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TE28F016B3B90
TE28F016B3B90 ECAD Model
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28F016B3 datasheet (18)

Part ECAD Model Manufacturer Description Type PDF
28F016B3 28F016B3 ECAD Model Intel SMART 3 ADVANCED BOOT BLOCK BYTE-WIDE, 8-MBIT (1024K x 8), 16-MBIT (2056K x 8) FLASH MEMORY FAMILY Original PDF
28F016B3 28F016B3 ECAD Model Intel SMART 3 ADVANCED BOOT BLOCK, 4-, 8-, 16-, 32-MBIT FLASH MEMORY FAMILY Original PDF
28F016B3 28F016B3 ECAD Model Intel 3-Volt Advanced Boot Block Flash Memory Original PDF
28F016B3B110 28F016B3B110 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3B120 28F016B3B120 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3B150 28F016B3B150 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3B80 28F016B3B80 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3B90 28F016B3B90 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3BA110 28F016B3BA110 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3BA90 28F016B3BA90 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3BTA110 28F016B3BTA110 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3T110 28F016B3T110 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3T120 28F016B3T120 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3T150 28F016B3T150 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3T80 28F016B3T80 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3T90 28F016B3T90 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3TA110 28F016B3TA110 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF
28F016B3TA90 28F016B3TA90 ECAD Model Intel Advanced Boot Block Flash Memory (B3) Original PDF

28F016B3 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1997 - INTEL 28F640

Abstract: transistor b 1238 socket s1 pinouts Advanced Micro Devices 165 ball top mark e5 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3
Text: . 18 4.3 µBGA* Package Dimensions for Boot Block Memory Components 28F016B3_A /28F160B3_A /28F320B3 , 28F016B3 / 28F016B3_A (x8) . 25 4.10 Table for , , 28F008B3, 28F016B3 , 28F016B3_A /28F160B3_A /28F032B3_A /28F320B3_A, and 28F016C3/28F160C3/28F032C3 , for 28F800B3/28F160B3/28F008B3/ 28F016B3 28F016B3_A /28F160B3_A/28F320B3_A and 28F160C3/28F320C3 , Dimensions for Boot Block Memory Components 28F016B3_A /28F160B3_A /28F320B3_A and 28F160C3/28F320C3 Devices


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PDF RD33704SW RD33708SW 28F800B3 28F160B3 CBG060-044A 28F160B3 28F016B3 28F160C3 CBG048-035C INTEL 28F640 transistor b 1238 socket s1 pinouts Advanced Micro Devices 165 ball top mark e5 28F008B3 28F008S3 28F016S3
1997 - INTEL 28F640

Abstract: Intel 8275 Block diagram 2k36e 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3 28F160B3 28F800B3
Text: . 14 4.3 µBGA Package Dimensions for Boot Block Memory Components 28F016B3_A /28F160B3_A / 28F032B3 , . 19 4.8 µBGA Package Schematics for 28F016B3 / 28F016B3_A /28F016C3 . 20 4.9 Table for Signal to Ball Assignment for 28F008B3/ 28F016B3 / 28F016B3_A /28F016C3 (x8 , , 28F016B3_A /28F160B3_A /28F032B3_A /28F320B3_A, and 28F016C3/28F160C3/28F032C3/28F320C3 device information , µBGA* Package Specifications for 28F800B3/28F160B3/28F008B3/ 28F016B3 28F016B3_A /28F160B3_A/28F032B3


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PDF 28F640J5 RD33708SW RD33716SW NP291-04002-G4-BF-P 28F160B3 28F008S3 28F160F3 CBG060-044A INTEL 28F640 Intel 8275 Block diagram 2k36e 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3 28F160B3 28F800B3
1997 - 8275 intel

Abstract: intel d 8275 Intel 8275 28F160B3 28F800B3 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3
Text: . 14 4.3 48-Ball µBGA Package Dimensions for Boot Block Memory Components 28F016B3_A /28F160B3 , . 19 4.8 µBGA Package Schematics for 28F016B3 / 28F016B3_A /28F016C3 . 20 4.9 Table for Signal to Ball Assignment for 28F008B3/ 28F016B3 / 28F016B3_A /28F016C3 (x8 , media information 05/12/98 3.7 Added 28F800B3, 28F160B3, 28F008B3, 28F016B3 , 28F016B3_A , * Package Specifications for 28F800B3/28F160B3/28F008B3/ 28F016B3 28F016B3_A /28F160B3_A/28F032B3_A/28F320B3


