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Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
TMS320C6713GDPX225 Texas Instruments Floating-Point Digital Signal Processor 272-BGA
TMS32C6713BZDPA200 Texas Instruments Floating-Point Digital Signal Processors 272-BGA
TVP4020GFN Texas Instruments 2D/3D/Video Graphics Controller 272-BGA
TMS32C6713BZDPR225 Texas Instruments Floating-Point Digital Signal Processors 272-BGA
TMS320C6713BGDP225 Texas Instruments Floating-Point Digital Signal Processors 272-BGA
C6713BZDPA200CIS Texas Instruments Floating-Point Digital Signal Processors 272-BGA

272-FBGA-15 Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2007 - EP3C40F484

Abstract: pin information ep3c10 PIN INFORMATION FOR EP3C55 EP3C16F484 U256 EP3C40 EP3C16 EP3C40Q240 100 PIN PQFP ALTERA DIMENSION EP3c55
Text: ( FBGA ), Micro FineLine BGA® (MBGA), Ultra FineLine BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead , 15 5.1 EP3C55 F484 18.9 15.4 13.8 12.2 4.2 EP3C55 F780 17.8 14.4 , ) Altera Corporation Power layer Cu thickness 35 um, Cu 90% Signal layer Cu thickness 17 um, Cu 15 , U484 21.2 17.1 15 13.3 7.5 EP3C55 F484 18.6 14.6 12.6 11.1 6 , FBGA 8.7 30.2 26.1 23.6 21.7 144 TQFP 9.9 29.8 28.3 26.9 24.9


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PDF EP3C25 EP3C10 EP3C40F484 pin information ep3c10 PIN INFORMATION FOR EP3C55 EP3C16F484 U256 EP3C40 EP3C16 EP3C40Q240 100 PIN PQFP ALTERA DIMENSION EP3c55
1999 - 272-pin

Abstract: No abstract text available
Text: FINE PITCH BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 272 PIN PLASTIC BGA-272P-M02 272-pin plastic FBGA Ball pitch 0.80 mm Ball matrix 21 Package width × package length 18.00 × 18.00 mm Sealing method Plastic mold Mounting height 1.45 mm MAX Ball size 0.45 (BGA-272P-M02) 272-pin plastic FBGA (BGA-272P-M02) 18.00±0.10(.709±.004)SQ Note: The , 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0.15(.006) INDEX AA Y W V U T R P N M


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PDF BGA-272P-M02 272-pin BGA-272P-M02) B272002S-1C-1
2008 - pin information ep3c10

Abstract: u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
Text: devices available in Ball-Grid Array (BGA), FineLine® BGA ( FBGA ), Micro FineLine BGA® (MBGA), Ultra , F780 15.2 13.5 12.2 4.5 21.6 18.2 16.4 15 5.1 18.9 15.4 13.8 , ) (2) Power layer Cu thickness 35 um, Cu 90% Signal layer Cu thickness 17 um, Cu 15 % Table 4 , 13.5 11.9 6.8 F780 17.6 13.9 12.1 10.7 6.7 U484 21.2 17.1 15 , 26.7 24.7 PQFP 4.3 27.2 24.7 22.1 17.8 FBGA 8.8 28.7 24.5 22.3


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PDF EP3C25 EP3C10 pin information ep3c10 u256 EP2C35-F484 E144 EP3C10 EP3C16 EP3C25 F256 M164
2007 - 3S110

Abstract: BGA 64 PACKAGE thermal resistance 12 x 12 fbga thermal resistance CHIP RESISTANCE TABLE 3S150 FBGA 152 JEDEC FBGA EP2S15
Text: ), FineLine® BGA ( FBGA ), and Hybrid FineLine BGA (HBGA). f For additional packaging information, refer , ./min. 200 ft./min. 400 ft./min. 3S50 484 Flip Chip FBGA 12.6 10 8.5 7.2 2.72 3S50 780 Flip Chip FBGA 11.1 8.6 7.2 6.0 2.34 3S70 484 Flip Chip FBGA 12.6 10 8.5 7.2 2.72 3S70 780 Flip Chip FBGA 11.1 8.6 7.2 6.0 2.34 3S110 780 Flip Chip FBGA 10.8 8.4 6.9 5.7 1.99 3S110 1,152 Flip Chip FBGA


