz 14-Pin Dip Module , Array ( BGA ) technology, with dimensions 0.400 inches wide, 0.450 inches long, and 0.180 inches high , RECOMMENDED LAND PATTERN LAYOUT (36-Pin BGA ) 32 7 of 8 DS32KHz 14-PIN DIP MODULE NOTE: PINS 2,3


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PDF DS32KHz DS32KHz 36-Pin 14-pin
2BL4

Abstract: DS32KHZ quartz 32khz gmd-32 34D72
Text: : -40°C to +85°C ■No calibration required ■Low power consumption ■Surface mountable using BGA , INFORMATION Part Number DS32KHZ/ BGA DS32KHZN/ BGA DS32KHZ/DIP DS32KHZN/DIP Package 36-pin BGA 36-pin BGA 14 , DS32kHz The DS32KHz is packaged in a small 36-pin SMD, utilizing Ball Grid Array ( BGA ) technology, with , DO oo OO oo oo oo oo oo RECOMMENDED LAND PATTERN LAYOUT (36-Pin BGA ) FJN 1 .036 .025 .000 ,013


OCR Scan
PDF DS32KHZ Cto40Â 32KHz: DS32KHZ/BGA DS32KHZN/BGA DS32KHZ/DIP DS32KHZN/DIP 36-pin 14-pin 2BL4 quartz 32khz gmd-32 34D72
1999 - ds32khz

Abstract: No abstract text available
Text: using BGA package VCC: VBAT: 32KHz: GND: C2, C3, D2, D3 A4, A5, B4, B5 C4, C5, D4, D5 All Remaining , 10 9 8 ORDERING INFORMATION Part Number DS32KHZ/ BGA DS32KHZN/ BGA DS32KHZ/DIP DS32KHZN/DIP Package 36-pin BGA 36-pin BGA 14-pin DIP 14-pin DIP Temp. Range Commercial Industrial Commercial Industrial , Array ( BGA ) technology, with dimensions 0.400 inches wide, 0.450 inches long, and 0.180 inches high , PATTERN LAYOUT (36-Pin BGA ) 6 of 7 102099 DS32kHz 14-PIN DIP MODULE NOTE: PINS 2,3 ARE


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PDF DS32KHz 32KHz: 36-Pin DS32KHZ/BGA DS32KHZN/BGA DS32KHZ/DIP DS32KHZN/DIP
1999 - 32.768 BGA

Abstract: ds32khz-n
Text: calibration required Low power consumption Surface mountable using BGA package VCC : VBAT : 32KHz: GND , , C5, D4, D5 All Remaining Balls Package 36-pin BGA 36-pin BGA 14-pin DIP 14-pin DIP C 1 , Commercial Industrial 1 2 ORDERING INFORMATION Part Number DS32KHZ/ BGA DS32KHZN/ BGA DS32KHZ/DIP , Array ( BGA ) technology, with dimensions 0.400 inches wide, 0.450 inches long, and 0.180 inches high , DIMENSIONS RECOMMENDED LAND PATTERN LAYOUT (36-Pin BGA ) 6 of 7 110399 DS32kHz 14-PIN DIP


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PDF DS32KHz 32KHz: DS32KHz 36-Pin 14-pin 32KHz 32.768 BGA ds32khz-n
32KHZ

Abstract: DS32KHZ
Text: €¢ Low power consumption • Surface mountable using BGA package VCC: C2, C3, D2, D3 VBAT: A4, A5, B4 , -pin SMD, utilizing Ball Grid Array ( BGA ) technology, with dimensions 0.400 inches wide, 0.450 inches long , -PIN BGA ) o cm in r^ ocmcm in os ^ in Nooo csi m r^ o O O O O <- CM CM CMCMro n ro 041599 6/7 r This


OCR Scan
PDF DS32KHZ 32KHZ: DS32KHz 36-PIN 010TNA 14-PIN 32KHZ
2007 - xtal 32.768