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PDF 28F008S3 RD33704SW RD33708SW 28F800B3 RD33716SW 28F160B3 28F640J5 8275 intel intel d 8275 Intel 8275 28F160B3 28F800B3 28F008B3 28F008S3 28F016B3 28F016S3 28F032B3
1997 - INTEL 28F640

Abstract: 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F800B3 intel DOC 28F800F3 intel i5 block diagram
Text: . 14 4.3 µBGA* Package Dimensions for Boot Block Memory Components 28F016B3_A /28F160B3_A /28F032B3 , / 28F016B3_A /28F016C3 (x8) . 21 4.10 µBGA* Package Schematics , Signal to Ball Assignment for 28F008B3/ 28F016B3 / 28F016B3_A /28F016C3/28F032B3_A/28F032C3 (x8 , , 28F016B3 , 28F016B3_A /28F160B3_A /28F032B3_A /28F320B3_A, and 28F016C3/28F160C3/28F032C3/28F320C3 device , for 28F800B3/28F160B3/28F008B3/ 28F016B3 28F016B3_A /28F160B3_A/28F032B3_A/28F320B3_A and 28F016C3


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PDF RD33708SW 28F640J5 28F160F3 RD33716SW INTEL 28F640 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F800B3 intel DOC 28F800F3 intel i5 block diagram
1999 - INTEL 28F640

Abstract: BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
Text: 28F016B3_A / 28F160B3_A /28F320B3_A and 28F160C3_A / 28F320C3_A Devices Only , , 28F016B3 , 28F016B3_A / 28F160B3_A /28F032B3_A /28F320B3_A, and 28F016C3_A /28F160C3_A / 28F032C3 , * Package Specifications for 28F800B3/28F160B3/28F008B3/ 28F016B3 28F016B3_A /28F160B3_A/28F320B3_A and , µBGA* Package Dimensions for Boot Block Memory Components 28F016B3_A /28F160B3_A /28F320B3_A and , _A 28F016B3_A 28F160C3_A 28F320B3 (VF BGA) 28F320C3 (VF BGA) 18.9 8.7 12.4 10.9 25 10


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PDF 12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 INTEL 28F640 application 298161 vf bga BGA PACKAGE TOP MARK BGA package tray 64 28F008B3 28F160B3
1999 - free circuit eprom programmer

Abstract: 28F016B3
Text: HSP ADAPTER SYSTEM GENERAL FLASH EPROM Hi-Speed Programming U B G A4 8 - 2 . H S P S OCK E T B OAR D v Date : 1999/2/6 v Board ID : 0Ah v Socket : NP291-04808-G4-BF-P (YAMAICHI) v Devices List : Manufacture Intel Device 28F016B3-T /B v Programming Time : Copy Mode Programming Time RAM Mode Device Name Erase Blank Program Verify Erase Blank Program Verify Intel 28F016B3-T /B 14" 2" 20" 3" 14" 2" 36" 36


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PDF NP291-04808-G4-BF-P 28F016B3-T/B free circuit eprom programmer 28F016B3
1998 - 9374

Abstract: EDI7F4342MV 28F016B3
Text: EDI7F4342MV 4x2Megx32 Features 4x2Megx32 Flash Module 4 x 2 Meg x 32 Based on Intel's 28F016B3 Flash Device Fast Read Access Time - 120ns Flexible Smart Voltage 2.7-3.6V Program Erase 2.7-3.6V Read Operation 12Vpp Fast Production Programming Low Power Dissipation 30mA per Device Active Current 10µA per Device CMOS Standby Current Typical Endurance >100,000 Cycles Single 3.0 , . The module is based on Intel's 28F016B3 - 2Megx8 Flash device in TSOP packages which are mounted on


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PDF EDI7F4342MV 4x2Megx32 4x2Megx32 28F016B3 120ns 12Vpp EDI7F4342MV EDI7F4342MV150BNC 01581USA 9374
Not Available

Abstract: No abstract text available
Text: ^EDI EDI7F4342MV i ELECTRONIC DESIGNS, INC. Features 4x2Megx32 4x2Megx32 Flash Module • 4 x 2 Meg x 32 The EDI7F4342MV is organized asfourbanks of 2 Meg x32. • Based on Intel's 28F016B3 Flash Device The module is based on Intel's 28F016B3 - 2Megx8 Flash • Fast Read Access Time - 120ns device in TSOP packages which are mounted on an FR4 • Flexible Smart Voltage substrate. • 2.7-3.6V Program Erase • 2.7-3.6V Read Operation The module offers access times