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2000 - VR5000

Abstract: VRC5074
Text: Ordering Information Devices Comment 500-pin FBGA Memory interface, PCI, local bus Part Number Package Operation Frequency VR5000 272-pin plastic FBGA 180 MHz VR5000 272-pin plastic FBGA 200 MHz VR5000 272-pin plastic FBGA 250 MHz VR5000 Documentation Package Vrc5074 Supported Devices Part Number 272-pin plastic FBGA 300 MHz Doc Number Devices , , Fax (01) 30 67 58 99 NEC Electronics (France) S.A., Representacion en Espana, Juan Esplandiu 15 , E


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PDF VRC5074 VR5000 VRC5074 VR5000 U13246EE1V0PL00
SAMSUNG 834

Abstract: pcb design 0,5 mm pitch STD130
Text: PBGA (2L) 19 - 20 (°C/W) PBGA (ML) 15 - 15.5 (°C/W) FBGA (Tape) 59 (°C/W) FBGA (PCB , ) 22 P(°C/W) 15 s P(°C/W) 13 P(°C/W) 12 P(°C/W) 24 s P(°C/W) 17 D-1 P(°C/W) 16 P(°C/W) 15 Samsung ASIC Appendix D Package s In-house , ) Package Pitch 1422 mm 1.27 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 4242 mm 1.27 PBGA (ML) 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27


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PDF STD130 SAMSUNG 834 pcb design 0,5 mm pitch STD130
SAMSUNG 834

Abstract: No abstract text available
Text: /W) PBGA (ML) 15 ~ 15.5 (˚C/W) FBGA (Tape) 59 (˚C/W) FBGA (PCB) STD131 θ ja , (˚C/W) 22 P(˚C/W) 15 ❏ ❏ ❏ ❏ ❏ s P(˚C/W) 13 P(˚C/W) 12 P(˚C/W) 24 ❏ s P(˚C/W) 17 ❏ ❏ ❏ ❏ ❏ D-1 P(˚C/W) 16 P(˚C/W) 15 Samsung ASIC , 1.27 s s s < 13nH PBGA (2L) Package Pitch 1422 mm 1.27 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 4242 mm 1.27 PBGA (ML) 1515 mm 1.0 2323 mm 1.27 1.5


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PDF STD131 SAMSUNG 834
pcb design 0,5 mm pitch

Abstract: SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance
Text: PBGA (2L) 19 ~ 20 (°C/W) PBGA (ML) 15 ~ 15.5 (°C/W) FBGA (Tape) 59 (°C/W) FBGA (PCB , ) 22 P(°C/W) 15 s P(°C/W) 13 P(°C/W) 12 P(°C/W) 24 s P(°C/W) 17 D-1 P(°C/W) 16 P(°C/W) 15 Samsung ASIC Appendix D Package s In-house , ) Package Pitch 1422 mm 1.27 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 4242 mm 1.27 PBGA (ML) 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27


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PDF STDL130 pcb design 0,5 mm pitch SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance
D 4242

Abstract: pcb design 0,5 mm pitch Samsung 3232 STDH150 FBGA PACKAGE thermal resistance
Text: Type PBGA (2L) 19 - 20 (°C/W) PBGA (ML) 15 - 15.5 (°C/W) FBGA (Tape) 59 (°C/W) FBGA , 208 240 256 1420 mm STDH150 304 Remarks P(°C/W) 22 P(°C/W) 15 P(°C/W) 13 P(°C/W) 12 s P(°C/W) 24 s s P(°C/W) 17 s s s D-1 P(°C/W) 16 P(°C/W) 15 , 1.27 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 4242 mm 1.27 PBGA (ML) 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 Lead Lead Count


