The Datasheet Archive

Top Results (6)

Part Manufacturer Description Datasheet Download Buy Part
LTM9009IY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9010CY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9009CY-14#PBF-ES Linear Technology LTM9009-14 - 14-Bit, 80Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9011CY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Commercial
LTM9010IY-14#PBF-ES Linear Technology LTM9010-14 - 14-Bit, 105Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial
LTM9011IY-14#PBF-ES Linear Technology LTM9011-14 - 14-Bit, 125Msps Low Power Octal ADCs; Package: BGA; Pins: 140; Temperature: Industrial

202 ball bga Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
1999 - BGA PACKAGE TOP MARK intel

Abstract: 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
Text: , Easy BGA Package Schematics: Silicon Daisy Chain Evaluation Units (E3 and F3 connected on the Ball , View - Ball Side Up daisy 2 Easy BGA Mechanical Specification 3.0 Easy BGA Package , Preliminary Mechanical and Shipping Media Information for Easy BGA Packages May 2000 Document , respective owners. Easy BGA Mechanical Specification Contents 1.0 Easy BGA Package Drawing and Dimensions . 1 2.0 Easy BGA Package Schematics: Silicon


Original
PDF 28F160F3 US048641 RD33708SW RD33716SW 12B-1013-G13 BGA PACKAGE TOP MARK intel 144 bga 12B-1013-G13 BGA PACKAGE TOP MARK 28F160F3 BGA package tray 64 tray bga 17 intel Easy BGA TOP MARK
2000 - 639X

Abstract: LGA 1150
Text: (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , Table 5. Carrier Tape Mechanical Data for BGA ( Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm , hole. Figure 4. Carrier Tape Outline for BGA ( Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm , 5. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA ) 8 x 9 mm Ko D BALL "A1" Po , LFBGA (Low Profile Fine Pitch BGA ) 7 x 7 mm Ko D T BALL "A1" Po REFERENCE E P2 F


Original
PDF 330mm 150mm 639X LGA 1150
1999 - INTEL 28F640

Abstract: BGA PACKAGE TOP MARK intel 28F160C18 vf bga INTEL 28F640 application 298161 intel BGA PACKAGE TOP MARK 28F016B3 28F008B3 BGA package tray 64
Text: . 3 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA ) Package Daisy Chain Schematics for GE28FSDCR46 . 4 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA ) Package Drawing and Dimensions for Daisy Chain , . 1 Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA ) Package Construction . 1 µBGA , Flash Memory Revised Section 2.4, Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA ) Package Drawing and , Construction provides excellent Reliability Very-Thin, Fine-Pitch, Ball Grid Array (VF BGA ) Package


Original
PDF 12E-0607-C13 28F320C3 12E-0710-C13 28F160F3 12E-0810-C13 28F320D18 12E-0713-C13 28F320W18 28F320W30 28F640W18 INTEL 28F640 BGA PACKAGE TOP MARK intel 28F160C18 vf bga INTEL 28F640 application 298161 intel BGA PACKAGE TOP MARK 28F016B3 28F008B3 BGA package tray 64
2000 - LGA 1150

Abstract: No abstract text available
Text: (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , components sizes. 4/15 CSP Tape & Reel Table 5. Carrier Tape Mechanical Data for BGA ( Ball Grid Array , measured as true position of pocket, not pocket hole. Figure 4. Carrier Tape Outline for BGA ( Ball Grid , Outline for LFBGA (Low Profile Fine Pitch BGA ) 8 x 9 mm Ko D BALL "A1" Po REFERENCE T E , LFBGA (Low Profile Fine Pitch BGA ) 7 x 7 mm Ko D T BALL "A1" Po REFERENCE E P2 F