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PDF EDI7F4342MV 4x2Megx32 4x2Megx32 EDI7F4342MV 28F016B3 120ns 150ns 12Vpp
1997 - intel i5 block diagram

Abstract: INTEL 56BALL intel C4 package 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F320J5 28F640J5
Text: . 20 4.7 µBGA* Package Schematics for 28F016B3 , * Package Specifications for 28F800B3/28F160B3/28F008B3/ 28F016B3 Remarks: 48-ball package consists of 8 x , * Package Schematics for 28F016B3 Pin #1 Indicator 1 2 3 4 5 6 7 8 A14 A12 , Table for Signal to Ball Assignment for 28F008B3/ 28F016B3 (x8) 28F008B3 28F016B3 28F008B3 28F016B3 A1 A14 A14 D1 A17 A17 A2 A12 A12 D2 NC NC Ball # Ball


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PDF 28F008S3 RD33704SW RD33708SW 28F800B3 RD33716SW 28F160B3 28F640J5 intel i5 block diagram INTEL 56BALL intel C4 package 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3 28F320J5 28F640J5
1998 - BGA-3000

Abstract: Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3
Text: 10.45mm x 9.04mm 46Ball (Pkgs # 3,4,5,6,) 8 Mb 28F160B3 28F016B3 CSP-1012 CSP-46B 7.580 x 9.810 10.12mm x 12.35mm 46Ball (Pkgs#4.2)16Mb 28F160B3_A 28F016B3_A 28F160C3 28F016C3 CSP


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PDF BGA-3000 241mm) Intel reflow soldering profile BGA BGA-3102 BGA-3101 convection oven temperature sensor intel 3102 DIAPHRAGM PUMP rtd 2025 vacuum pump 28F008B3
1998 - 28F008B3

Abstract: 28F016B3 28F032B3 28F160B3 28F320B3 28F400B3 28F800B3 GT28F032B3BA95 GT28F032B3TA95 Intel CSP memory 1998
Text: SMART 3 ADVANCED BOOT BLOCK FLASH MEMORY FAMILY SPECIFICATION UPDATE Release Date: June, 1998 Order Number: 297948-001 The 28F008B3, 28F016B3 , 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update , any time, without notice. The 28F008B3, 28F016B3 , 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3


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PDF 28F008B3, 28F016B3, 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F008B3 28F016B3 28F032B3 28F160B3 28F320B3 28F400B3 28F800B3 GT28F032B3BA95 GT28F032B3TA95 Intel CSP memory 1998
1998 - diode 1.5 ke 36 ca

Abstract: free circuit eprom programmer
Text: HSP ADAPTER SYSTEM GENERAL FLASH EPROM Hi-Speed Programming T S O P 4 0 - 2 . H SP S OC K E T B OAR D v Date : 1998/11/25 v Board ID : 04h v Socket : IC191-0402-002 (YAMAICHI) v Devices List : Manufacture Intel Device 28F002BC-T, 28F002BL-T/B, 28F002BV-T/B, 28F002BX-T/B, 28F004BV-T/B, 28F004BL-T/B, 28F004BX-T/B, 28F004BE-T/B, 28F008BV-T/B, 28F008BE-T/B, 28F008B3-T/B, 28F004B5, 28F016B3-T /B, 28F008C3-T/B, 28F016C3-T/B v Programming Time : Copy Mode Programming Time


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PDF IC191-0402-002 28F002BC-T, 28F002BL-T/B, 28F002BV-T/B, 28F002BX-T/B, 28F004BV-T/B, 28F004BL-T/B, 28F004BX-T/B, 28F004BE-T/B, 28F008BV-T/B, diode 1.5 ke 36 ca free circuit eprom programmer
1998 - 28F400B3

Abstract: 28F008B3 28F016B3 28F032B3 28F160B3 28F320B3 28F800B3 GT28F032B3BA95 GT28F032B3TA95 intel DOC
Text: SMART 3 ADVANCED BOOT BLOCK FLASH MEMORY FAMILY SPECIFICATION UPDATE Release Date: August, 1998 Order Number: 297948-003 The 28F008B3, 28F016B3 , 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification Update , any time, without notice. The 28F008B3, 28F016B3 , 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3


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PDF 28F008B3, 28F016B3, 28F032B3, 28F400B3, 28F800B3, 28F160B3, 28F320B3 28F400B3 28F008B3 28F016B3 28F032B3 28F160B3 28F320B3 28F800B3 GT28F032B3BA95 GT28F032B3TA95 intel DOC
28F016B3