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PDF STDH150 D 4242 pcb design 0,5 mm pitch Samsung 3232 STDH150 FBGA PACKAGE thermal resistance
pcb design 0,5 mm pitch

Abstract: PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153
Text: Type PBGA (2L) 19 - 20 (°C/W) PBGA (ML) 15 - 15.5 (°C/W) FBGA (Tape) 59 (°C/W) FBGA , 208 240 256 1420 mm STD150 304 Remarks P(°C/W) 22 P(°C/W) 15 P(°C/W) 13 P(°C/W) 12 s P(°C/W) 24 s s P(°C/W) 17 s s s D-1 P(°C/W) 16 P(°C/W) 15 , 1.27 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 4242 mm 1.27 PBGA (ML) 1515 mm 1.0 2323 mm 1.27 1.5 2727 mm 1.27 3131 mm 1.27 3535 mm 1.27 Lead Lead Count


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PDF STD150 pcb design 0,5 mm pitch PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153
2001 - FPQ-256(352)-0.5-04

Abstract: ic149-208-161-s5 FPQ-256 Enplas drawings IC51-1004-809 Enplas fpq 352 Yamaichi TQFP Enplas fpq IC51-1764-1505-5 IC51-1444-1354
Text: Package Lead Count Actel Part # Vendor Part Number FBGA (1.00mm) 144-ball (13mmx13mm , (0.8mm) FBGA (1.00mm) BGA 456 (35mm x 35mm) v2.0 3 So c k e t R e c o m m e n d a t io , FBGA 272 Loranger LIC#350SQ 456B6617 v2.0 S o c k e t R e c o mm e n d a t io n f o r A


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PDF IC51-1964-1952 FPQ-256 FPQ-256(352)-0.5-04 ic149-208-161-s5 Enplas drawings IC51-1004-809 Enplas fpq 352 Yamaichi TQFP Enplas fpq IC51-1764-1505-5 IC51-1444-1354
RISC-Processor s3c2410

Abstract: MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd arm9 s3c2440 sp0411n K9W8G08U1M sandisk micro SD Card 2GB K9F1G08U0A K6X8008C2B
Text: 14~ 15 . Speed (Wafer/Chip Biz/BGD: 00) G : CSP(except 54 Pin) R : 54-CSP B : 54-CSP(LF) D : 90- FBGA , K4H560438E-GC(L)B0/A2/B3 60 ball FBGA 256M 32Mx8 266/266/333/400 K4H560838E-TC(L)B0/A2/B3/CC , 256M 32Mx8 266/266/333/400 K4H560838E-GC(L)B0/A2/B3/CC 60 ball FBGA 256M 16Mx16 , K4H561638F-GC(L)B0/A2/B3/CC 60 ball FBGA 512M 128Mx4 266/266/333 K4H510438B-TC(L)B0/A2/B3 66 , 128Mx4 266/266/333 K4H510438B-GC(L)B0/A2/B3 60 ball FBGA 512M 64Mx8 266/266/333/400


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PDF BR-04-ALL-005 BR-04-ALL-004 RISC-Processor s3c2410 MR16R1624DF0-CM8 arm9 samsung s3c2440 architecture chip 3351 dvd arm9 s3c2440 sp0411n K9W8G08U1M sandisk micro SD Card 2GB K9F1G08U0A K6X8008C2B
2003 - Yamaichi IC51-1444-1354-7 footprint

Abstract: IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 enplas SY-PQ240 FPQ-256
Text: -ball (31mmx31mm) SE-FG896 E-tec: BPW896-1030-30AB01L 1152-ball (35mmx35mm) FBGA (1.00mm) Lead Count , -1270-26AB11 S582-11-456-13-005414 BPW729-1230-27AA01L 128 (11mmx11mm) 180 (13mmx13mm) FBGA (1.00mm) 144 , BGA IC51-0684-390-1 240 FBGA Yamaichi 208 CS IC51-044-400 160 3.2mm footprint