Original
PDF 330mm LGA 1150
2000 - Not Available

Abstract: No abstract text available
Text: (P) Q.ty per Reel Table BGA 10 x 12 mm Ball Grid Array 24 mm 16 mm 1500 5 , . Carrier Tape Mechanical Data for BGA ( Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm mm inches , Outline for BGA ( Ball Grid Array) and LGA (Land Grid Array) 10 x 12 mm Ko D BALL "A1" REFERENCE , 5. Carrier Tape Outline for LFBGA (Low Profile Fine Pitch BGA ) 8 x 9 mm Ko D BALL "A1" Po , Profile Fine Pitch BGA ) 7 x 7 mm Ko D T BALL "A1" Po REFERENCE E P2 F Bo K1 W


Original
PDF 330mm
2000 - 202 ball bga

Abstract: No abstract text available
Text: excluding the 320ball BGA and 432- ball BGA , which specify a maximum allowable junction temperature of 140 , °C (140°C for the 320- ball BGA and 432- ball BGA ), refer to the following hints to reduce overall power , -pin MQFP 208-pin 240-pin 304-pin caBGA 49- ball 100- ball 144- ball 208- ball 208- ball * fpBGA 256- ball 256- ball * 388- ball 388- ball * 272- ball 272- ball * 320- ball BGA 388- ball 388- ball * 432- ball 492- ball 492- ball , 31 29 26 26 19 22.6 14 36 44 29 29 28 12 10 10 9.8 68 39 25 22 19.1 20.6 15.4 20.2 15.1 19 15 11.2 16


Original
PDF 320ball 432-ball G42-88: 44-pin 68-pin 84-pin 133-pin 20-pin 24-pin 28-pin 202 ball bga
2008 - FIN212AC

Abstract: dsi LCD driver JESD22-A114 FIN212ACMLX FIN212ACGFX 202 ball bga DSO20 mobile camera interface microcontroller ipc-SM-782 5M cmos camera
Text: 18 DIRI DP[9] 8 17 VDDS DP[10] 9 E DP[4] 1 42- Ball BGA , 3.5 x 4.5mm, .5mm pitch (Top , PWS0 S1 S0 42- Ball BGA , 3.5 x 4.5mm, .5mm pitch (Top View) VDDA 16 DP[12] S0 15 G , 330.0 1.5 13.0 20.2 178.0. 16.4 22.4 15.9 ~ 19.4 Figure 9. BGA Tape and Reel , www.fairchildsemi.com 14 Figure 11. 42- Ball , Ball Grid Array ( BGA ) Package Order Number Operating Temperature , 1.65 to 3.6V 14kV 32-Terminal MLP 42- Ball USS-BGA FIN212ACMLX FIN212ACGFX The FIN212AC


Original
PDF FIN212AC 12-Bit 12-Bit 40MHz 32-Terminal 42-Ball FIN212ACMLX FIN212ACGFX FIN212AC dsi LCD driver JESD22-A114 FIN212ACMLX FIN212ACGFX 202 ball bga DSO20 mobile camera interface microcontroller ipc-SM-782 5M cmos camera
2008 - DP1211

Abstract: 337 BGA footprint FIN212AC
Text: DP[12] 11 PLL1 12 DP[12] N/C PLL1 PLL0 S1 S0 42- Ball BGA , 3.5 x 4.5mm, .5mm , 11. 42- Ball , Ball Grid Array ( BGA ) Package Order Number FIN212ACGFX Operating Temperature Range , 1.65 to 3.6V 14kV 32-Terminal MLP 42- Ball USS-BGA FIN212ACMLX FIN212ACGFX Description The FIN212AC , ground. BGA : all GND pads. MLP: Pin 29 & GND PAD must be grounded. No connect. (Do not connect to GND or , for serial I/O. Power supply for core. All GND pins must be connected to ground. BGA : all GND pads


Original
PDF FIN212AC 12-Bit 40MHz 48MHz 32-Terminal 42-Ball FIN212ACMLX DP1211 337 BGA footprint
2008 - 577ns

