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Part Manufacturer Description Datasheet Download Buy Part
LTC3854EMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IDDB#TRMPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: DFN; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#TRPBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C
LTC3854IMSE#PBF Linear Technology LTC3854 - Small Footprint, Wide VIN Range Synchronous Step-Down DC/DC Controller; Package: MSOP; Pins: 12; Temperature Range: -40°C to 85°C

2012 footprint dimension Datasheets Context Search

Catalog Datasheet MFG & Type PDF Document Tags
2012 - 2220 footprint

Abstract: C0603JR 1808 FOOTPRINT YNM0015
Text: November 12, 2012 V.17 Product specification 2 2 Surface-Mount Ceramic Multilayer Capacitors , OUTLINES Table 3 Packing quantities for component size; see note 1 and Fig.1 For dimension see Table 3 , L1 L3 MBB211 0805 0805 Fig. 2 Surface mounted multilayer ceramic capacitor dimension NOTE 1. Refer to the selection charts in product data for specific values www.yageo.com Nov. 12, 2012 , 0612 array www.yageo.com Nov. 12, 2012 V.17 Product specification 4 4 Surface-Mount


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PDF C0806" 2220 footprint C0603JR 1808 FOOTPRINT YNM0015
2012 - AN10896

Abstract: No abstract text available
Text: AN10896 Mounting and Soldering of RF transistors Rev. 2 - 13 Nov 2012 Application note , . 2012 . All rights reserved. Application note Rev. 2 - 13 Nov 2012 2 of 49 NXP , subject to legal disclaimers. © NXP B.V. 2012 . All rights reserved. Application note Rev. 2 - 13 Nov 2012 3 of 49 NXP Semiconductors AN10896 Mounting and Soldering of RF transistors 2 , , the copper dimension is 0.15 mm larger than the solder mask dimension . These values may vary depending


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PDF AN10896 AN10896
2007 - mpxv7025dp

Abstract: GA18 MPVZ7025G6U
Text: Pressure Freescale Semiconductor Data Sheet: Technical Data MPXV7025 Rev 6, 10/ 2012 Integrated , MPXV7025DP MPVZ7025DP CASE 1351-01 © 2007-2009, 2012 Freescale Semiconductor, Inc. All rights reserved , FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint , the packages will self


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PDF MPXV7025 mpxv7025dp GA18 MPVZ7025G6U
2012 - Not Available

Abstract: No abstract text available
Text: November 2012 Application note Document information Info Content Keywords Over-Molded Plastic (OMP) packages, heat sink, footprint , surface mount, reflow soldering, component handling , . Rev. 1 — 6 November 2012 © NXP B.V. 2012 . All rights reserved. 2 of 40 AN11183 NXP , exposed metal underneath the plastic over molded devices (or Cu base). " Footprint or solder land" is , to legal disclaimers. Rev. 1 — 6 November 2012 © NXP B.V. 2012 . All rights reserved. 3 of


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PDF AN11183
2008 - S71VS256RD0AHK3M

Abstract: No abstract text available
Text: D1 BALL COUNT Ib 0.25 0.30 MATRIX FOOTPRINT 0.35 6 DIMENSION "b" IS MEASURED , FOOTPRINT 14 MATRIX FOOTPRINT 6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER IN A , S71VS_XS-R_00 Revision 17 Issue Date October 2, 2012 D at a S hee t Notice On Data Sheet , /XS-R Memory Subsystem Solutions S71VS_XS-R_00_17 October 2, 2012 S71VS/XS-R Memory Subsystem , _00 Revision 17 Issue Date October 2, 2012 D at a S hee t For detailed specifications, please refer


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PDF S71VS/XS-R 16-bit) S71VS256RD0AHK3M
2007 - Not Available

Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXA6115A Rev 7.2, 10/ 2012 , MPXA6115A Sensors Freescale Semiconductor, Inc. 5 MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for , mm Figure 5. SOP Footprint (Case 482) 0.050 1.27 TYP 0.150 3.81 0.387 9.83 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 6. SSOP Footprint (Case 1317 and 1317A) MPXA6115A 6 Sensors


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PDF MPXA6115A MPXxx6115A
Not Available

