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Fischer Elektronik GmbH & Co KG
ICK BGA 27 X 27 X 22 HEAT SINK; Thermal Resistance:13.5°C/W; Packages Cooled:BGA; External Width - Metric:27mm; External Height - Metric:22mm; External Length - Metric:27mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; Product Range:- RoHS Compliant: Yes
ICK BGA 27 X 27 X 22 ECAD Model
Distributors Part Package Stock Lead Time Min Order Qty 1 10 100 1,000 10,000
Newark ICK BGA 27 X 27 X 22 Bulk 17 1 $16.58 $15.19 $11.91 $10.71 $10.71 More Info
Avnet Europe ICK BGA 27 X 27 X 22 0 12 Weeks, 3 Days 100 - - €5.61042 €4.426 €4.14548 More Info
element14 Asia-Pacific ICK BGA 27 X 27 X 22 Each 17 1 $12.81 $12.81 $12.16 $11.79 $11.79 More Info
Farnell ICK BGA 27 X 27 X 22 Each 291 13 Weeks, 1 Days 1 £13.63 £10.83 £8.37 £8.37 £8.37 More Info
Fischer Elektronik GmbH & Co KG
ICK BGA 27X27X22 Heatsink, Universal Square Alu, 13.5K/W, 27 x 27 x 22mm, Adhesive Foil, Conductive Foil, EA
ICK BGA 27X27X22 ECAD Model
Distributors Part Package Stock Lead Time Min Order Qty 1 10 100 1,000 10,000
RS ICK BGA 27X27X22 Bulk 133 1 $12.323 $11.333 $9.609 $9.609 $9.609 More Info
Rutronik ICK BGA 27X27X22 Box 80 10 - $4.55 $4.13 $4.13 $4.13 More Info

27x27x2 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2002 - vt8233a

Abstract: vt1631 VT8233 VT1621 CLE266 RX6C pro266t CLE266 cd PRO266 via apollo
Text: No file text available


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PDF CLE266 27x27x2 MS-034 548-Pin 27x27mm vt8233a vt1631 VT8233 VT1621 CLE266 RX6C pro266t CLE266 cd PRO266 via apollo
2008 - Not Available

Abstract: No abstract text available
Text: 2,5 22 M (2:1) 27 27 M (1:1)  Schutzvermerk gemäß DIN ISO 16016 beachten Fischer Elektronik GmbH & Co. KG 2008 Freimasstoleranz Oberfläche DIN ISO 2768m SA Datum Erst. 04.04.2008 Bearb. 04.04.2008 Werkstoff / Material AlMgSi0,5 F22 (EN AW 6060 T66) Z. Änderungen Datum Name C 001019909.ipt Name Lochen Lochen Kunde 77777 - Fischer Elektronik Bezeichnung / Titel ICK BGA 27x27x22 Zeichnungs-Nummer 001024498 Blatt 1 Blätter 1 Fischer


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PDF 2768m 27x27x22
1998 - PGA68

Abstract: clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
Text: No file text available


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PDF GS-150T 102x51x19 GS-100T GS-R1005 PGA68 clcc44 SO53 material declaration semiconductor package FDIP28 schottky diode sb 5400 CLCC68 CLCC52 smd transistor marking 7622 DIP40 weight
2009 - JESD79-2B

Abstract: 0x01000202 CR88 DDR2-667 STLS2E02 STLS2F01 Loongson
Text: (compatible with MIPSIII) instruction set (s) ct Description HFCBGA452 ( 27x27x2.9mm ) uc d , summary Order code Package Packing STLS2F02-LP HFCBGA452 ( 27x27x2.9 mm) Tray January


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PDF STLS2F02-LP 64-bit DDR2-667 27x27 JESD79-2B 0x01000202 CR88 STLS2E02 STLS2F01 Loongson
2002 - SC3200

Abstract: scx200 s/ksmh12/2.27/30/ecg philips semiconductor master book CS13* CAPACITOR CCIR-656 CS1301 CS1311 IEC958 SC2200 M-Systems diskonchip
Text: No file text available


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PDF CS1301/CS1311 CS1301 CS1311 SC1200/SC1201, SC2200, SC3200, SCx200) SC3200 scx200 s/ksmh12/2.27/30/ecg philips semiconductor master book CS13* CAPACITOR CCIR-656 IEC958 SC2200 M-Systems diskonchip
2008 - JESD79-2B

Abstract: CR88 DDR2 Mechanical Dimensions DDR2-667 STLS2E02 STLS2F01 STLS2F02 axi crossbar
Text: (compatible with MIPSIII) instruction set HFCBGA452 ( 27x27x2.9mm ) The memory hierarchy is composed by , code Packing STLS2F02 August 2008 Package HFCBGA452 ( 27x27x2.9 mm) Tray Rev 1