Abstract: FIN212AC
Text: PLL0 S1 S0 42- Ball BGA , 3.5 x 4.5mm, .5mm pitch (Top View) 32-pin MLP, 5 x 5mm, .5mm pitch , VDDA N/C DIRI G DP[12] N/C PWS1 PWS0 S1 S0 42- Ball BGA , 3.5 x 4.5mm, .5mm , 11. 42- Ball , Ball Grid Array ( BGA ) Package Packing Method Tape & Reel Order Number FIN212ACGFX , 1.65 to 3.6V 14kV 32-Terminal MLP 42- Ball USS-BGA FIN212ACMLX FIN212ACGFX Description The FIN212AC , ground. BGA : all GND pads. MLP: Pin 29 & GND PAD must be grounded. No connect. (Do not connect to GND or


Original
PDF FIN212AC 12-Bit 40MHz 32-Terminal 42-Ball FIN212ACMLX FIN212ACGFX 577ns
1999 - rd33708

Abstract: Intel H4 socket BGA PACKAGE TOP MARK intel 28F3202C3 intel h2 socket 806801 JEDEC TRAY DIMENSIONS E6G3 28F3204C3 28F1604C3
Text: Media and Socket Ordering Information for Easy BGA Package. 8 Note: Please refer to , E F b G H 1 2 3 4 5 6 7 8 Top View - Ball Down 9 10 11 12 D Bottom View - Ball Up A A1 A2 Y 8068_01 NOTE: Specific ball population patterns may , Ball Standoff A1 0.30 0.35 0.40 0.012 0.014 0.016 Package Body Thickness A2 0.92 0.97 1.02 0.036 0.038 0.040 Ball (Lead) Width b 0.325 0.40 0.475


Original
PDF 28F1602C3 US048631 28F1604C3 28F3202C3 28F3204C3 US048681 rd33708 Intel H4 socket BGA PACKAGE TOP MARK intel 28F3202C3 intel h2 socket 806801 JEDEC TRAY DIMENSIONS E6G3 28F3204C3 28F1604C3
1999 - 234 N02

Abstract: No abstract text available
Text: ) for Fast Counters, State Machines, Address Decoders, etc. - PCB Efficient Ball Grid Array ( BGA , I/O 192 I/O 192 I/O 388 BGA - 288 I/O 288 I/O *1.0mm ball pitch Fine Pitch BGA 3 , multiplexed with TOE. 18 Specifications ispLSI 5384VA 208- Ball BGA Signal Locations Signal GOE0, GOE1 , connected to any active signals, VCC or GND. 208- Ball BGA I/O Locations (Sorted by I/O) I/O # 0* 1 2 3 4 , multiplexed with CLK3 and I/O 0 is multiplexed with TOE. 19 Specifications ispLSI 5384VA 208- Ball BGA


Original
PDF 5384VA 388-BGA 0212/5384va 5384VA-125LQ208 5384VA-125LB208 5384VA-125LB272 5384VA-125LB388 5384VA-100LQ208 5384VA-100LB208 5384VA-100LB272 234 N02
2009 - QFP Package 128 lead .5mm

Abstract: QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 A54SX72A-CQ256 BGA 256 PACKAGE thermal resistance A54SX72A-FG484
Text: socket base . 4. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation into socket is critical. 5. Place the compession plate (D), on top of the BGA package, orientation is not , 0.5mm Description: BGA to QFP package converter 484 position BGA surface mount GHz BGA socket , commercial practices (1) per Mil-STD- 202 , method 107, test condition A (2) per Mil-STD- 202 , method 208 , . Compression Screw Socket Top Assembly E F Socket Lid Compression plate D C BGA Package


Original
PDF 26X26 27X27mm PC-BGA/QFP-SX72A-Z-01 A54Sx72A-CQ256 A54SX72A-FG484 SI-SX72-ACQ256SFG484 QFP Package 128 lead .5mm QFP 128 lead .5mm BGA reflow guide SI-SX72-ACQ256SFG484 BGA 256 PACKAGE thermal resistance
2006 - FIN212AC