Abstract: No abstract text available
Text: /11/2 mend Dimension By 0.5 to 1.0 Jaosn 2012 /3/1 ALL A 4. Mechanical Specifications Initial Design Eddie 2012 /3/9 4.1 Dimensions and Drawing Bottom Side B Top Bottom Side PCB Footprint NOTE: NOTE: 1. Solder mask. 1.Solder mask 2. Area to to be soldered 2.Area be soldered. 3.Clearance area 3. Clearance area. 4.Diemension of Ohm CPW dependent 4. Dimension , .15 Ceramic Clear 1 Top B Side 4.2 Antenna footprint PCB Footprint NOTE: 1


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PDF 1575MHz SPE-11-8-137/C/SS 45x45mm 023MHz SP03AB15756-0030 SMA1575C
2005 - MPXV7007

Abstract: No abstract text available
Text: Pressure Freescale Semiconductor Data Sheet: Technical Data MPXV7007 Rev 3, 10/ 2012 Integrated , circuitry or ground. Pin 1 is noted by the notch in the lead. © 2005, 2009, 2011, 2012 Freescale , Port Attached Side with Port Attached Side with Part Marking MINIMUM RECOMMENDED FOOTPRINT FOR , footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint , the packages will self align when


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PDF MPXV7007
2012 - IDT8N3PF10VA-159

Abstract: IDT8N3PF10VA-159I
Text: IDT8N3PF10VA-159I is a programmable LVPECL synthesizer that is "forward" footprint compatible with standard 5mm , of high clock frequency and low phase noise performance. Forward footprint compatibility means that a , fully compatible with a canned oscillator footprint - the canned oscillator will drop onto the 10-VFQFN footprint for second sourcing purposes. This capability provides designers with programability and lead time , . Features · · · · · · · · · Fourth Generation FemtoClock® NG technology Footprint compatible with 5mm x


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PDF IDT8N3PF10VA-159I IDT8N3PF10VA-159I 10-VFQFN IDT8N3PF10VA-159
2012 - Not Available

Abstract: No abstract text available
Text: Footprint Case Dimensions Dimension A B C D E H J K P Min 6.80 4.80 0.47 2.41 0.87 4.87 2.87 1.14 mm Nom , = 50 ohms SMP-03 7 x 5 mm Nominal Footprint RFM/SF2304B/YYWW Terminals 10 10, 1 5 All others , : info@rfm.com © 2012 by RF Monolithics, Inc. Filter Response Plots 20 Nov 2012 14:13:01 CH1 S21 LOG 10 , CENTER 175 . 000 000 MHz SPAN 50 . 000 000 MHz 20 Nov 2012 14:17:11 CH1 S21 LOG , © 2012 by RF Monolithics, Inc. Page 2 of 5 SF2304B - 12/19/12 20 Nov 2012 14:16:09 CH1 S21 LOG


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PDF SF2304B 2002/95/EC SMP-03 SF2304B
2012 - Not Available

Abstract: No abstract text available
Text: Footprint Case and PCB Footprint Dimensions Dimension A B C D E F G H I J K L M N O K L , — SM3030-6 3.0 x 3.0 mm Nominal Footprint Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 , © 2012 by RF Monolithics, Inc. Page 1 of 5 SF2316E - 1/24/13 Frequency Characteristics: S21 , 600 16 10 162 0 1630 1640 MHz www.RFM.com E-mail: info@rfm.com © 2012 by RF , 0 260 0 MHz www.RFM.com E-mail: info@rfm.com © 2012 by RF Monolithics, Inc. Page 3 of


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PDF SF2316E 2002/95/EC cycles/10 SM3030-6 SF2316E
2012 - Not Available

Abstract: No abstract text available
Text: Footprint Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator A66, YWWS Standard Reel , registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: info@rfm.com © 2012 by RF Monolithics , © 2012 by RF Monolithics, Inc. Page 2 of 5 SF2098E - 12/20/12 Filter SWR Plots www.RFM.com E-mail: info@rfm.com © 2012 by RF Monolithics, Inc. Page 3 of 5 SF2098E - 12/20/12 SM3030-6 Case 6-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint


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PDF 2002/95/EC SF2098E cycles/10 SM3030-6 SF2098E
2007 - Not Available