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PDF piec-256 FPQ-256 Yamaichi IC51-1444-1354-7 footprint IC149-208-161-S5 BPW32 Enplas drawings BPW896-1030-30AB01L IC51-1764-1505-5 IC51-1004-809 enplas SY-PQ240 FPQ-256
2009 - VR5EU567218FBW

Abstract: IDD3PS VR5EU287218FBW PC2-6400 VR5EU566418FBZ vtr 150 VR5EU286418EBP VR5EU127218GBS VR5EU647218EBS VR5EU566418FBW
Text: ) 256M x 8 (16) 256M x 8 (16) Device Package FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA Module Ranks 1 1 1 1 2 2 2 2 1 1 1 1 1 1 2 2 2 2 2 2 1 , ) 256M x 8 (18) Device Package FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA FBGA


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PDF VR5EUxxxx18xBx VR5EU646418EBP VR5EU646418EBS VR5EU646418EBW VR5EU646418EBY VR5EU286418EBP VR5EU286418EBS VR5EU286418EBW VR5EU286418EBY VR5EU286418FBP VR5EU567218FBW IDD3PS VR5EU287218FBW PC2-6400 VR5EU566418FBZ vtr 150 VR5EU286418EBP VR5EU127218GBS VR5EU647218EBS VR5EU566418FBW
2001 - actel cqfp 84

Abstract: A1010B ACTEL FBGA 144
Text: 114 147 81 81 TQFP 64 100 144 176 BGA 272 313 329 456 FBGA 144 256 484 111 111 , TQFP 64 100 144 176 104 140 150 202 210 210 BGA 272 313 329 456 312 368 FBGA 144


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PDF A54SX08A A54SX16A A54SX32A A54SX72A A54SX08 A54SX16 A54SX16P A54SX32 eX128 eX256 actel cqfp 84 A1010B ACTEL FBGA 144
fbga 12 x 12 thermal resistance

Abstract: FBGA160-P-1212
Text: , enabling the development of high value-added products. !C PACKAGES CSP(Chip Size Package) The FBGA , digital assistants (PDAs), portable phones, camcorders and digital cameras. FBGA (commonly known as C SP , mounted using conventional mounter. Can be mix mounted with SO P and QFP. · Structure of Sharp CSP( FBGA , Conventional package (QFP) C SP ( FBGA ) Reduction ratio QFP176-P-2424 (0.5 mm pin-pitch) FBGA160-P-1212 (0.8 mm , Epoxy-incorporated glass cloth Thickness 1.5 mm (TYP.) (B) Single-side potting \ Thickness 0 5 mm '


OCR Scan
PDF developme5x24 fbga 12 x 12 thermal resistance FBGA160-P-1212
fBGA package tray 12 x 19

Abstract: FCCSP HT80C51 SecuCalm a44e ARM10 uLGA I18N 64 pin IC microcontroller LCD cortex my
Text: / Interposer 9 10 11 12 13 14 15 E : EVA-CHIP P : OTP 2 : 32-bit ARM9 4 : 32 32-bit 6 : 56 4-bit 8 : 88 8-bit A : 15 Other 1 : 1K byte 3 : 12K byte 5 : 16K byte 7 : 24K byte 9 : 32K byte B , : WFP W : WAFER Y : FBGA 2 : FCBGA 4 : TEBGA 6 : PBGA 5~6. Application Category 0n : General , / WF) Z : SBGA 3 : FCCSP 5 : ELP2 7 : LPCC 13~ 15 . " Refer to Next Page " -1- Part Number , 12 13 14 15 16 17 18 19 20 21 22 - ELP2 H : 16 U : 40 O : 32 V : 30 - QFPH D : 160 F