Abstract: 5M cmos camera MO-220 MO-195 FIN212ACMLX FIN212ACGFX FIN212ACBFX DP10 AN-5061 AN-5058
Text: Ground center pad, ground D4, E3 and NCs for 42- ball BGA . Ground B5, C2, C4 for 36- ball BGA . Notes , (Continued) Figure 12. 42- Ball , Ball Grid Array ( BGA ) Package Package drawings are provided as a , Multiple Frequency Ranges Physical Dimensions (Continued) Figure 13. 36- Ball , Ball Grid Array ( BGA , in a 5x5mm MLP package to attach directly to a flex circuit, or in two choices of BGA , where space , -220, 5mm Square Tape & Reel FIN212ACGFX -30 to 70°C 42- Ball Ultra Small-Scale Ball Grid Array


Original
PDF FIN212AC 12-Bit FIN212AC 5M cmos camera MO-220 MO-195 FIN212ACMLX FIN212ACGFX FIN212ACBFX DP10 AN-5061 AN-5058
1999 - 5000VA

Abstract: b20 p03 A09 N03 5512VA 5384VA 5256VA 234 N02 5384VA-70L T14 N03 283 g23
Text: 16 512 - 144 I/O 192 I/O 288 I/O *1.0mm ball pitch Fine Pitch BGA 3 , 5384VA 208- Ball BGA Signal Locations Signal Ball GOE0, GOE1 P9, P10 TOE / I/O0 K1 , E15, C14 1. NCs are not to be connected to any active signals, VCC or GND. 208- Ball BGA I/O , ispLSI 5384VA 208- Ball BGA I/O Locations (Sorted by Ball ) I/O # Ball I/O # Ball I/O # , Specifications ispLSI 5384VA 272- Ball BGA Signal Locations Signal GOE0, GOE1 Ball V11, U11 TOE / I/O 0


Original
PDF 5384VA 5384VA-125LB208 208-Ball 5384VA-125LB272 272-Ball 5384VA-125LB388 388-Ball 5384VA-100LQ208 208-Pin 5384VA-100LB208 5000VA b20 p03 A09 N03 5512VA 5384VA 5256VA 234 N02 5384VA-70L T14 N03 283 g23
1999 - A09 N03

Abstract: 5000VA 5256VA 5384VA 5512VA
Text: 144 I/O 192 I/O 288 I/O *1.0mm ball pitch Fine Pitch BGA 3 Specifications ispLSI , 5384VA 208- Ball BGA Signal Locations Signal Ball GOE0, GOE1 P9, P10 TOE / I/O0 K1 , E15, C14 1. NCs are not to be connected to any active signals, VCC or GND. 208- Ball BGA I/O , ispLSI 5384VA 208- Ball BGA I/O Locations (Sorted by Ball ) I/O # Ball I/O # Ball I/O # , Specifications ispLSI 5384VA 272- Ball BGA Signal Locations Signal GOE0, GOE1 Ball V11, U11 TOE / I/O 0


Original
PDF 5384VA 5384VA-125LB208 208-Ball 5384VA-125LB272 272-Ball 5384VA-125LB388 388-Ball 5384VA-100LQ208 208-Pin 5384VA-100LB208 A09 N03 5000VA 5256VA 5384VA 5512VA
2009 - SG-BGA-6064

Abstract: 6064 aluminium data sheet
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB , required Compression plate distributes forces evenly 22.225mm Ball guide prevents over compression of , : Shoulder screw, 18-8 SS, 0-80 fine thread. 10 8 Ball Guide: Kapton polyimide. 8 2 , base nut: 18-8 Stainless steel, 0-80 fine thread. 7 6 10 5 11 Customer's BGA IC , : BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark


Original
PDF 225mm 16x16 SG-BGA-6064 6064 aluminium data sheet
2009 - SG-BGA-6143