Abstract: xtal 32768 UBX-G5010 UBLOX UBX-G5010-A00-ST ic 7447 UBX-G5000 pin diagram of ic 7447 IC 7447 diagram circuit IC 7447 PIN CONNECTION DIAGRAM
Text: Memory Interf. ( BGA only) Data width: 16 bits Address space: 3 x 4 M Bytes Serial Interfaces , Multipath Suppression NMEA, UBX Binary General-Purpose I/O Ports Package: BGA 56 Pin QFN GPIOs , kHz Synthesizer Fractional N 24 Pin QFN, 4 x 4 x 0.9 mm 100 Pin BGA , 9 x 9 x 1 mm , UBX-G5000-A00-BT u-blox 5 Baseband Processor, 100 pin BGA UBX-G0010-A00-QT u-blox 5 RF Front-End IC, 24


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PDF UBX-G5010, UBX-G5000 G5-X-06042-P4 xtal 32.768 xtal 32768 UBX-G5010 UBLOX UBX-G5010-A00-ST ic 7447 UBX-G5000 pin diagram of ic 7447 IC 7447 diagram circuit IC 7447 PIN CONNECTION DIAGRAM
2004 - 68EC000

Abstract: M68000 MC68328 MC68EZ328 MC68VZ328 MC68328PV csc 2314
Text: replacing a BGA EZ part with a BGA VZ part that does not require changing hardware platforms. 1 , and BGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3 Upgrading EZ ( BGA ) to VZ ( BGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.1 , appropriately. The second main section describes a method for directly replacing a BGA EZ part with a BGA VZ


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PDF MC68328 MC68EZ328 MC68VZ328 AN1847/D CH370 MA15/A16 MA14/A15 MA13/A14 MA12/A13 MA11/A12 68EC000 M68000 MC68EZ328 MC68VZ328 MC68328PV csc 2314
2001 - Not Available

Abstract: No abstract text available
Text: Interface With 'C6x DSPs Available in 80-Pin Thin Quad Flat Pack (TQFP) and 100-Pin Ball Grid Array ( BGA


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PDF SN74V263, SN74V273, SN74V283, SN74V293 SCAS669D SN74V263 SN74V273 SN74V283 SN74V293 166-MHz
Theta-JC dip-16

Abstract: No abstract text available
Text: to +85°C (Industrial) No Calibration Required Low-Power Consumption Surface Mountable Using BGA , DIP 14 DIP 16 SO (0.300") 16 SO (0.300") 16 SO (0.300") 16 SO (0.300") 36 BGA 36 BGA PINPACKAGE , .-40°C to +85°C Soldering Temperature ( BGA , SO).See the Handling, PC Board Layout , 13 14 BGA C4, C5, D4, D5 C2, C3, D2, D3 A7, A8, B7, B8, C7, C8, D7, D8 All remaining balls A4, A5, B4 , DS32kHz is packaged in a 36-pin ball grid array ( BGA ). It also is available in a 16-pin 0.300" SO and a 14


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PDF DS32kHz 768kHz 768kHz. DS32kHz) DS32kHz-N) 14-pin 16-pin 36-pin 56-G0001-002 Theta-JC dip-16
2007 - Not Available

Abstract: No abstract text available
Text: Calibration Required Low-Power Consumption Surface Mountable Using BGA Package UL Recognized ORDERING , 16 SO (0.300”) 16 SO (0.300”) 16 SO (0.300”) 16 SO (0.300”) 36 BGA 36 BGA DS32KHZ , to +85°C Soldering Temperature ( BGA , SO)……………………….See the Handling , FUNCTION SO BGA DIP 1 C4, C5, D4, D5 12 32kHz 2 C2, C3, D2, D3 13 VCC , from +40°C to +85°C. 5 of 8 DS32kHz The DS32kHz is packaged in a 36-pin ball grid array ( BGA ).