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PDF STLS2F02 64-bit DDR2-667 27x27 JESD79-2B CR88 DDR2 Mechanical Dimensions STLS2E02 STLS2F01 STLS2F02 axi crossbar
2005 - DPRAM

Abstract: No abstract text available
Text: Figure 5. PBGA/HSP-561 ( 27x27x2.36mm ) Mechanical Data & Package Dimensions mm inch DIM. MIN , fff 0.10 0.004 PBGA/HSp-561 ( 27x27x2.36mm ) Heat Spreader Plastic Ball Grid Array D B


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PDF V600AT ARM926 ARM926: 32/16-bit 16kBytes 150kGates 300MHz DPRAM
BT.1120

Abstract: tw2851 LVDS BT.1120 Techwell* tw2851 bt.656 to RGB display 120 Techwell BT1120 bt.656 parallel to RGB LVDS INPUT CVBS OUTPUT bt.656 to RGB LCD display
Text: ­ 8/12/16-channel Cascade Support ­ 1.2V, 3.3V Supply ­ Package: 352-PBGA, 27x27x2.23 mm Block


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PDF TW2851 4/8/16-Channel TW2851 16x12 8/16-bit 8/12/16-channel 352-PBGA, 27x27x2 BT.1120 LVDS BT.1120 Techwell* tw2851 bt.656 to RGB display 120 Techwell BT1120 bt.656 parallel to RGB LVDS INPUT CVBS OUTPUT bt.656 to RGB LCD display
1996 - PLESSEY CLA

Abstract: gh160 FG48
Text: 913 913 914 914 CLA90000 SERIES 23x23x2.33 27x27x2.33 35x35x2.33 35x35x2.3 , 23x23x2.33 27x27x2.33 35x35x2.33 35x35x2.3 BC169 BC225 BC313 BC352 1.27 1.27


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PDF DS4375-1 CLA90000 PLESSEY CLA gh160 FG48
2009 - JESD79-2B

Abstract: CR88 DDR2-667 STLS2E02 STLS2F01 1013tdi
Text: (compatible with MIPSIII) instruction set HFCBGA452 ( 27x27x2.9mm ) The memory hierarchy is composed by , code Package Packing STLS2F02-LP HFCBGA452 ( 27x27x2.9 mm) Tray January 2009 Rev 1


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PDF STLS2F02-LP 64-bit DDR2-667 27x27 JESD79-2B CR88 STLS2E02 STLS2F01 1013tdi
2005 - ahb to i2c verilog code

Abstract: V600AT AMBA AHB memory controller ARM926 DPRAM amba bus architecture AMBA AHB DMA Verilog code for ADC and DAC SPI with FPGA verilog code for i2c communication fpga HDLC verilog code
Text: Figure 5. PBGA/HSP-561 ( 27x27x2.36mm ) Mechanical Data & Package Dimensions mm inch DIM. MIN , fff 0.10 0.004 PBGA/HSp-561 ( 27x27x2.36mm ) Heat Spreader Plastic Ball Grid Array D B


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PDF V600AT ARM926 ARM926: 32/16-bit 16kBytes 150kGates 200MHz 10-bit ahb to i2c verilog code V600AT AMBA AHB memory controller DPRAM amba bus architecture AMBA AHB DMA Verilog code for ADC and DAC SPI with FPGA verilog code for i2c communication fpga HDLC verilog code
Nitto GE 100

Abstract: nitto GE J-STD-020 NITTO GE-100 GE-100L
Text: ) Date Code Range: QTY FAILS 0 0 FA# 0 ATP (Amkor, PI) 400 PBGA-TE 27x27x2.33 Plaskon


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PDF DS33R41, reliabil48 30C/60% Nitto GE 100 nitto GE J-STD-020 NITTO GE-100 GE-100L
2002 - SCx200

Abstract: schematic diagram of TV memory writer TM32A MPEG4 schematic Marking code WMP SC1200 webpad sc2200 national PNX1300 CS1301 s/ksmh12/2.27/30/ecg philips semiconductor master book
Text: No file text available


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PDF CS1301/CS1311 CS1301 CS1311 SC1200/SC1201, SC2200, SC3200, SCx200) SCx200/CS1301 SCx200/CS1311 SCx200 schematic diagram of TV memory writer TM32A MPEG4 schematic Marking code WMP SC1200 webpad sc2200 national PNX1300 s/ksmh12/2.27/30/ecg philips semiconductor master book
2002 - VT8233A

Abstract: vt8233a motherboard VT8235M pin diagram AMD Athlon 64 X2 STR W 5453 C Rx4B-48 RX2C RX6C VT8233 via kt266a
Text: No file text available


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PDF VT8235M 487-Pin 27x27x2 MS-034 VT8233A vt8233a motherboard VT8235M pin diagram AMD Athlon 64 X2 STR W 5453 C Rx4B-48 RX2C RX6C VT8233 via kt266a
2008 - JESD79-2B