Abstract: No abstract text available
Text: Freescale Semiconductor Document Number: MPXA6115A Rev 7.1, 05/ 2012 Data Sheet: Technical , . 5 MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the , 16.76 0.060 TYP 8X 1.52 0.300 7.62 inch mm 0.100 TYP 8X 2.54 Figure 5. SOP Footprint , inch mm Figure 6. SSOP Footprint (Case 1317 and 1317A) MPXA6115A 6 Sensors Freescale


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PDF MPXA6115A MPXxx6115A
Not Available

Abstract: No abstract text available
Text: footprint , these LEDs are ideal for smaller equipment and miniature application. Dimension : Units: mm , . 8 Solder Profile & Footprint , - Solder Profile & Footprint -Recommended tin solder specifications: melting temperature in the , - Packing Reel Dimension : Unit: mm Tape Dimension : Unit: mm Arrangement of Tape , intensity Revision # V1.0 V1.1 V1.2 V1.3 V1.4 Revision Date 01/11/ 2012 01/12/ 2012 06/18/ 2012


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PDF QBLP617 QBLP617 QBL617
2012 - Not Available

Abstract: No abstract text available
Text: Surface-mount Case 5 x 7 mm Nominal Footprint Case Dimensions Dimension A B C D E H J K P Min 6.80 4.80 0.47 , -03 7 x 5 mm Nominal Footprint RFM/SF2304B/YYWW Terminals 10 5 All others Electrical Connection , : info@rfm.com © 2012 by RF Monolithics, Inc. Page 1 of 5 SF2304B - 11/28/12 Filter Response Plots 20 Nov 2012 14:13:01 CH1 S21 LOG 10 dB/ REF -.621 dB 1 : 0 . 0000 dB 0 . 000 000 MHz SF2304B_new -1 , 20 Nov 2012 14:17:11 CH1 S21 LOG 10 dB/ REF 20 dB 1 : 0 . 0000 dB 0 . 000 000 MHz SF2304B_new 3


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PDF SF2304B 2002/95/EC SMP-03 SF2304B
2007 - MPXAZ6115A6U

Abstract: No abstract text available
Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXA6115A Rev 7.1, 05/ 2012 , , Inc. 5 MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the , 0.300 7.62 0.100 TYP 8X 2.54 inch mm Figure 5. SOP Footprint (Case 482) 0.050 1.27 TYP 0.150 3.81 0.387 9.83 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 6. SSOP Footprint (Case


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PDF MPXA6115A MPXxx6115A MPXAZ6115A6U
2005 - MPXV4115V series

Abstract: 3-17S
Text: Pressure Freescale Semiconductor Data Sheet: Technical Data MPXV4115V Rev 4, 10/ 2012 , , 2010, 2012 Freescale Semiconductor, Inc. All rights reserved. Pressure Operating Characteristics , (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the , correct footprint , the packages will self align when subjected to a solder reflow process. It is always


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PDF MPXV4115V MPXV4115V series 3-17S
2012 - Not Available

Abstract: No abstract text available
Text: handsets and accessories Video equipment TM: Transil is a trademark of STMicroelectronics June 2012 , dimension definitions L1 L2 b1 PIN # 1 ID b2 e A A1 E D Table 3. SOD882 dimension values Dimensions Ref. Min. A A1 b1 b2 D E e L1 L2 0.40 0.00 0.45 0.45 0.55 0.95 0.60 0.20 , footprint in mm (inches) Figure 18. SOD882 marking 0.55 (0.022) 0.55 (0.022) 0.50 0.020 0.40 (0.016 , Figure 20. SOD882T dimension definitions L1 L2 ESDALC5-1BM2, ESDALC5-1BT2 b1 PIN # 1 ID b2


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PDF OD882 OD882T
2012 - SOD882T

Abstract: No abstract text available
Text: STMicroelectronics June 2012 This is information on a product in full production. Doc ID 16937 Rev 2 1/14 , dimension definitions L1 L2 b1 PIN # 1 ID b2 e A A1 E D Table 3. SOD882 dimension values Dimensions Ref. Min. A A1 b1 b2 D E e L1 L2 0.40 0.00 0.45 0.45 0.55 0.95 0.60 0.20 , footprint in mm (inches) Figure 18. SOD882 marking 0.55 0.022 0.55 0.022 0.020 0.50 Pin1 , Package information Figure 20. SOD882T dimension definitions L1 L2 ESDAVLC8-1BM2, ESDAVLC8-1BT2 b1