Abstract: EDI7F342MV 80pin simm
Text: ^EDI ELECTRONIC DESIGNS, INC. EDI7F342M V 2Megx32 2Megx32 Flash Module The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Meg x 32 respectively. The modules are based on Intel's 28F016B3-2Megx8 Flash device in TSOP packages which are mounted on an FR4 substrate. Both modules otter access times between 120 and 150ns allowing for operation of high-speed microprocessors without wait states. Features ' 2 Meg x 32 and 2 x 2 Meg x 32 Densities • Based on Intel's 28F016B3


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PDF EDI7F342M 2Megx32 2Megx32 EDI7F342MV 7F2342MV 28F016B3-2Megx8 150ns 28F016B3 -120ns EDI7F2342MV120BNC 80pin simm
ECO 9476

Abstract: No abstract text available
Text: ^EDI E D I7F 342M V 2Megx32 ELECTRONIC DESIGNS, INC 2Megx32 Flash Module The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Meg x 32 respectively. The Block Diagrams modules are based on Intel's 28F016B3-2Megx8 Flash device In TSOP packages which are mounted on an FR4 EDI7F342MV-BNC 2Megx32 80pin SIMM substrate. Both modules offer access times between 120 and 150ns allowing , x 2 Meg x 32 Densities • Based on Intel's 28F016B3 Flash Device • Fast Read Access Time -


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PDF 2Megx32 2Megx32 EDI7F342MV 7F2342MV 28F016B3-2Megx8 EDI7F342MV-BNC 80pin 150ns 28F016B3 ECO 9476
9476

Abstract: 28F016B3 EDI7F342MV
Text: EDI7F342MV 2Megx32 2Megx32 Flash Module The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Meg x 32 respectively. The modules are based on Intel's 28F016B3-2Megx8 Flash device in TSOP packages which are mounted on an FR4 substrate. Block Diagrams EDI7F342MV-BNC 2Megx32 80 pin SIMM Both modules offer access times between 120 and 150ns allowing for operation of , on Intel's 28F016B3 Flash Device · Fast Read Access Time - 120ns · Low Power Dissipation · 30mA


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PDF EDI7F342MV 2Megx32 2Megx32 EDI7F342MV 7F2342MV 28F016B3-2Megx8 EDI7F342MV-BNC 150ns A0-A20 9476 28F016B3
1998 - SmartDie

Abstract: 28F008B3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3 28F400B3 28F800B3
Text: 80* 90, 110 28F016B3 2M × 8 80* 90, 110 8 Mb 28F800F3 512K × 16 90[21]b[14]c 95[23]b[16]c , 80* 90, 110 28F016B3 2M × 8 80* 90, 110 8 Mb 28F800F3 512K × 16 90[21]b[14]c 95[23]b[16]c


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PDF USA/0898/15K/MS SmartDie 28F008B3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3 28F400B3 28F800B3
1998 - 28F640J5a

Abstract: iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3
Text: 16 80, 100 28F016B3 2M × 8 80, 100 28F800C3 28F008C3a 28F800F3 512K × 16 1M × 8 , 16 80, 100 28F016B3 2M × 8 80, 100 28F800C3 28F008C3a 28F800F3 512K × 16 1M × 8


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PDF 28F320C3a 28F032C3a 28F320LSA USA/698/10K/MS 28F640J5a iMC016FLSG 28F160B3 IMC016FLSC 9021b iMC008FLSC flash memory 5v 16m SmartDie 28F016B3 28F160F3
1999 - SmartDie

Abstract: IMC016FLSC PLCC 44 intel package dimensions 28f800b5 flash ftl intel 28F008B3 28F016B3 28F032B3 IMC008FLSc 28F160F3
Text: , 110 28F160B3 1M × 16 80* 90, 110 28F016B3 2M × 8 80* 90, 110 8 Mb 28F800F3 512K × 16 90[25 , [23]c 1M × 16 80* 28F160C3a 90, 110 28F160B3 1M × 16 80* 90, 110 28F016B3 2M × 8 80* 90


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PDF USA/0399/10K/MS SmartDie IMC016FLSC PLCC 44 intel package dimensions 28f800b5 flash ftl intel 28F008B3 28F016B3 28F032B3 IMC008FLSc 28F160F3
1996 - intel 28f160