Abstract: DDR2 Mechanical Dimensions DDR2-667 STLS2E02 STLS2F01 Loongson
Text: instruction set (MIPS III compatible) HFCBGA452 ( 27x27x2.9mm ) The memory hierarchy is composed by the , Packing STLS2F01 May 2008 Package HFCBGA452 ( 27x27x2.9mm ) Tray Rev 1 This is


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PDF STLS2F01 64-bit DDR2-667 27x27 JESD79-2B DDR2 Mechanical Dimensions STLS2E02 STLS2F01 Loongson
1999 - PCI1131

Abstract: PCI1210 PCI1221 PCI CardBus Controllers PCI4450 BGA and QFP Package PCI1420 ghk diode TI PCI PCI1220
Text: -­­­­­­-­­ Package dimensions3 · 27x27x2.1 mm · 16x16x1.2 mm · 256-pin BGA · 257-pin u*BGA


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PDF SCPB002 PCI1131 PCI1210 PCI1221 PCI CardBus Controllers PCI4450 BGA and QFP Package PCI1420 ghk diode TI PCI PCI1220
2011 - TW9900

Abstract: TW2866 TW-2866 TW2867 BT.1120 converter TW2837 TW6802 Techwell tw6805 TW2864H TW2880
Text: : 352-PBGA, 27x27x2.23 mm Block Diagram A 8 SECURITY SURVEILLANCE ICs TW2866/TW2867 4


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PDF
2008 - Loongson

Abstract: axi crossbar DDR2-667 JESD97 STLS2E02 STLS2F01
Text: compatible) HFCBGA452 ( 27x27x2.9mm ) The memory hierarchy is composed by the first level of 64 Kbyte 4 , Package HFCBGA452 ( 27x27x2.9mm ) Tray Rev 2 For further information contact your local , 0.0039 HFCBGA452 ( 27x27x2.9mm ) Heat Spreader Flip Chip Ball Grid Array 8061758 A 4/6


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PDF STLS2F01 64-bit DDR2-667 27x27 Loongson axi crossbar JESD97 STLS2E02 STLS2F01
2005 - Not Available

Abstract: No abstract text available
Text: Figure 5. PBGA/HSP-561 ( 27x27x2.36mm ) Mechanical Data & Package Dimensions mm inch DIM. MIN , fff 0.10 0.004 PBGA/HSp-561 ( 27x27x2.36mm ) Heat Spreader Plastic Ball Grid Array D B


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PDF V600AT ARM926 300MHz ARM926: 32/16-bit 16kBytes 150kGates 300MHz
2009 - bt.656 to RGB display 120

Abstract: Techwell* tw2851
Text: Supply – Package: 352-PBGA, 27x27x2.23 mm Block Diagram A TEL 1-888


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PDF TW2851 4/8/16-Channel TW2851 16x12 16-bit 24-bit 16-ch 8/16-bit 8/12/16-channel bt.656 to RGB display 120 Techwell* tw2851
2005 - Not Available

Abstract: No abstract text available
Text: -561 ( 27x27x2.36mm ) Mechanical Data & Package Dimensions mm inch DIM. MIN. TYP. MAX. A A1 MIN , /HSp-561 ( 27x27x2.36mm ) Heat Spreader Plastic Ball Grid Array D B D1 e ddd C F A A1


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PDF STW21000AT ARM926 ARM926: 32/16-bit 16kBytes 150kGates 200MHz
2005 - Verilog code for ADC and DAC SPI with FPGA

Abstract: amba ahb report with verilog code verilog code AMBA AHB verilog code for i2c communication fpga ahb to i2c verilog code verilog code for amba ahb bus GreenFIELD-STW21000
Text: Package Information Figure 5. PBGA/HSP-561 ( 27x27x2.36mm ) Mechanical Data & Package Dimensions mm DIM , MIN. TYP. MAX. 0.093 inch OUTLINE AND MECHANICAL DATA PBGA/HSp-561 ( 27x27x2.36mm ) Heat Spreader


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PDF STW21000 ARM926 ARM926: 32/16-bit 16kBytes 150kGates 200MHz 10-bit Verilog code for ADC and DAC SPI with FPGA amba ahb report with verilog code verilog code AMBA AHB verilog code for i2c communication fpga ahb to i2c verilog code verilog code for amba ahb bus GreenFIELD-STW21000
2008 - JESD79-2B

Abstract: CR88 DDR2-667 STLS2E02 STLS2F01 STLS2F02 Loongson
Text: (compatible with MIPSIII) instruction set (s) ct Description HFCBGA452 ( 27x27x2.9mm ) uc d , Package Packing STLS2F02 August 2008 s) t( HFCBGA452 ( 27x27x2.9 mm) Tray Rev 1


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PDF STLS2F02 64-bit DDR2-667 27x27 JESD79-2B CR88 STLS2E02 STLS2F01 STLS2F02 Loongson
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