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PDF 16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-bit fBGA package tray 12 x 19 FCCSP SecuCalm a44e ARM10 uLGA I18N 64 pin IC microcontroller LCD cortex my
secucalm

Abstract: HT80C51 ARM10 H285 I18N SecuCalm16
Text: / Interposer 9 10 11 12 13 14 15 E : EVA-CHIP P : OTP 2 : 32-bit ARM9 4 : 32 32-bit 6 : 56 4-bit 8 : 88 8-bit A : 15 Other 1 : 1K byte 3 : 12K byte 5 : 16K byte 7 : 24K byte 9 : 32K byte B , : WFP W : WAFER Y : FBGA 2 : FCBGA 4 : TEBGA 6 : PBGA 5~6. Application Category 0n : General , / WF) Z : SBGA 3 : FCCSP 5 : ELP2 7 : LPCC 13~ 15 . " Refer to Next Page " -1- Part Number , 12 13 14 15 16 17 18 19 20 21 22 - ELP2 H : 16 U : 40 O : 32 V : 30 - QFPH D : 160 F


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PDF 16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-be secucalm ARM10 H285 I18N SecuCalm16
secucalm

Abstract: SecuCalm16 FCCSP fBGA package tray 12 x 19 ARM10 HT80C51 I18N 1Z89
Text: : OTP 2 : 32-bit ARM9 4 : 32 32-bit 6 : 56 4-bit 8 : 88 8-bit A : 15 Other 5~6. Application , No (1Z) 8 9 10 11 12 13 14 15 7. Rom Master 0 : 0K byte 2 : 2K byte 4 : 4K byte 6 : 6K , R : TSSOP S : SOP U : WFP W : WAFER Y : FBGA 2 : FCBGA 4 : TEBGA 6 : PBGA B : LGA D : DIP , : SBGA 3 : FCCSP 5 : ELP2 7 : LPCC 13~ 15 . " Refer to Next Page " -1- Part Number Decoder , 13 14 15 16 17 18 19 20 21 22 - ELP2 H : 16 U : 40 O : 32 V : 30 - QFPH D : 160 F


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PDF 16-bit 32-bit ARM10 16-bit HT80C51 SC-200 128-bit SC-100 secucalm SecuCalm16 FCCSP fBGA package tray 12 x 19 ARM10 I18N 1Z89
IEC60730

Abstract: CMOS Sensor to H.264 STK 361 ARM926EJ-S SD-Card layout VIA ARM926EJ-S lcd cross reference toshiba 32gb nand ARM926EJ-S, tutorial Graphics LCD 320 x 240 mono 3.5"
Text: 32 FBGA 289 H/D 2 3 2 1 8 6 91 1.7~3.6 TMPA901CMXBG 2) ARM926EJ-S 200* - 32 FBGA 177 H/D 1 2 1 1 4 6 43 1.7~3.6 ARM926EJ-S 200* - 56 FBGA 361 D 2 2 2 1 6 6 114 1.7~3.6 1 , 56 32 16 FBGA 361 FBGA 361 FBGA 361 D D D 2 2 2 2 2 2 2 2 2 1 , Microcontroller TMPA900CMXBG Memory Features ADC 10-bit Ch. 16-bit Timer RTC / WDT 32 FBGA 289


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PDF TMPA900CMXBG 10-bit 16-bit TMPA901CMXBG ARM926EJ-S TMPA911CRAXBG TMPA912CMAXBG IEC60730 CMOS Sensor to H.264 STK 361 ARM926EJ-S SD-Card layout VIA ARM926EJ-S lcd cross reference toshiba 32gb nand ARM926EJ-S, tutorial Graphics LCD 320 x 240 mono 3.5"
2007 - 256-pin Plastic BGA 17 x 17