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PDF OD882 OD882T SOD882T
2012 - Not Available

Abstract: No abstract text available
Text: trademark of STMicroelectronics June 2012 This is information on a product in full production. Doc ID , . Figure 16. SOD882 dimension definitions L1 L2 b1 b2 PIN # 1 ID e A A1 E D Table 3. SOD882 dimension values Dimensions Ref. Millimeters Inches Min. Max. Min , footprint in mm (inches) 0.55 0.022 0.020 0.55 0.022 Figure 18. SOD882 marking 0.50 I , Rev 2 7/14 Package information ESDAVLC8-1BM2, ESDAVLC8-1BT2 Figure 20. SOD882T dimension


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PDF OD882T OD882
2012 - Not Available

Abstract: No abstract text available
Text: © 2012 by RF Monolithics, Inc. Page 2 of 4 SF2315E-1 - 3/12/13 SM3030-6 Case 6-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint Case and PCB Footprint Dimensions Dimension , Footprint Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator Standard Reel Quantity A82 , registered trademarks of RF Monolithics, Inc. www.RFM.com E-mail: info@rfm.com © 2012 by RF Monolithics , Solder Pad Plating 2.0 to 3.0 µm Nickel Body PCB Footprint Top View 0.3 to 1.0 µm Gold


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PDF SF2315E-1 2002/95/EC cycles/10 SM3030-6 SF2315E-1
2012 - NLU2G16AMUTCG

Abstract: No abstract text available
Text: non-inverting buffer in ultra-small footprint . The NLU2G16 input and output structures provide protection when , this data sheet. FUNCTION TABLE A L H Y L H © Semiconductor Components Industries, LLC, 2012 July, 2012 - Rev. 3 1 Publication Order Number: NLU2G16/D NLU2G16 MAXIMUM RATINGS Symbol , DETAIL A NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION : MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE


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PDF NLU2G16 517AA 613AD NLU2G16/D NLU2G16AMUTCG
2012 - NLU1G32AMUTCG

Abstract: No abstract text available
Text: gate in ultra-small footprint . The NLU1G32 input and output structures provide protection when voltages , B L H L H Output Y L H H H © Semiconductor Components Industries, LLC, 2012 July, 2012 - Rev , . DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION : MILLIMETERS. 3. DIMENSION b , C SIDE VIEW A1 5X 1 3 SEATING PLANE MOUNTING FOOTPRINT * 0.42 6X C L 0.22 6X , . DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION : MILLIMETERS. 3. DIMENSION b


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PDF NLU1G32 517AA 613AD 613AE NLU1G32/D NLU1G32AMUTCG
2012 - Not Available

Abstract: No abstract text available
Text: gate in ultra-small footprint . The NLU1G32 input and output structures provide protection when voltages , © Semiconductor Components Industries, LLC, 2012 November, 2012 - Rev. 4 1 Publication Order Number , . DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION : MILLIMETERS. 3. DIMENSION b , C SIDE VIEW A1 5X 1 3 SEATING PLANE MOUNTING FOOTPRINT * 0.42 6X C L 0.22 6X , . DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION : MILLIMETERS. 3. DIMENSION b


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PDF NLU1G32 517AA 613AD 613AE NLU1G32/D
2012 - UDFN6

Abstract: No abstract text available
Text: ultra−small footprint . The NLU1G04 input and output structures provide protection when voltages up to 7.0 V , H L © Semiconductor Components Industries, LLC, 2012 July, 2012 − Rev. 2 1 , .5M, 1994. 2. CONTROLLING DIMENSION : MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS , 0.00 0.15 0.40 0.50 MOUNTING FOOTPRINT * 6X C A1 1 A3 SEATING PLANE SIDE VIEW , DIMENSION : MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30


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PDF NLU1G04 NLU1G04 613AE 613AF NLU1G04/D UDFN6
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