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PDF DS32kHz 768kHz DS32kHz 768kHz. DS32kHz) DS32kHz-N) 14-pin 16-pin 36-pin 56-G0001-002
2007 - BGA-56 DATASHEET

Abstract: DS32KHZ DS32KHZ-N DS32KHZS DS32KHZSN JESD97
Text: Consumption Surface Mountable Using BGA Package UL Recognized ORDERING INFORMATION PART TEMP RANGE , (0.300") 16 SO (0.300") 36 BGA 36 BGA DS32KHZ DS32KHZ-N DS32KHZS DS32KHZS DS32KHZSN DS32KHZSN , .-40°C to +85°C Soldering Temperature ( BGA , SO).See the Handling, PC Board , DS32kHz PIN DESCRIPTION PIN NAME FUNCTION SO BGA DIP 1 C4, C5, D4, D5 12 , -pin ball grid array ( BGA ). It also is available in a 16-pin 0.300" SO and a 14-pin encapsulated DIP (EDIP


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PDF DS32kHz 768kHz DS32kHz 768kHz. DS32kHz) DS32kHz-N) 14-pin 16-pin 36-pin 56-G0001-002 BGA-56 DATASHEET DS32KHZ-N DS32KHZS DS32KHZSN JESD97
2000 - csc 2313 f

Abstract: csc 2314 mc68328pv csc 2313 0xFFFFF906 MC68EZ328 68EC000 M68000 MC68328 MC68VZ328
Text: replacing a BGA EZ part with a BGA VZ part that does not require changing hardware platforms. 1 , and BGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 , . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 3 Upgrading EZ ( BGA ) to VZ ( BGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 3.1 , method for directly replacing a BGA EZ part with a BGA VZ part. Users who require information about this


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PDF MC68328 MC68EZ328 MC68VZ328 AN1847/D MA15/A16 MA14/A15 MA13/A14 MA12/A13 MA11/A12 csc 2313 f csc 2314 mc68328pv csc 2313 0xFFFFF906 MC68EZ328 68EC000 M68000 MC68VZ328
1998 - MSM5052

Abstract: QFP80-P-1420-0 thermistor 7 rom
Text: ), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting , Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount , Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which


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PDF E2E0008-38-94 MSM5052 MSM5052 QFP80-P-1420-0 80-BK thermistor 7 rom
2007 - Not Available

Abstract: No abstract text available
Text: (Industrial) No Calibration Required Low-Power Consumption Surface Mountable Using BGA Package UL , 14 DIP 14 DIP 16 SO (0.300”) 16 SO (0.300”) 16 SO (0.300”) 16 SO (0.300”) 36 BGA 36 BGA TOP MARK* DS32KHZ DS32KHZ-N DS32KHZS DS32KHZS DS32KHZSN DS32KHZSN DS32KHZ DS32KHZ-N , to +85°C Soldering Temperature ( BGA , SO)……………………….See the Handling , FUNCTION SO BGA DIP 1 C4, C5, D4, D5 12 32kHz 2 C2, C3, D2, D3 13 VCC


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PDF DS32kHz 768kHz DS32kHz 768kHz. DS32kHz) DS32kHz-N) 14-pin 16-pin 36-pin 56-G0001-002
2001 - Not Available

Abstract: No abstract text available
Text: Interface With 'C6x DSPs Available in 80-Pin Thin Quad Flat Pack (TQFP) and 100-Pin Ball Grid Array ( BGA


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PDF SN74V263, SN74V273, SN74V283, SN74V293 SCAS669D SN74V263 SN74V273 SN74V283 SN74V293 166-MHz
2001 - Not Available

Abstract: No abstract text available
Text: Interface With 'C6x DSPs Available in 80-Pin Thin Quad Flat Pack (TQFP) and 100-Pin Ball Grid Array ( BGA


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PDF SN74V263, SN74V273, SN74V283, SN74V293 SCAS669D SN74V263 SN74V273 SN74V283 SN74V293 166-MHz
2001 - Not Available

