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TPN12008QM
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Toshiba Electronic Devices & Storage Corporation
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MOSFET, N-ch, 80 V, 26 A, 0.0123 Ohm@10V, TSON Advance |
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20083EB0BD
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Amphenol Communications Solutions
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Elite Backplane connectors, DO 8pair, 12position, NiS |
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10077239-116LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail |
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10077239-140LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header ,Press Fit ,Double row , 40 Positions ,2.54mm (0.100in) Pitch. |
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10077259-001CLF
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Amphenol Communications Solutions
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SAS 3.0 Connectors, Storage & Server System, Receptacle, Vertical, Surface Mount, 29 Positions. |
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10077239-214LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Header, Press Fit, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 8.08 mm (0.318 in.) Mating, 4.82 mm (0.19 in.) Tail |
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