Abstract: 16X16
Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB , required Compression plate distributes forces evenly 22.225mm Ball guide prevents over compression , a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Ball Guide: Kapton polyimide , 's BGA IC SG-BGA-6143 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 , : BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark


Original
PDF 225mm Elasto1994. 16x16 SG-BGA-6143 16X16
2002 - Not Available

Abstract: No abstract text available
Text: +85°C –40°C to +100°C 456- ball Fine Pitch BGA XC2S300E C = Commercial 256- ball Fine Pitch BGA XC2S200E Temperature Range (TJ ) 676- ball Fine Pitch BGA XC2S400E XC2S600E , 37,000 - 100,000 20 x 30 600 202 86 38,400 40K XC2S150E 3,888 52,000 - 150 , 256 456 676 Type Device 144 Plastic TQFP Plastic PQFP Fine Pitch BGA Fine Pitch BGA Fine Pitch BGA Code TQ144 PQ208 FT256 FG456 FG676 XC2S50E -6 C


Original
PDF DS077-1 28rking. DS077-1, DS077-2, DS077-3, DS077-4, XC2S400E XC2S600E. XC2S150E XC2S50E
2006 - Not Available

Abstract: No abstract text available
Text: , ground D4, E3 and NCs for 42- ball BGA . Ground B5, C2, C4 for 36- ball BGA . (2) CKSI+, CKSICKSO , Frequency Ranges Physical Dimensions (Continued) Figure 12. 42- Ball , Ball Grid Array ( BGA ) Package , , Ball Grid Array ( BGA ) Package (Preliminary) Package drawings are provided as a service to customers , , or in two choices of BGA , where space constraints are a concern. Adjustable Parallel Edge , °C Package Description 32-Terminal Molded Leadless Package (MLP), Quad, JEDEC MO-220, 5mm Square 42- Ball


Original
PDF FIN212AC 12-Bit FIN212AC
2003 - XC2S400E

Abstract: XC2S200E XC2S600-E XC2s600e XC2S400-E XC2S100E XC2S50E XC2S300E XC2S150E bga pin 676
Text: +100°C 456- ball Fine Pitch BGA XC2S300E I = Industrial 0°C to +85°C 256- ball Fine Pitch BGA XC2S200E C = Commercial 676- ball Fine Pitch BGA XC2S400E XC2S600E Device Part , 24,576 32K XC2S100E 2,700 37,000 - 100,000 20 x 30 600 202 86 38,400 , 208 256 456 676 Type Plastic TQFP Plastic PQFP Fine Pitch BGA Fine Pitch BGA Fine Pitch BGA Device Code TQ144 PQ208 FT256 FG456 FG676 XC2S50E -6 C, I


Original
PDF DS077-1 DS077-2, DS077-3, DS077-4, XC2S400E XC2S600E. XC2S150E XC2S50E XC2S200E XC2S600-E XC2s600e XC2S400-E XC2S100E XC2S50E XC2S300E bga pin 676
2009 - BGA reflow guide

Abstract: QFP Package 128 lead .5mm QFP 128 lead .5mm A54SX32A-FG484 SI-SX32-ACQ256SFG484 A54SX32A-CQ256 BGA 256 PACKAGE thermal resistance
Text: onto the socket base . 4. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation into socket is critical. 5. Place the compession plate (D), on top of the BGA package , Packaging (3) Best commercial practices (1) per Mil-STD- 202 , method 107, test condition A (2) per Mil-STD- 202 , method 208 (soldering heat per Method 210, condition B) (3) Packaging contains Ironwood , BGA Package Shoulder screw Socket lid screws, DO NOT ADJUST B Socket / Elastomer assembly


Original
PDF PC-BGA/QFP-SX32A-Z-01 A54Sx32A-CQ256 A54SX32A-FG484 SI-SX32-ACQ256SFG484 BGA reflow guide QFP Package 128 lead .5mm QFP 128 lead .5mm SI-SX32-ACQ256SFG484 BGA 256 PACKAGE thermal resistance
BGA-56 DATASHEET