Abstract: EPM240 EPM3032A application EPM7256AE epm7192 EPM7128AE EPM7064AE EPM7032AE EPM3512A altera EPM7032S
Text: -Pin FBGA (F)7 80 76 160 68 212 204 98 161 208 100 176 164 84 84 , 212 Package Statistics PLCC TQFP PQFP BGA FBGA UBGA 44 84 44 100 144 100 , EPM570/G/Z MAX 3000A CPLDs 3.3 V, 2.5 V, 1.8 V EPM240/G/Z MAX II CPLDs 3.3, 2.5, 1.8, 1.5


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PDF 7000AE 7000B 7000S EPM3064A EPM3128A EPM3256A EPM3512A EPM7032B EPM7064B EPM7128B 256-pin Plastic BGA 17 x 17 EPM240 EPM3032A application EPM7256AE epm7192 EPM7128AE EPM7064AE EPM7032AE EPM3512A altera EPM7032S
2007 - PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA TQFP 144 PACKAGE DIMENSION FBGA 1760 84 FBGA thermal
Text: 484 EP1M350 Flip Chip FBGA 780 Table 15 . Mercury Devices Table 16. FLEX Series Devices , FBGA , Wirebond (Option 2) Altera Corporation TQFP, Wirebond PQFP, Wirebond 484 15 , -Pin MBGA - Wire Bond Added 780-Pin FBGA option 2 - Wire Bond, 256-Pin UBGA - Wire Bond, 68-Pin MBGA - , added for Stratix III Thermal Resistance information 1517-Pin FineLine Ball-Grid Array ( FBGA ) - Flip Chip data sheet was added 1760-Pin FineLine Ball-Grid Array ( FBGA ) - Flip Chip data sheet was added


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PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA TQFP 144 PACKAGE DIMENSION FBGA 1760 84 FBGA thermal
KGA0E000BA

Abstract: kgc0g000dm fBGA package tray 12 x 19 KGB0F000BA FCMSP kga0a000am fBGA package tray 12 19 kgd0h000dm secucalm lsi SoC
Text: / Interposer 9 10 11 12 13 14 15 E : EVA-CHIP P : OTP 2 : 32-bit ARM9 4 : 32 32-bit 6 : 56 4-bit 8 : 88 8-bit A : 15 Other 1 : 1K byte 3 : 12K byte 5 : 16K byte 7 : 24K byte 9 : 32K byte B , : WFP W : WAFER Y : FBGA 2 : FCBGA 4 : TEBGA 6 : PBGA 5~6. Application Category 0n : General , / WF) Z : SBGA 3 : FCCSP 5 : ELP2 7 : LPCC 13~ 15 . " Refer to Next Page " -2- Part Number , 12 13 14 15 16 17 18 19 20 21 22 - ELP2 H : 16 U : 40 O : 32 V : 30 - QFPH D : 160 F


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PDF 16-bit 32-bit ARM10 16-bit HT80Cer KGA0E000BA kgc0g000dm fBGA package tray 12 x 19 KGB0F000BA FCMSP kga0a000am fBGA package tray 12 19 kgd0h000dm secucalm lsi SoC
2003 - AT73C202

Abstract: battery mobile phone charger operation of mobile charger
Text: Ultra-low sleep mode current consumption ( 15 µA typical) Ultra-thin 5mm x 5mm 49-ball FBGA package R , AT73C202 is packaged into a 49balls (7x7 matrix), 0.65mm pitch, 5mm x 5mm outline FBGA package. Atmel


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PDF AT73C202 AT73C202. 49balls battery mobile phone charger operation of mobile charger
1999 - QFN "100 pin" PACKAGE

Abstract: PIN32 BGA 176 ball package IC-288 280-Pin BGA
Text: ) 5 pin 14 pin 15 pin 64 pin 72 pin 84 pin 120 pin 132 pin 175 pin 176 pin 208 pin 280 pin 447 , 580 pin 272 pin 672 pin 313 pin 352 pin 396 pin FBGA 36 pin 116 pin 40 pin 121 pin 52 pin 144 pin , BGA 256 pin 352 pin 420 pin 500 pin 504 pin 576 pin 696 pin FBGA 432 pin L IC


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