Abstract: 28F008B3 28F016B3 28F160B3 28F400B3 28F800B3
Text: 28F400B3, 28F800B3, 28F160B3 28F008B3, 28F016B3 n n n n n n n n Flexible SmartVoltage , , 28F016B3 28F400B3, 28F800B3, 28F160B3 Reference VCC Read Voltage 2.7 V­ 3.6 V Section 4.2 , 6 E SMART 3 ADVANCED BOOT BLOCK 28F016B3 28F008B3 A16 A15 A14 A13 A12 A11 A9 A8 , # VPP WP# A18 A7 A6 A5 A4 A3 A2 A1 28F008B3 28F016B3 1 2 3 4 5 6 7 8 9 10 11 12 , or erase cycle. 28F008B3: A[0-19], 28F016B3 : A[0-20], 28F400B3: A[0-17], 28F800B3: A[0-18


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PDF 16-MBIT 28F400B3, 28F800B3, 28F160B3 28F008B3, 28F016B3 64-KB FFH/40H intel 28f160 28F008B3 28F016B3 28F160B3 28F400B3 28F800B3
1998 - PLCC 44 intel package dimensions

Abstract: SmartDie 28F008B3 28F008C3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3
Text: , 110 a 28F016C3 2M × 8 80* 90, 110 28F160B3 1M × 16 80* 90, 110 28F016B3 2M × 8 80* 90 , 28F160B3 1M × 16 80* 90, 110 28F016B3 2M × 8 80* 90, 110 8 Mb 28F800F3 512K × 16 90[25]b[14]c


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PDF USA/0199/10K/MS PLCC 44 intel package dimensions SmartDie 28F008B3 28F008C3 28F016B3 28F032B3 28F032C3 28F160B3 28F160F3 28F320B3
1996 - GT28F160B3B110

Abstract: 28F008B3 28F016B3 28F160B3 28F400B3 28F800B3 TE28F800B3-T90
Text: 28F400B3, 28F800B3, 28F160B3 28F008B3, 28F016B3 n n n n n n n n Flexible SmartVoltage , , 28F016B3 28F400B3, 28F800B3, 28F160B3 Reference VCC Read Voltage 2.7 V­ 3.6 V Section 4.2 , E SMART 3 ADVANCED BOOT BLOCK 28F016B3 28F008B3 A16 A15 A14 A13 A12 A11 A9 A8 WE# RP , # A18 A7 A6 A5 A4 A3 A2 A1 28F008B3 28F016B3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 , addresses. Addresses are internally latched during a program or erase cycle. 28F008B3: A[0-19], 28F016B3


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PDF 16-MBIT 28F400B3, 28F800B3, 28F160B3 28F008B3, 28F016B3 64-KB FFH/40H GT28F160B3B110 28F008B3 28F016B3 28F160B3 28F400B3 28F800B3 TE28F800B3-T90
1997 - MO-195

Abstract: Intel BGA Solder BGA PACKAGE OUTLINE flash memory databook World transistors databook 28F008B3 28F016B3 28F016S3 28F160B3 28F160S3
Text: , 150 1.8V I/O 2.7V­3.6V or 12V 28F016B3 2M x 8 120, 150 1.8V I/O 2.7V­3.6V or 12V


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PDF
1998 - 5 ball csp drawing

Abstract: intel i5 top mark e5 intel 28f160 s5 3020 h3 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3
Text: for 28F800B3 / 28F160B3 / 28F008B3 / 28F016B3 Remarks: The 48-ball package consists of 8 x 6 solder


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PDF 28F008Sckness 5 ball csp drawing intel i5 top mark e5 intel 28f160 s5 3020 h3 28F008B3 28F008S3 28F016B3 28F016S3 28F160B3
TE28F800B3B90

Abstract: F160B3B
Text: , 28F160B3 28F008B3, 28F016B3 Flexible SmartVoltage Technology - 2.7 V- 3.6 V Read/Program/Erase - 12 , -Mbit) Blocking (top or bottom) 28F008B3, 28F016B3 28F400B3, 28F800B3, 28F160B3 Reference Section 4.2, 4.4 Section , art 3 Advanced Boot Block 28F016B3 28F008B3 A,« A,s A,. A|3 A,2 A, A, A, WE# RP# V pp WP# A, A , latched during a program or erase cycle. 28F008B3: A{0-19], 28F016B3 : A[0-20], 28F400B3: AIO-17], 28FBOOB3 , indicate completion of a program or erase operation. Size 28F400B3 28F008B3 28F800B3 28F016B3 28F160B3


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PDF 16-MBIT 28F400B3, 28F80QB3, 28F160B3 28F008B3, 28F016B3 64-KB TE28F800B3B90 F160B3B
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