Abstract: mini ball corner PQFP die size cpga dimensions BGA-64 pad atmel 0945 PQFP 132 PACKAGE DIMENSION
Text: 4-27 ® pkg-3.7-04/99 Low Profile BGA Dimensions Ball Count Ball Pitch Row Array Body , Mini Array BGA Dimensions Ball Count Ball Pitch Row Array Body Size Package Height 40 , Rows 11mm x 11mm 1.4mm 4-29 ® pkg-3.7-04/99 Mini Array BGA 40/.5 Top View A1 BALL , 4-31 ® pkg-3.7-04/99 Mini Array BGA 56/.5 Side View Top View 1.24 ±0.10 A1 BALL PAD , 4-32 Packaging 0.75 REF 0.50 pkg-3.7-04/99 Mini Array BGA 64/.8 Top View A1 BALL PAD


Original
PDF
2000 - 5000VA

Abstract: 5256VA 5384VA 5512VA
Text: Specifications ispLSI 5384VA 272- Ball BGA Signal Locations Signal GOE0, GOE1 Ball V11, U11 TOE / I/O 0 , ispLSI 5384VA 272- Ball BGA I/O Locations (Sorted by I/O) I/O # Ball I/O # Ball I/O # , ispLSI 5384VA 272- Ball BGA I/O Locations (Sorted by Ball ) I/O # 164 160 158 154 151 149 146 142 , 5384VA 388- Ball BGA Signal Locations Signal GOE0, GOE1 Ball AF14, AD13 TOE / I/O0 T1 GSET , Specifications ispLSI 5384VA 388- Ball BGA I/O Locations (Sorted by I/O) I/O # Ball I/O # Ball I/O #


Original
PDF 5384VA 5384VA-125LB208 208-Ball 5384VA-125LB272 272-Ball 5384VA-125LB388 388-Ball 5384VA-100LQ208 208-Pin 5384VA-100LB208 5000VA 5256VA 5384VA 5512VA
2009 - Not Available

Abstract: No abstract text available
Text: Ultra-High-Precision Z-Foil Ball Grid Array ( BGA ) Surface-Mount Voltage Divider features · Temperature coefficient of , Electrostatic discharge (ESD) up to 25 000 V The VFB1012D ball grid array ( BGA ) surface divider Foil range , . The Z-foil The VFB1012D ball grid array ( BGA ) surface mount divider element's sensitivity ambient temperature The VFB1012D ball grid array ( BGA ) surface divider technology provides a to significant reduction , applications, please The VFB1012D ball grid and array ( BGA ) surface mount please divider technical requirements


Original
PDF VFB1012D 08-Jan-09 VMN-PT0161-0904 08-Jan-09
1999 - b20 p03

Abstract: B20 n03
Text: ) for Fast Counters, State Machines, Address Decoders, etc. - PCB Efficient Ball Grid Array ( BGA , 288 I/O *1.0mm ball pitch Fine Pitch BGA 3 Specifications ispLSI 5512VA Figure 2. ispLSI , multiplexed with TOE. 18 Specifications ispLSI 5512VA 388- Ball BGA Signal Locations Signal GOE0, GOE1 , . 20 Specifications ispLSI 5512VA 388- Ball BGA I/O Locations (Sorted by Ball ) I/O # 246 242 238 , ispLSI 5512VA Signal Locations (272- Ball BGA ) Signal GOE0, GOE1 TOE / I/O 0 GSET/GRST TCK TDI TDO TMS


Original
PDF 5512VA 388-BGA 0212/5512va ispLSI5512VA-110LB272 5512VA-110LB388 5512VA-110LQ208 5512VA-100LB272 5512VA-100LB388 5512VA-100LQ208 5512VA-70LB272 b20 p03 B20 n03
Supplyframe Tracking Pixel