Abstract: No abstract text available
Text: Interface With 'C6x DSPs Available in 80-Pin Thin Quad Flat Pack (TQFP) and 100-Pin Ball Grid Array ( BGA


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PDF SN74V263, SN74V273, SN74V283, SN74V293 SCAS669D SN74V263 SN74V273 SN74V283 SN74V293 166-MHz
2001 - Not Available

Abstract: No abstract text available
Text: Interface With 'C6x DSPs Available in 80-Pin Thin Quad Flat Pack (TQFP) and 100-Pin Ball Grid Array ( BGA


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PDF SN74V263, SN74V273, SN74V283, SN74V293 SCAS669D SN74V263 SN74V273 SN74V283 SN74V293 166-MHz
2000 - mc68328pv

Abstract: 68EC000 M68000 MC68328 MC68EZ328 MC68VZ328 csc 2313 f csc 2314 MC6832
Text: for directly replacing a BGA EZ part with a BGA VZ part that does not require changing hardware , Pin Assignments (TQFP and BGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . , . . 18 3 Upgrading EZ ( BGA ) to VZ ( BGA ) . . . . . . . . . . . . . . . . . . . . . . . . . . . , system designs appropriately. The second main section describes a method for directly replacing a BGA EZ part with a BGA VZ part. Users who require information about this procedure can go directly to Section


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PDF MC68328 MC68EZ328 MC68VZ328 AN1847/D MA15/A16 MA14/A15 MA13/A14 MA12/A13 MA11/A12 MA10/A11 mc68328pv 68EC000 M68000 MC68EZ328 MC68VZ328 csc 2313 f csc 2314 MC6832
2001 - SN74V263

Abstract: SN74V263-6 SN74V273 SN74V273-6 SN74V283 SN74V283-6 SN74V293
Text: Pack (TQFP) and 100-Pin Ball Grid Array ( BGA ) Packages description The SN74V263, SN74V273


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PDF SN74V263, SN74V273, SN74V283, SN74V293 SCAS669D SN74V263 SN74V273 SN74V283 166-MHz SN74V263 SN74V263-6 SN74V273 SN74V273-6 SN74V283 SN74V283-6 SN74V293
2007 - Not Available

Abstract: No abstract text available
Text: (Industrial) No Calibration Required Low-Power Consumption Surface Mountable Using BGA Package UL , 14 DIP 14 DIP 16 SO (0.300”) 16 SO (0.300”) 16 SO (0.300”) 16 SO (0.300”) 36 BGA 36 BGA TOP MARK* DS32KHZ DS32KHZ-N DS32KHZS DS32KHZS DS32KHZSN DS32KHZSN DS32KHZ DS32KHZ-N , to +85°C Soldering Temperature ( BGA , SO)……………………….See the Handling , FUNCTION SO BGA DIP 1 C4, C5, D4, D5 12 32kHz 2 C2, C3, D2, D3 13 VCC


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PDF DS32kHz 768kHz DS32kHz 768kHz. DS32kHz) DS32kHz-N) 14-pin 16-pin 36-pin 56-G0001-002
2001 - Not Available

Abstract: No abstract text available
Text: Interface With 'C6x DSPs Available in 80-Pin Thin Quad Flat Pack (TQFP) and 100-Pin Ball Grid Array ( BGA


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PDF SN74V263, SN74V273, SN74V283, SN74V293 SCAS669D SN74V263 SN74V273 SN74V283 SN74V293 166-MHz
2001 - SN74V263

Abstract: SN74V263-6 SN74V273 SN74V273-6 SN74V283 SN74V283-6 SN74V293
Text: Pack (TQFP) and 100-Pin Ball Grid Array ( BGA ) Packages description The SN74V263, SN74V273


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PDF SN74V263, SN74V273, SN74V283, SN74V293 SCAS669D SN74V263 SN74V273 SN74V283 166-MHz SN74V263 SN74V263-6 SN74V273 SN74V273-6 SN74V283 SN74V283-6 SN74V293
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